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SN74LVC2G125DCUT

Texas Instruments

SN74LVC2G125DCUT by Texas Instruments

SN74LVC2G125DCUT by Texas Instruments is a 2-function bus driver with a propagation delay of 4.3 ns and operates at a nominal voltage of 1.8V. This CMOS technology device has an output polarity of TRUE, suitable for automotive applications due to its wide temperature range from -40°C to 125°C.

Median Price

$1.015

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

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Arrow

USA . 164 parts In-Stock

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$1.015

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$0.487

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Chip1Stop

Japan . 1,261 parts In-Stock

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$1.040

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$0.575

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$0.483

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$0.437

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$0.575

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Texas Instruments

USA . 48,906 parts In-Stock

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$0.378

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Avnet

USA . 8,250 parts In-Stock

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Verical

USA . 164 parts In-Stock

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$0.487

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Digiode

USA . 3,528 parts In-Stock

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$0.626

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Mobius Materials

USA . 1,253 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Chip Stock

USA . 96,628 parts In-Stock

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Vyrian

USA . 8,652 parts In-Stock

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Bristol Electronics

USA . 500 parts In-Stock

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NexGen Digital

USA . 408 parts In-Stock

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PAR Electronics

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ComSIT Distribution GmbH

Germany . 246 parts In-Stock

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Speed Components Ltd

Israel . 120 parts In-Stock

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Semi Source

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EMSNET

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Mil-Aero Solutions, Inc.

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Distributors (Availability)

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Ampacity Inc.

Singapore . 8,423 parts In-Stock

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$0.414

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$0.414

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Semicontronic

India . 8,390 parts In-Stock

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$0.414

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$0.404

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$0.402

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Corphita

USA . 336 parts In-Stock

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$0.593

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Continental Prestige Electronics

USA . 5,078 parts In-Stock

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$0.743

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$0.728

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Argo Parts USA

USA . 393 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Andel Nordic

Denmark . 1,737 parts In-Stock

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$1.408

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$1.352

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Microchip USA

USA . 5,943 parts In-Stock

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Parana Technologies

USA . 1,986 parts In-Stock

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$12.779

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$1,186.689

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$11.501

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DigiPath Technology Company

USA . 1,450 parts In-Stock

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$14.071

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$12.945

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ChromeModa Solutions

Germany . 6,619 parts In-Stock

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IDEA Electronic Components Group

UK . 1,000 parts In-Stock

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Corohmni

South Africa . 70 parts In-Stock

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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Perfect Parts

USA . 11,286 parts In-Stock

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Infinite Electronics LLP (Excess)

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Robosynatics

Brazil . 500 parts In-Stock

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$7.795

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Lucentia Tech

USA . 500 parts In-Stock

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$7.795

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$7.795

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Overview

Discover the superior quality and reliability of Texas Instruments with the SN74LVC2G125DCUT Bus Driver & Transceiver. Perfect for a wide range of applications, this product offers fast propagation delay, low power consumption, and 3-state output characteristics. With a small outline package and dual terminal position, it is easy to integrate into your designs. Trust in Texas Instruments for cutting-edge technology and unmatched performance. Upgrade your projects with the SN74LVC2G125DCUT and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver and transceiver, ensuring a longer product life.

Propagation Delay At Nominal Supply: 4.3 ns

Low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 2

Having multiple functions in a single component reduces the number of parts needed in a design, saving costs and simplifying the overall system.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage of 1.8V makes this product energy-efficient and suitable for battery-powered applications.

Load Capacitance (CL): 50 pF

The specified load capacitance of 50 pF ensures compatibility with a wide range of devices and signal transmission requirements.

Power Supplies (V): 3.3

Support for multiple power supplies at 3.3V offers flexibility in system design and compatibility with various voltage requirements.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

The compact package style with a thin profile and shrink pitch design enables space-saving and high-density PCB layouts.

Maximum I (ol): 32 Amp

High output current capability of 32A allows for driving heavy loads and ensures robust performance in demanding applications.

Propagation Delay (tpd): 9.1 ns

With a low propagation delay of 9.1 ns, this product offers fast signal transmission, reducing latency and improving overall system efficiency.

Maximum Operating Temperature: 125 °C

Wide operating temperature range up to 125°C ensures reliability and performance in harsh environmental conditions, making it suitable for automotive applications.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, enabling easy bus sharing and reducing power consumption when not actively driving the bus.

Minimum Operating Temperature: -40 °C

Operating at a low temperature of -40°C ensures functionality in cold environments, making this product suitable for a wide range of applications.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good solderability and corrosion resistance, ensuring reliable connections and long-term performance.

Terminal Position: DUAL

Dual terminal position allows for versatile PCB mounting options and simplifies the assembly process, offering flexibility in system design.

No. of Ports: 2

Having two ports enables simultaneous communication with multiple devices, enhancing system flexibility and performance.

Technical Specifications

Bus Driver & Transceivers SN74LVC2G125DCUT attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.3 ns

Propagation Delay (tpd):

9.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Trade Compliance

SN74LVC2G125DCUT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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