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SN74AHC1G125DBVT

Texas Instruments

SN74AHC1G125DBVT by Texas Instruments

SN74AHC1G125DBVT by Texas Instruments is a 3-STATE bus driver with 14ns propagation delay, suitable for automotive applications. It operates at a nominal voltage of 3.3V and has a load capacitance of 50pF. This CMOS technology device features dual terminal position and GULL WING form factor in a small outline package style.

Median Price

$0.392

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 29 parts In-Stock

1+ parts

$0.369

100+ parts

$0.357

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-

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29

$0.369

$0.357

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Chip1Stop

Japan . 29 parts In-Stock

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$0.603

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$0.381

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-

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29

$0.603

$0.381

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DigiKey

USA . 32,481 parts In-Stock

1+ parts

$0.850

100+ parts

$0.484

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$0.423

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$0.387

32,481

$0.850

$0.484

$0.423

$0.387

Mouser Electronics

USA . 30,077 parts In-Stock

1+ parts

-

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$0.392

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$0.351

30,077

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$0.392

$0.351

Verical

USA . 29 parts In-Stock

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$0.357

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29

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$0.357

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Digiode

USA . 4,060 parts In-Stock

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$0.351

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$0.351

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Nova Conductors

Japan . 300 parts In-Stock

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$0.544

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300

$0.544

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Chip Stock

USA . 153,500 parts In-Stock

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153,500

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Vyrian

USA . 13,445 parts In-Stock

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QIE Inc.

USA . 2,267 parts In-Stock

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Prism Electronics

USA . 296 parts In-Stock

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PC Components Company LLC

USA . 200 parts In-Stock

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Bristol Electronics

USA . 200 parts In-Stock

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200

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Semi Source

USA . 193 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 15 parts In-Stock

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Holdelec - ElecDif-Pro

France . 15 parts In-Stock

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Martec Srl

Italy . 4 parts In-Stock

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Semicontronic

India . 13,758 parts In-Stock

1+ parts

$0.303

100+ parts

$0.295

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$0.294

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13,758

$0.303

$0.295

$0.294

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Ampacity Inc.

Singapore . 13,638 parts In-Stock

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$0.303

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$0.303

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Corphita

USA . 2,201 parts In-Stock

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$0.332

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$0.332

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Continental Prestige Electronics

USA . 3,582 parts In-Stock

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$0.544

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$0.533

3,582

$0.544

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$0.533

Argo Parts USA

USA . 809 parts In-Stock

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$0.544

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$0.527

809

$0.544

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$0.527

Netroflash

USA . 100 parts In-Stock

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$0.544

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Microchip USA

USA . 5,042 parts In-Stock

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$3.886

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$3.886

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Andel Nordic

Denmark . 2,980 parts In-Stock

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$7.888

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$7.572

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$7.572

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$7.888

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$7.572

Corohmni

South Africa . 51 parts In-Stock

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$10.543

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Parana Technologies

USA . 978 parts In-Stock

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$30.172

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$2,801.918

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$27.155

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978

$30.172

$2,801.918

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$30.735

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$29.198

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$29.198

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DigiPath Technology Company

USA . 7 parts In-Stock

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$33.223

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ChromeModa Solutions

Germany . 6,273 parts In-Stock

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$33.901

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$27.799

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IDEA Electronic Components Group

UK . 1,991 parts In-Stock

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$33.901

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$32.206

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$30.511

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A-Z Elektronik GmbH

Germany . 6,843 parts In-Stock

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Perfect Parts

USA . 5,349 parts In-Stock

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Overview

Discover the Texas Instruments SN74AHC1G125DBVT, a top-of-the-line Bus Driver & Transceiver designed to deliver high-performance results in various applications. With a reputable manufacturer like Texas Instruments behind it, you can trust in the quality and reliability of this product. From its compact design to its 3-STATE output characteristics, this device offers unmatched value and benefits to customers looking for seamless data transmission. Upgrade your projects with the SN74AHC1G125DBVT and experience efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability in various operating conditions.

Propagation Delay At Nominal Supply: 14 ns

Low propagation delay results in faster data transmission and improved performance.

Surface Mount: YES

Easy installation and space-saving design make it suitable for compact applications.

Package Shape: RECTANGULAR

Provides easy integration into existing circuit layouts for seamless connectivity.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard voltage levels for convenient power supply requirements.

Load Capacitance (CL): 50 pF

Ideal for driving capacitive loads without compromising signal integrity.

Power Supplies (V): 2/5.5

Wide range of power supply voltages offers flexibility in different operating environments.

No. of Terminals: 5

Simplifies connection to external components and reduces installation complexity.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact design with low profile is suited for space-constrained applications.

Maximum I (ol): 8 Amp

High output current capability allows for driving heavy loads without overheating.

Propagation Delay (tpd): 13 ns

Fast propagation delay ensures quick response time in data transmission.

Maximum Operating Temperature: 125 °C

Wide temperature range makes it suitable for harsh operating conditions.

Output Characteristics: 3-STATE

Enables multiple device connections and provides flexibility in controlling output signals.

Minimum Operating Temperature: -40 °C

Operates reliably in extreme cold temperatures without performance degradation.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides corrosion resistance for long-term reliability in various environments.

Terminal Position: DUAL

Allows for easy connection to external components in a compact form factor.

No. of Ports: 2

Enables versatile connectivity options for different configurations and applications.

Maximum Seated Height: 1.45 mm

Low profile design is suitable for slim and compact device designs.

Width: 1.6 mm

Compact width enables easy integration into crowded circuit layouts.

Output Polarity: TRUE

Ensures accurate signal transmission without any distortion or phase inversion.

Minimum Supply Voltage (Vsup): 2 V

Low minimum voltage requirement allows for operation in low power scenarios.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance for durable and reliable soldering during manufacturing.

Length: 2.9 mm

Compact length makes it suitable for space-constrained applications.

Temperature Grade: AUTOMOTIVE

Designed to withstand temperature fluctuations in automotive applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed performance.

Terminal Form: GULL WING

Gull wing terminals provide secure soldering connections for reliable operation.

Packing Method: TR

Tape and reel packaging ensures easy handling and storage in production environments.

Terminal Pitch: 0.95 mm

Fine terminal pitch allows for compact design and efficient use of PCB space.

Count Direction: UNIDIRECTIONAL

Unidirectional communication ensures data integrity and prevents signal interference.

Control Type: ENABLE LOW

Enables easy control of output signals with a simple enable low mechanism.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum voltage tolerance for reliable operation in various power supply scenarios.

Maximum Power Supply Current (ICC): 0.01 mA

Low power supply current consumption for energy-efficient operation.

Technical Specifications

Bus Driver & Transceivers SN74AHC1G125DBVT attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74AHC1G125DBVT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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