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SN74LVC2G241DCUR

Texas Instruments

SN74LVC2G241DCUR by Texas Instruments

SN74LVC2G241DCUR by Texas Instruments is a 2-function bus driver with a propagation delay of 4.3 ns at 1.8V, suitable for automotive applications. It features a max operating temperature of 125°C, output polarity TRUE, and terminal finish in Matte Tin (Sn). With a small outline package style and dual terminal position, it offers high performance in compact designs.

Median Price

$0.300

Lifecycle Status

Suppliers In-Stock

34

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 5,119 parts In-Stock

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Texas Instruments

USA . 536,730 parts In-Stock

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DigiKey

USA . 50,718 parts In-Stock

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Mouser Electronics

USA . 4,748 parts In-Stock

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Newark

USA . 4,424 parts In-Stock

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$0.546

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Farnell

UK . 2,765 parts In-Stock

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Arrow

USA . 9,000 parts In-Stock

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Element14

Singapore . 2,750 parts In-Stock

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Chip1Stop

Japan . 741 parts In-Stock

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RS (Exports)

UK . 120 parts In-Stock

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Verical

USA . 41 parts In-Stock

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Avnet

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IBS Electronics

USA . 37,974 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Digiode

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Chip Stock

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Vyrian

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ACDS - Activité Composants Distribution Service

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Sensible Micro Corp

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ComSIT Distribution GmbH

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Cyclops Electronics Ltd

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Inland Empire Components Inc.

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Atlantic Semiconductor

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PC Components Company LLC

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Velocity Electronics

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Semtec, LLC

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Ampacity Inc.

Singapore . 57,731 parts In-Stock

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Semicontronic

India . 57,632 parts In-Stock

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Corohmni

South Africa . 907 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Argo Parts USA

USA . 358 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$0.276

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Corphita

USA . 825 parts In-Stock

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Microchip USA

USA . 4,838 parts In-Stock

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Andel Nordic

Denmark . 937 parts In-Stock

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$10.731

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$10.731

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Parana Technologies

USA . 2,118 parts In-Stock

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$21.606

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DigiPath Technology Company

USA . 8 parts In-Stock

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$23.790

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$21.887

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ChromeModa Solutions

Germany . 3,852 parts In-Stock

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$19.906

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IDEA Electronic Components Group

UK . 2,178 parts In-Stock

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Perfect Parts

USA . 215,133 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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Metaverse IC Inc.

Canada . 5,980 parts In-Stock

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Kepictronics

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Futuretech Components

Singapore . 3,000 parts In-Stock

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GreenTree Electronics

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S.R.D Solutions

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Continental Prestige Electronics

USA . 289 parts In-Stock

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$0.318

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Overview

Elevate your electronics with the SN74LVC2G241DCUR from Texas Instruments, a top-tier manufacturer known for its high-quality components. As part of the Bus Driver & Transceivers category, this product offers unmatched reliability and performance. With a compact design and advanced features like 3-STATE output characteristics and low propagation delay, it's perfect for a wide range of applications. Trust Texas Instruments to deliver innovative solutions that add value, provide benefits, and give you a competitive edge in the market. Upgrade to the SN74LVC2G241DCUR today and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 4.3 ns

Low propagation delay ensures fast data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage helps in reducing power consumption and operating costs.

No. of Port: 2

Having 2 ports allows for increased connectivity options, making it versatile for different types of buses or transceiver setups.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, such as heat in automotive applications.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures makes this product suitable for both hot and cold climates, ensuring consistent performance in various conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74LVC2G241DCUR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW/HIGH

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.3 ns

Propagation Delay (tpd):

8.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

2 mm

Trade Compliance

SN74LVC2G241DCUR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-629-9170, 5962016299170

NIIN

016299170

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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