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MM74HC541WMX

Onsemi

MM74HC541WMX by Onsemi

MM74HC541WMX by Onsemi is an 8-bit bus driver with 29ns propagation delay, operating at 4.5V. It features a small outline package and can handle up to 6A output current. Ideal for industrial applications requiring true output polarity and dual terminal position control.

Median Price

$0.456

Lifecycle Status

Suppliers In-Stock

34

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1k+

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Arrow

USA . 3 parts In-Stock

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$0.353

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$0.353

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Mouser Electronics

USA . 2,579 parts In-Stock

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$0.710

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$0.511

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$0.462

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2,579

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Farnell

UK . 7,748 parts In-Stock

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$0.872

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$0.493

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$0.302

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$0.293

7,748

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$0.493

$0.302

$0.293

Adafruit Industries

USA . 500 parts In-Stock

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$26.718

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$24.313

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$21.909

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$26.718

$24.313

$21.909

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Rochester

USA . 163,664 parts In-Stock

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$0.440

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$0.365

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$0.326

163,664

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DigiKey

USA . 155,983 parts In-Stock

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Verical

USA . 95,818 parts In-Stock

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Chip1Stop

Japan . 1,000 parts In-Stock

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RS (Exports)

UK . 970 parts In-Stock

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$0.384

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$0.344

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$0.336

970

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$0.336

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Freelance Electronics

USA . 100 parts In-Stock

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Digiode

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Nova Conductors

Japan . 68 parts In-Stock

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TME

Poland . 937 parts In-Stock

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Component Electronics Inc.

Canada . 200 parts In-Stock

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$1.540

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$1.150

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DigiKey Marketplace

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Vyrian

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Flip Electronics

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Chip Stock

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Atlantic Semiconductor

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Bristol Electronics

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NAC Semi

USA . 4,000 parts In-Stock

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ComSIT USA

USA . 4,000 parts In-Stock

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Resion

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Mil-Aero Solutions, Inc.

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J & M Industries LLC

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Ampacity Inc.

Singapore . 24,636 parts In-Stock

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$0.272

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Corohmni

South Africa . 96 parts In-Stock

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Semicontronic

India . 29,442 parts In-Stock

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$0.275

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Corphita

USA . 2,278 parts In-Stock

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Argo Parts USA

USA . 3,484 parts In-Stock

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$0.429

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$0.416

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Netroflash

USA . 100 parts In-Stock

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$0.429

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Continental Prestige Electronics

USA . 178,638 parts In-Stock

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$0.672

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$0.380

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$0.233

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Microchip USA

USA . 5,208 parts In-Stock

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$2.793

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Aztec Data Supply Inc.

USA . 200 parts In-Stock

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$24.245

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$26.718

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$24.313

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$21.909

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$26.718

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$21.909

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Andel Nordic

Denmark . 5,289 parts In-Stock

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$43.000

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$30.099

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Perfect Parts

USA . 9,023 parts In-Stock

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TANS Electronics

Latvia . 6,649 parts In-Stock

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Problanco Electronics

Mexico . 5,427 parts In-Stock

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SupplyDigital Components

Austria . 4,320 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 3,134 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Supply Digital

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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Assy Fe

Spain . 1,200 parts In-Stock

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Eastek

USA . 1,000 parts In-Stock

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$0.911

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Futuretech Components

Singapore . 975 parts In-Stock

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UHIMA Technologies

Türkiye . 178 parts In-Stock

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Overview

Unlock the power of seamless data transmission with the MM74HC541WMX by Onsemi, a top-tier manufacturer known for its superior quality and reliability. This bus driver & transceiver is a game-changer in the industry, offering lightning-fast propagation delay, 3-STATE output characteristics, and a wide operating temperature range. Whether you're designing industrial automation systems or communication networks, this product delivers unmatched performance and efficiency. Elevate your projects with the MM74HC541WMX and experience the difference in speed, precision, and overall functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to impact, making it suitable for rugged environments.

Propagation Delay At Nominal Supply: 29 ns

The low propagation delay ensures fast signal transmission, improving overall system efficiency.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into circuit boards, saving space and simplifying assembly.

No. of Bits: 8

With 8 bits, the product can handle a wide range of data transmission and processing tasks efficiently.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V ensures compatibility with a wide range of power sources, enhancing versatility.

Load Capacitance (CL): 50 pF

The low load capacitance allows for faster signal transmission and reduces the risk of signal distortion.

Power Supplies (V): 2/6

Support for power supplies ranging from 2V to 6V gives flexibility in different operating conditions and power sources.

No. of Terminals: 20

The 20 terminals provide ample connectivity options for interfacing with other components and systems.

Maximum I (ol): 6 Amp

The high maximum output current of 6A allows the product to drive heavy loads without overheating or damage.

Propagation Delay (tpd): 208 ns

Although slightly higher, the propagation delay of 208ns is still within acceptable limits for most applications, ensuring reliable performance.

Maximum Operating Temperature: 85°C

The high maximum operating temperature of 85°C allows the product to withstand harsh environmental conditions without performance degradation.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexibility in controlling signals, enabling efficient switching between high impedance and active states.

Minimum Operating Temperature: -40°C

The low minimum operating temperature of -40°C makes the product suitable for use in cold environments without risk of failure.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good conductivity and solderability, ensuring reliable connections and ease of assembly.

Terminal Position: DUAL

The dual terminal position allows for better stability and more secure connections in the circuitry.

No. of Ports: 2

Having 2 ports enables the product to interface with multiple devices or subsystems simultaneously, expanding its functionality.

Width: 7.5 mm

The compact width of 7.5mm saves space on the circuit board and allows for more efficient layout design.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission and interpretation, reducing the risk of errors in data processing.

Minimum Supply Voltage (Vsup): 2 V

Support for a minimum supply voltage of 2V allows the product to operate efficiently even with low-power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering and assembly without damaging the product.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product can withstand high-temperature soldering processes without deformation or failure.

Length: 12.8 mm

The compact length of 12.8mm contributes to space-saving on the circuit board and enables sleek and efficient product design.

Temperature Grade: INDUSTRIAL

Designed for industrial use, the product can withstand harsh operating conditions and is suitable for a wide range of industrial applications.

Technology: CMOS

Utilizing CMOS technology, the product offers low power consumption, high noise immunity, and reliable performance in various applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical and electrical connections, ensuring durability and stability in operation.

Packing Method: TR

The TR packing method offers convenience in storage, transportation, and assembly of the product, enhancing overall efficiency.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm allows for precise and compact placement on the circuit board, optimizing space utilization and electrical connectivity.

Control Type: ENABLE LOW

The enable low control type offers flexibility in managing the operation of the product, allowing for efficient power management and signal control.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the product can withstand moderate exposure to moisture during storage and assembly, reducing the risk of damage.

Maximum Supply Voltage (Vsup): 6 V

Support for a maximum supply voltage of 6V ensures compatibility with a wide range of power sources and operating conditions, enhancing versatility.

Technical Specifications

Bus Driver & Transceivers MM74HC541WMX attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

29 ns

Propagation Delay (tpd):

208 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

MM74HC541WMX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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