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SN74LVCC3245APWRG4

Texas Instruments

SN74LVCC3245APWRG4 by Texas Instruments

SN74LVCC3245APWRG4 by Texas Instruments is an 8-bit bus driver with 3V & 3/5V translation, featuring a propagation delay of 7.6 ns and output characteristics in a small outline package. Ideal for bidirectional applications requiring common control at industrial temperature grades.

Median Price

$1.950

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,631 parts In-Stock

1+ parts

$1.950

100+ parts

$1.660

1k+ parts

$1.580

10k+ parts

$0.880

2,631

$1.950

$1.660

$1.580

$0.880

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 58 parts In-Stock

1+ parts

$0.904

100+ parts

-

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-

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-

58

$0.904

-

-

-

Digiode

USA . 1,284 parts In-Stock

1+ parts

$1.548

100+ parts

-

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-

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1,284

$1.548

-

-

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Chip Stock

USA . 29,030 parts In-Stock

1+ parts

-

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29,030

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Vyrian

USA . 3,537 parts In-Stock

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-

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3,537

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Bristol Electronics

USA . 829 parts In-Stock

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-

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829

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,316 parts In-Stock

1+ parts

$0.890

100+ parts

-

1k+ parts

-

10k+ parts

$0.872

2,316

$0.890

-

-

$0.872

Argo Parts USA

USA . 2,002 parts In-Stock

1+ parts

$0.890

100+ parts

-

1k+ parts

-

10k+ parts

-

2,002

$0.890

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.904

100+ parts

-

1k+ parts

-

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-

2,000

$0.904

-

-

-

Corphita

USA . 3,122 parts In-Stock

1+ parts

$1.467

100+ parts

-

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-

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3,122

$1.467

-

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Semicontronic

India . 3,691 parts In-Stock

1+ parts

$1.520

100+ parts

$1.482

1k+ parts

$1.474

10k+ parts

-

3,691

$1.520

$1.482

$1.474

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Ampacity Inc.

Singapore . 3,252 parts In-Stock

1+ parts

$1.660

100+ parts

-

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-

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3,252

$1.660

-

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Andel Nordic

Denmark . 1,483 parts In-Stock

1+ parts

$4.293

100+ parts

-

1k+ parts

$4.122

10k+ parts

$4.122

1,483

$4.293

-

$4.122

$4.122

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$19.315

100+ parts

$18.349

1k+ parts

$18.349

10k+ parts

-

5,000

$19.315

$18.349

$18.349

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Parana Technologies

USA . 603 parts In-Stock

1+ parts

$26.009

100+ parts

-

1k+ parts

$26.604

10k+ parts

-

603

$26.009

-

$26.604

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ChromeModa Solutions

Germany . 6,910 parts In-Stock

1+ parts

$29.224

100+ parts

$23.964

1k+ parts

-

10k+ parts

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6,910

$29.224

$23.964

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IDEA Electronic Components Group

UK . 46 parts In-Stock

1+ parts

$29.224

100+ parts

$27.763

1k+ parts

$26.302

10k+ parts

-

46

$29.224

$27.763

$26.302

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Corohmni

South Africa . 439 parts In-Stock

1+ parts

$30.804

100+ parts

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439

$30.804

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Perfect Parts

USA . 2,240 parts In-Stock

1+ parts

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2,240

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DigiPath Technology Company

USA . 2,141 parts In-Stock

1+ parts

-

100+ parts

$26.348

1k+ parts

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2,141

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$26.348

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Microchip USA

USA . 2,069 parts In-Stock

1+ parts

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2,069

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Overview

Unlock the power of seamless data transmission with the SN74LVCC3245APWRG4 by Texas Instruments. Designed with precision and reliability in mind, this cutting-edge bus driver & transceiver offers unparalleled performance for a wide range of applications. With its advanced technology and robust construction, this product ensures fast and efficient data transfer while maintaining maximum security. Experience the high-quality standards of Texas Instruments with the SN74LVCC3245APWRG4, where value meets excellence. Elevate your projects to the next level with this innovative solution.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and ensures the component is resistant to damage.

Propagation Delay At Nominal Supply

7.6 ns - Low propagation delay ensures fast signal transmission, improving overall system efficiency.

Surface Mount

YES - Surface mount design allows for easy installation and space-saving on PCBs.

Package Shape

RECTANGULAR - Rectangular shape is a common and practical design for easy handling and placement.

No. of Bits

8 - Suitable for applications requiring communication over 8 data lines.

Translation

3V & 3/5V - Compatible with varying voltage requirements, offering flexibility in system integration.

Nominal Supply Voltage / Vsup (V)

3.3 - Stable supply voltage ensures reliable operation of the component.

Load Capacitance (CL)

50 pF - Designed to work efficiently with a specific load capacitance, enhancing performance.

Power Supplies (V)

3.3 - Compatible with common power supply voltages, making it versatile for different applications.

No. of Terminals

24 - Sufficient terminals for connecting with other components in the system.

Package Style (Meter)

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Compact package style saves space on the PCB while maintaining functionality.

Maximum I (ol)

24 Amp - High output current capability for driving loads without external amplification.

Propagation Delay (tpd)

11.2 ns - Low propagation delay ensures fast signal transmission, reducing latency.

Maximum Operating Temperature

85 °C - Wide operating temperature range allows operation in various environments.

Output Characteristics

3-STATE - 3-state output provides flexibility in controlling the bus lines.

Minimum Operating Temperature

40 °C - Able to operate reliably in low-temperature conditions.

Terminal Finish

Nickel/Palladium/Gold (Ni/Pd/Au) - Quality terminal finish for reliable connections and corrosion resistance.

Terminal Position

DUAL - Dual terminal position for secure mounting on the PCB.

No. of Ports

2 - Suitable for applications requiring connection to multiple devices.

Maximum Seated Height

1.2 mm - Low profile design for space-constrained applications.

Width

4.4 mm - Compact width for efficient PCB layout.

Output Polarity

TRUE - Positive logic output for easy interfacing with other components.

Minimum Supply Voltage (Vsup)

2.3 V - Compatible with a wide range of supply voltages, ensuring versatility.

Peak Reflow Temperature °C

260 - High reflow temperature tolerance for robust manufacturing processes.

Length

7.8 mm - Optimal length for easy placement and routing on the PCB.

Temperature Grade

INDUSTRIAL - Industrial-grade component suitable for harsh operating conditions.

Technology

CMOS - CMOS technology for low power consumption and high noise immunity.

Terminal Form

GULL WING - Gull wing terminal form for secure soldering and mechanical strength.

Packing Method

TR - Tape and reel packing for easy handling and storage.

Terminal Pitch

0.65 mm - Fine terminal pitch for high-density PCB layouts.

Count Direction

BIDIRECTIONAL - Bidirectional communication capability for versatile applications.

Control Type

COMMON CONTROL - Common control interface simplifies system integration.

Maximum Supply Voltage (Vsup)

3.6 V - High maximum supply voltage tolerance for added reliability.

Maximum Power Supply Current (ICC)

0.13 mA - Low power supply current consumption for energy-efficient operation.

Technical Specifications

Bus Driver & Transceivers SN74LVCC3245APWRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3V TO 5.5V SUPPLY FOR PORT B

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.13 mA

Propagation Delay At Nominal Supply:

7.6 ns

Propagation Delay (tpd):

11.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

3V & 3/5V

Width:

4.4 mm

Trade Compliance

SN74LVCC3245APWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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