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CD74AC541M96

Texas Instruments

CD74AC541M96 by Texas Instruments

CD74AC541M96 by Texas Instruments is an 8-bit bus driver with 10.9 ns propagation delay at 3.3V, suitable for military-grade applications. It features a max operating temperature of 125°C, output polarity TRUE, and a terminal pitch of 1.27 mm for surface mount assembly.

Median Price

$0.670

Lifecycle Status

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Mouser Electronics

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$1.230

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$0.712

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$0.580

1,786

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$0.580

DigiKey

USA . 565 parts In-Stock

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$1.230

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$0.711

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$0.647

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$0.613

565

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$0.647

$0.613

RS (Exports)

UK . 3,490 parts In-Stock

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$0.670

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$0.574

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Arrow

USA . 2,000 parts In-Stock

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Element14

Singapore . 1,531 parts In-Stock

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$0.745

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$0.425

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$0.416

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Farnell

UK . 495 parts In-Stock

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$0.539

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$0.475

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$0.539

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Nova Conductors

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Digiode

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Vyrian

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Chip Stock

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Semicontronic

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$0.241

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$0.235

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$0.234

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Continental Prestige Electronics

USA . 1,316 parts In-Stock

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$0.399

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$0.391

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Argo Parts USA

USA . 527 parts In-Stock

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$0.399

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$0.387

527

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Corphita

USA . 1,486 parts In-Stock

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$0.502

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Parana Technologies

USA . 858 parts In-Stock

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$19.265

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$1,789.042

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$17.338

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858

$19.265

$1,789.042

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DigiPath Technology Company

USA . 1,301 parts In-Stock

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$21.213

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ChromeModa Solutions

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$17.750

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IDEA Electronic Components Group

UK . 738 parts In-Stock

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$20.564

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$19.481

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738

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Corohmni

South Africa . 72 parts In-Stock

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Perfect Parts

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iodParts Technologies Inc.

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Authorized Procurement Solutions

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Glotronic Ltd.

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Netroflash

USA . 1,000 parts In-Stock

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Supply Digital

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Advanced Electronics

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Component Stockers USA

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Overview

Experience superior quality and reliability with the CD74AC541M96 by Texas Instruments, a leading manufacturer in the industry. This bus driver & transceiver offers seamless communication and data transfer with its 8-bit design, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this product delivers exceptional performance with a nominal supply voltage of 3.3V, ensuring efficiency and precision in every operation. Trust Texas Instruments for cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the CD74AC541M96 today.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Durable and lightweight material for long-lasting performance.

Propagation Delay At Nominal Supply:

10.9 ns - Provides fast signal transmission for efficient operation.

Surface Mount:

YES - Easy installation on circuit boards for convenient use.

Package Shape:

RECTANGULAR - Compact design for space-saving mounting.

No. of Bits:

8 - Ideal for handling multiple data signals efficiently.

Nominal Supply Voltage/Vsup (V):

3.3 - Compatible with standard voltage requirements for easy integration.

Load Capacitance (CL):

50 pF - Suitable for driving capacitive loads without performance issues.

Power Supplies (V):

3.3/5 - Versatile voltage options for flexibility in different applications.

No. of Terminals:

20 - Sufficient terminals for connecting to various components.

Package Style (Meter):

SMALL OUTLINE - Streamlined design for optimized space utilization.

Maximum I (ol):

24 Amp - High output current capacity for driving heavy loads.

Propagation Delay (tpd):

89 ns - Low delay time for quick signal processing.

Maximum Operating Temperature:

125 °C - Suitable for harsh environmental conditions.

Output Characteristics:

3-STATE - Flexible output options for versatile connectivity.

Minimum Operating Temperature:

55 °C - Can function in extreme cold temperatures.

Terminal Finish:

NICKEL PALLADIUM GOLD - Provides corrosion resistance for longevity.

Terminal Position:

DUAL - Allows for easy connection in various orientations.

No. of Ports:

2 - Sufficient ports for connecting to multiple devices.

Maximum Seated Height:

2.65 mm - Low profile design for compact installations.

Width:

7.5 mm - Narrow width for efficient PCB layout.

Output Polarity:

TRUE - Accurate signal output for reliable communication.

Minimum Supply Voltage (Vsup):

1.5 V - Can operate at low voltage levels efficiently.

Maximum Time At Peak Reflow Temperature (s):

30 - Resistant to high-temperature soldering processes.

Peak Reflow Temperature °C:

260 - Withstands high temperatures during reflow soldering.

Length:

12.8 mm - Compact length for efficient board space utilization.

Temperature Grade:

MILITARY - Meets stringent military-grade standards for durability.

Technology:

CMOS - Low power consumption with high performance.

Terminal Form:

GULL WING - Easy to solder onto circuit boards.

Packing Method:

TR - Suitable packing for protection during transportation.

Terminal Pitch:

1.27 mm - Standard pitch for easy PCB layout.

Count Direction:

UNIDIRECTIONAL - Supports data transmission in one direction.

Control Type:

ENABLE LOW - Simple control mechanism for easy operation.

Maximum Supply Voltage (Vsup):

5.5 V - Can handle high voltage levels without damage.

Maximum Power Supply Current (ICC):

0.16 mA - Low power consumption for energy efficiency.

Technical Specifications

Bus Driver & Transceivers CD74AC541M96 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

10.9 ns

Propagation Delay (tpd):

89 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

CD74AC541M96 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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