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SN74LVC4245APWTG4

Texas Instruments

SN74LVC4245APWTG4 by Texas Instruments

SN74LVC4245APWTG4 by Texas Instruments is a bus driver & transceiver with 8 bits of translation b/w 3V and 5V. It has a propagation delay of 6.7 ns and operates at a nominal voltage of 5V. This IC is commonly used in industrial applications due to its small size, low power consumption, and bidirectional control.

Median Price

$3.050

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 246 parts In-Stock

1+ parts

$3.050

100+ parts

$1.640

1k+ parts

$0.889

10k+ parts

$0.886

246

$3.050

$1.640

$0.889

$0.886

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.970

100+ parts

-

1k+ parts

-

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100

$0.970

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Digiode

USA . 3,006 parts In-Stock

1+ parts

$1.796

100+ parts

-

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3,006

$1.796

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Chip Stock

USA . 202,620 parts In-Stock

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-

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202,620

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Vyrian

USA . 6,897 parts In-Stock

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-

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6,897

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,290 parts In-Stock

1+ parts

$0.970

100+ parts

-

1k+ parts

-

10k+ parts

$0.951

2,290

$0.970

-

-

$0.951

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.970

100+ parts

$0.951

1k+ parts

-

10k+ parts

-

1,000

$0.970

$0.951

-

-

Argo Parts USA

USA . 24 parts In-Stock

1+ parts

$0.970

100+ parts

-

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-

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-

24

$0.970

-

-

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Corphita

USA . 2,725 parts In-Stock

1+ parts

$1.701

100+ parts

-

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2,725

$1.701

-

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Ampacity Inc.

Singapore . 247 parts In-Stock

1+ parts

$2.330

100+ parts

-

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-

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247

$2.330

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Semicontronic

India . 97 parts In-Stock

1+ parts

$5.070

100+ parts

$4.943

1k+ parts

$4.918

10k+ parts

-

97

$5.070

$4.943

$4.918

-

Andel Nordic

Denmark . 1,609 parts In-Stock

1+ parts

$5.907

100+ parts

-

1k+ parts

$5.671

10k+ parts

$5.671

1,609

$5.907

-

$5.671

$5.671

Corohmni

South Africa . 352 parts In-Stock

1+ parts

$9.552

100+ parts

-

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352

$9.552

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Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$13.240

100+ parts

$12.578

1k+ parts

$12.578

10k+ parts

-

270

$13.240

$12.578

$12.578

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AZTECH Wire

Italy . 766 parts In-Stock

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$16.304

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766

$16.304

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Parana Technologies

USA . 2,018 parts In-Stock

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$29.321

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$58.017

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2,018

$29.321

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$58.017

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DigiPath Technology Company

USA . 24 parts In-Stock

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$32.286

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24

$32.286

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ChromeModa Solutions

Germany . 2,390 parts In-Stock

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$32.945

100+ parts

$27.015

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-

10k+ parts

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2,390

$32.945

$27.015

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IDEA Electronic Components Group

UK . 1,214 parts In-Stock

1+ parts

$32.945

100+ parts

$31.298

1k+ parts

$29.650

10k+ parts

-

1,214

$32.945

$31.298

$29.650

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Microchip USA

USA . 2,779 parts In-Stock

1+ parts

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2,779

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Robosynatics

Brazil . 200 parts In-Stock

1+ parts

-

100+ parts

$0.065

1k+ parts

$0.065

10k+ parts

$0.065

200

-

$0.065

$0.065

$0.065

Lucentia Tech

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$0.065

1k+ parts

$0.065

10k+ parts

$0.065

200

-

$0.065

$0.065

$0.065

Overview

Discover the SN74LVC4245APWTG4 by Texas Instruments, a high-quality bus driver and transceiver that offers unparalleled value to customers. With its advanced CMOS technology, this product ensures reliable data transmission between different voltage levels of 3V and 5V. Whether you're designing for industrial applications or consumer electronics, this versatile device is the perfect choice. Its compact size, surface mount capability, and low power consumption make it an ideal solution for space-constrained designs. Trust in Texas Instruments' reputation for excellence and choose the SN74LVC4245APWTG4 for all your bus driving and transceiver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material in the package body makes this product lightweight and durable, making it an excellent choice for bus drivers and transceivers.

Propagation Delay At Nominal Supply: 6.7 ns

With a low propagation delay of 6.7 ns at nominal supply, this product ensures fast and efficient data transmission, making it ideal for high-speed bus driver and transceiver applications.

Surface Mount: YES

This product's surface mount capability allows for easy installation and integration into a variety of devices, making it a convenient choice for bus driver and transceiver designs.

No. of Functions: 1

With a single function, this product provides a straightforward and focused solution for bus driving and transceiving needs, simplifying system design and reducing complexity.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard board layouts and enhances ease of assembly, making this product a practical choice for bus driver and transceiver implementations.

No. of Bits: 8

With 8 bits, this product enables efficient data handling and processing, making it suitable for applications that require precise and reliable bus communication.

Translation: 3V & 5V

Supporting both 3V and 5V translation, this product offers versatility in interfacing with different voltage levels, making it compatible with a wide range of bus driver and transceiver systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this product ensures stable and consistent performance, making it a reliable choice for bus driver and transceiver applications.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this product can handle typical bus loads with ease, delivering efficient signal transmission and reception for bus driver and transceiver operations.

Power Supplies (V): 3.3

Supporting a power supply voltage of 3.3V, this product offers compatibility with low-power bus driver and transceiver systems, making it energy-efficient and suitable for portable applications.

No. of Terminals: 24

With 24 terminals, this product provides sufficient connectivity options, allowing for versatile integration and enabling complex bus driver and transceiver configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style ensure space-saving design and high-density integration, making this product an excellent choice for compact bus driver and transceiver implementations.

Maximum I (ol): 24 Amp

With a maximum output current of 24 Amp, this product can drive high-power bus loads, making it suitable for demanding bus driver and transceiver applications.

Propagation Delay (tpd): 6.7 ns

The low propagation delay of 6.7 ns ensures minimal signal latency, enabling fast and real-time data transmission, which is crucial for responsive bus driver and transceiver operations.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high-temperature environments commonly encountered in bus driver and transceiver applications, ensuring reliable performance.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexible control over signal transmission, enabling efficient bus driving and transceiving by allowing multiple devices to share the bus without interference.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product remains operational in extremely cold environments, making it suitable for bus driver and transceiver applications in various climates.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of NICKEL PALLADIUM GOLD ensures excellent conductivity, corrosion resistance, and long-term reliability, making this product a durable choice for bus driver and transceiver systems.

Terminal Position: DUAL

The dual terminal position allows for versatile board mounting options, facilitating flexibility in bus driver and transceiver system layouts and enabling efficient space utilization.

No. of Ports: 2

With two ports, this product offers expanded connectivity options, allowing for simultaneous bus communication and enabling complex bus driver and transceiver configurations.

Maximum Seated Height: 1.2 mm

With a maximum seated height of 1.2 mm, this product offers a low-profile design, enhancing space efficiency and enabling compact bus driver and transceiver implementations.

Width: 4.4 mm

With a width of 4.4 mm, this product features a compact footprint, making it suitable for space-constrained bus driver and transceiver applications where size matters.

Output Polarity: TRUE

The true output polarity ensures accurate signal representation, minimizing errors and ensuring reliable data transmission in bus driver and transceiver applications.

Minimum Supply Voltage (Vsup): 4.5 V

With a minimum supply voltage of 4.5 V, this product can operate effectively within low-power bus driver and transceiver systems, making it energy-efficient and ideal for battery-operated devices.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product simplifies the assembly process, allowing for efficient manufacturing of bus driver and transceiver systems.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures effective soldering during the manufacturing process, resulting in reliable connections and robust bus driver and transceiver devices.

Length: 7.8 mm

With a length of 7.8 mm, this product offers a compact design, facilitating space-saving integration and making it suitable for small-sized bus driver and transceiver applications.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this product meets the temperature and reliability requirements of bus driver and transceiver systems operating in demanding conditions, ensuring consistent performance.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption, high noise immunity, and excellent signal integrity, making it an efficient and reliable choice for bus driver and transceiver applications.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and enhances mechanical stability, ensuring secure connections and making this product a robust solution for bus driver and transceiver designs.

Packing Method: TR

The TR packing method provides convenient and reliable packaging, ensuring proper protection during shipping and handling, making this product suitable for hassle-free distribution and integration.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this product offers fine-pitch connectivity, enabling high-density integration and allowing for compact bus driver and transceiver designs.

Count Direction: BIDIRECTIONAL

The bidirectional count direction allows for versatile data flow in both directions on the bus, facilitating efficient communication and making this product suitable for bidirectional bus driver and transceiver applications.

Control Type: COMMON CONTROL

The common control type simplifies system operation and integration, allowing multiple bus drivers and transceivers to be controlled using a single set of control signals, enhancing efficiency and reducing complexity.

Moisture Sensitivity Level (MSL): 1

With a moisture sensitivity level of 1, this product has minimal moisture absorption risks, ensuring long shelf life and reliable performance in bus driver and transceiver applications.

Maximum Supply Voltage (Vsup): 5.5 V

Featuring a maximum supply voltage of 5.5 V, this product offers flexibility in power supply options, making it compatible with various bus driver and transceiver systems.

Maximum Power Supply Current (ICC): 0.13 mA

With a maximum power supply current of 0.13 mA, this product operates with low power consumption, contributing to energy-efficient bus driver and transceiver designs.

Technical Specifications

Bus Driver & Transceivers SN74LVC4245APWTG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

5V SUPPLY FOR PORT A; 3.3V SUPPLY FOR PORT B

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.13 mA

Propagation Delay At Nominal Supply:

6.7 ns

Propagation Delay (tpd):

6.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

3V & 5V

Width:

4.4 mm

Trade Compliance

SN74LVC4245APWTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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