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MC74HC573ANG

Onsemi

MC74HC573ANG by Onsemi

MC74HC573ANG by Onsemi is an 8-bit bus driver with 45ns propagation delay. It operates at a nominal voltage of 3V and supports a load capacitance of 50pF. Ideal for applications requiring fast signal transmission in compact spaces.

Median Price

$1.141

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Nova Conductors

Japan . 50 parts In-Stock

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$0.742

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Component Electronics Inc.

Canada . 10 parts In-Stock

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$1.540

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$1.150

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$1.000

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Vyrian

USA . 8,128 parts In-Stock

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Digiode

USA . 2,369 parts In-Stock

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Connector Distribution Corp

USA . 189 parts In-Stock

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Right Parts Inc.

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ACDS - Activité Composants Distribution Service

France . 39 parts In-Stock

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Electronics Depot

USA . 16 parts In-Stock

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QIE Inc.

USA . 10 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2 parts In-Stock

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Diverse Electronics

Canada . 1 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,276 parts In-Stock

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$0.742

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$0.727

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$0.727

Argo Parts USA

USA . 2,066 parts In-Stock

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$0.742

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Netroflash

USA . 100 parts In-Stock

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$0.742

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$0.727

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$0.727

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Corohmni

South Africa . 74 parts In-Stock

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$1.540

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74

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Semicontronic

India . 1,498 parts In-Stock

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$5.000

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$4.875

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$4.850

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Ampacity Inc.

Singapore . 635 parts In-Stock

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$13.000

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635

$13.000

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AZTECH Wire

Italy . 246 parts In-Stock

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$13.846

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Aztec Data Supply Inc.

USA . 4,657 parts In-Stock

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$17.050

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$22.429

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$21.308

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$21.308

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$22.429

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$21.308

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SupplyDigital Components

Austria . 6,594 parts In-Stock

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TANS Electronics

Latvia . 6,068 parts In-Stock

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Kulean Microsystems

USA . 3,183 parts In-Stock

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Problanco Electronics

Mexico . 3,053 parts In-Stock

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Corphita

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Perfect Parts

USA . 974 parts In-Stock

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UHIMA Technologies

Türkiye . 413 parts In-Stock

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Microchip USA

USA . 167 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 39 parts In-Stock

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Assy Fe

Spain . 36 parts In-Stock

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Glotronic Ltd.

UK . 31 parts In-Stock

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Overview

Upgrade your electronic projects with the high-quality MC74HC573ANG bus driver & transceiver by Onsemi. This versatile component is designed to provide seamless communication and connectivity, ensuring reliable performance in various applications. With a nominal supply voltage of 3V and a propagation delay of just 45ns, this product offers fast and efficient data transmission. Whether you're working on industrial automation, robotics, or IoT devices, the MC74HC573ANG guarantees optimal functionality and precision. Trust Onsemi for cutting-edge technology that delivers value and innovation to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, perfect for use in a variety of environments.

Propagation Delay At Nominal Supply: 45 ns

Low propagation delay ensures that signals are transmitted quickly and efficiently, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on PCBs.

Nominal Supply Voltage / Vsup (V): 3

Operates at a low nominal supply voltage, making it energy-efficient and suitable for battery-operated devices.

Load Capacitance (CL): 50 pF

Optimized for a 50 pF load capacitance, ensuring compatibility with a wide range of devices and circuit configurations.

No. of Terminals: 20

The 20 terminals provide ample connection points for interfacing with other components and systems.

Output Characteristics: 3-STATE

3-STATE output allows for flexibility in controlling the bus lines, enabling high-speed data transfer with reduced signal interference.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital circuit designs.

Technical Specifications

Bus Driver & Transceivers MC74HC573ANG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Trade Compliance

MC74HC573ANG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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