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SN74HCT573DWR

Texas Instruments

SN74HCT573DWR by Texas Instruments

SN74HCT573DWR by Texas Instruments is an 8-bit bus driver with a propagation delay of 44 ns at 5V. It features a small outline package, operates in industrial temperature range (-40 to 85 °C), and has a true output polarity. Ideal for applications requiring fast data transmission and control signals in electronic systems.

Median Price

$0.774

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 1,837 parts In-Stock

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$0.767

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$0.437

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$0.334

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DigiKey

USA . 23,135 parts In-Stock

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$0.780

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$0.440

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$0.389

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$0.345

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$0.440

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$0.345

Mouser Electronics

USA . 5,394 parts In-Stock

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$0.780

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$0.440

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$0.389

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$0.352

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$0.352

Adafruit Industries

USA . 3,000 parts In-Stock

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$27.813

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Verical

USA . 1,837 parts In-Stock

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$0.437

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$0.334

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Chip1Stop

Japan . 1,780 parts In-Stock

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$0.436

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Distributors (In-Stock)

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DF Sales Co.

USA . 3 parts In-Stock

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DF Sales Co.

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Digiode

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Nova Conductors

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Mobius Materials

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Chip Stock

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Vyrian

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ABC Electronics Ltd.

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Rebound Electronics

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Pegasus Components GmbH

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ComSIT Distribution GmbH

Germany . 864 parts In-Stock

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R&J Components

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Lakeland Logistics Inc

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Bristol Electronics

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Mil-Aero Solutions, Inc.

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Semtec, LLC

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Resion

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QIE Inc.

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LWI Electronics Inc

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,133 parts In-Stock

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$0.150

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Semicontronic

India . 3,832 parts In-Stock

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Argo Parts USA

USA . 3,088 parts In-Stock

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$0.257

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$0.249

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Corphita

USA . 4,282 parts In-Stock

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$0.335

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Component Stockers USA

USA . 39,328 parts In-Stock

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$0.170

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$0.130

39,328

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$0.130

Continental Prestige Electronics

USA . 277 parts In-Stock

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$0.528

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$0.332

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$0.204

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Bastille Electronics

Australia . 60 parts In-Stock

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$1.000

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$0.950

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$0.902

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$0.890

60

$1.000

$0.950

$0.902

$0.890

Andel Nordic

Denmark . 1,086 parts In-Stock

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$5.932

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$5.695

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$5.695

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$5.695

Corohmni

South Africa . 187 parts In-Stock

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$27.221

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$27.813

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$26.422

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$26.422

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$27.813

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Parana Technologies

USA . 1,113 parts In-Stock

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$29.997

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$65.751

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DigiPath Technology Company

USA . 908 parts In-Stock

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IDEA Electronic Components Group

UK . 1,848 parts In-Stock

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$33.705

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$32.020

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$30.334

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ChromeModa Solutions

Germany . 1,492 parts In-Stock

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$33.705

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$27.638

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Perfect Parts

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Lixinc

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A-Z Elektronik GmbH

Germany . 7,431 parts In-Stock

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Futuretech Components

Singapore . 6,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 3,141 parts In-Stock

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S.R.D Solutions

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Infinite Electronics LLP (Excess)

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Glotronic Ltd.

UK . 268 parts In-Stock

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Assy Fe

Spain . 119 parts In-Stock

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Overview

Upgrade your electronics with the SN74HCT573DWR by Texas Instruments, a top-quality bus driver and transceiver that guarantees high performance and reliability. Perfect for various applications, this product offers exceptional value with its 3-STATE output characteristics, true output polarity, and low propagation delay. Trust in Texas Instruments' reputation for excellence and invest in the SN74HCT573DWR for seamless integration and superior functionality in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components within the package, ensuring reliability in various operating conditions.

Propagation Delay At Nominal Supply: 44 ns

Fast propagation delay allows for quick signal transmission, making this bus driver ideal for high-speed communication applications.

Surface Mount: YES

Ease of installation and space-saving design with surface mount capability.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage for compatibility with common power sources.

Load Capacitance (CL): 50 pF

Suitable for driving capacitive loads, ensuring signal integrity without distortion.

Output Characteristics: 3-STATE

Ability to tri-state the output allows for flexibility in controlling the bus lines, reducing power consumption when not actively transmitting data.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with high operating temperatures, ensuring reliability under harsh conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the bus driver energy efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers SN74HCT573DWR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

44 ns

Propagation Delay (tpd):

65 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74HCT573DWR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-361-1436, 5962013611436

NIIN

013611436

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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