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74AHC1G125GV,125

NXP Semiconductors

74AHC1G125GV,125 by NXP Semiconductors

74AHC1G125GV,125 by NXP Semiconductors is a bus driver & transceiver with a propagation delay of 9.5 ns and a load capacitance of 50 pF. It is commonly used in automotive applications due to its small size (1.5mm width) and low power consumption (2V nominal voltage).

Median Price

$0.111

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25

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1k+

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Chip1Stop

Japan . 2,187 parts In-Stock

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$0.041

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Mouser Electronics

USA . 6,967 parts In-Stock

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$0.067

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DigiKey

USA . 4,947 parts In-Stock

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$0.072

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$0.059

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Newark

USA . 2,995 parts In-Stock

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Rochester

USA . 222,935 parts In-Stock

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Verical

USA . 222,135 parts In-Stock

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Arrow

USA . 33,000 parts In-Stock

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EBV Elektronik

Germany . 3,000 parts In-Stock

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Farnell

UK . 925 parts In-Stock

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Element14

Singapore . 925 parts In-Stock

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$0.111

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925

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Digiode

USA . 1,430 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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TME

Poland . 2,388 parts In-Stock

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$0.048

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$0.072

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$0.048

DigiKey Marketplace

USA . 234,935 parts In-Stock

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Chip Stock

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IBS Electronics

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$0.260

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NAC Semi

USA . 6,000 parts In-Stock

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Vyrian

USA . 2,983 parts In-Stock

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Inventory MP

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Bristol Electronics

USA . 2,711 parts In-Stock

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Anansix

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Martec Srl

Italy . 2,195 parts In-Stock

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VNN

France . 1,183 parts In-Stock

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Cyclops Electronics Ltd

UK . 100 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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Ampacity Inc.

Singapore . 68,006 parts In-Stock

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Semicontronic

India . 67,241 parts In-Stock

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Corphita

USA . 2,128 parts In-Stock

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Component Stockers USA

USA . 327,958 parts In-Stock

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AZTECH Wire

Italy . 8,597 parts In-Stock

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Argo Parts USA

USA . 3,242 parts In-Stock

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Microchip USA

USA . 2,058 parts In-Stock

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Andel Nordic

Denmark . 321 parts In-Stock

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$12.250

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$8.575

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$8.575

321

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$8.575

Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$21.147

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Corohmni

South Africa . 78 parts In-Stock

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$28.652

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Aztec Data Supply Inc.

USA . 678 parts In-Stock

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Perfect Parts

USA . 305,418 parts In-Stock

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Continental Prestige Electronics

USA . 234,935 parts In-Stock

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$0.064

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GreenTree Electronics

Israel . 15,000 parts In-Stock

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Eastek

USA . 12,000 parts In-Stock

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UNI Independent Distributors

Spain . 2,796 parts In-Stock

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Authorized Procurement Solutions

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Netroflash

USA . 1,000 parts In-Stock

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$0.094

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$0.091

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$0.089

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Supply Digital

USA . 846 parts In-Stock

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Formix International (Excess)

India . 325 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of NXP Semiconductors with the 74AHC1G125GV,125. As a leading manufacturer in the industry, NXP delivers cutting-edge technology that powers a wide range of applications. This bus driver and transceiver is designed to enhance performance and provide seamless connectivity. With its compact size and surface mount capability, it offers unmatched convenience for integration into various systems. Trust in NXP's expertise and elevate your projects with the 74AHC1G125GV,125, delivering superior value, benefits, and advantages to meet your unique needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and provides protection against external factors, making this product a reliable and long-lasting choice.

Propagation Delay At Nominal Supply: 9.5 ns

With a low propagation delay of 9.5 ns, this product enables fast data transmission and ensures improved performance, making it ideal for time-critical applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation, making this product suitable for space-constrained environments and reducing assembly time.

No. of Functions: 1

With a single function, this product offers simplicity and ease of use, making it a cost-effective choice for various applications.

Package Shape: RECTANGULAR

The rectangular package shape provides compatibility with standard board designs, allowing for easy integration and reducing design complexity.

No. of Bits: 1

This product has a single bit, making it suitable for applications that require simple data transmission or control signals.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures consistent and stable power delivery, making this product compatible with a wide range of applications.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this product can handle a moderate amount of capacitance, making it suitable for driving various types of loads.

Power Supplies (V): 2/5.5

The availability of power supply options from 2V to 5.5V allows for flexibility in different operating scenarios, making this product versatile and adaptable.

No. of Terminals: 5

With 5 terminals, this product provides sufficient connectivity options, ensuring compatibility with various circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style result in a compact and space-saving design, making this product suitable for applications with limited physical board space.

Maximum I (ol): 8 Amp

The maximum output current of 8 Amp ensures this product can drive high-current loads, making it suitable for applications that require strong signal driving capabilities.

Propagation Delay (tpd): 14.5 ns

With a propagation delay of 14.5 ns, this product can transmit signals within a short period, allowing for faster communication and reducing latency.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C enables this product to withstand harsh environmental conditions, making it suitable for automotive and industrial applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for tristate control and flexibility in signal routing, enabling efficient bus sharing and reducing contention issues.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures this product can function reliably in extremely cold environments, making it suitable for a wide range of operating conditions.

Terminal Finish: Tin (Sn)

The terminal finish of tin (Sn) provides excellent solderability and corrosion resistance, ensuring reliable electrical connections and long-term performance.

Terminal Position: DUAL

With dual terminal position, this product offers versatile mounting options, making it suitable for different board layouts and orientations.

No. of Ports: 2

With 2 ports, this product can accommodate multiple input or output signals, allowing for increased flexibility and connectivity options.

Maximum Seated Height: 1.1 mm

The low maximum seated height of 1.1mm allows for a low-profile installation, reducing the overall size of the assembled system and increasing design flexibility.

Width: 1.5 mm

The compact width of 1.5 mm saves board space, making this product ideal for applications where size constraints are a concern.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission and compatibility with other components or systems, making this product reliable and easy to integrate.

Minimum Supply Voltage (Vsup): 2 V

With a minimum supply voltage of 2V, this product can operate efficiently in low-power scenarios, extending battery life and enabling energy-saving applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum allowed time of 30 seconds at peak reflow temperature ensures safe and reliable assembly during the manufacturing process, providing consistent quality and reducing the risk of component damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable and efficient soldering, ensuring robust electrical connections and minimizing the risk of thermal issues.

Length: 2.9 mm

The compact length of 2.9 mm saves board space, making this product suitable for applications with tight size constraints.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade designation indicates that this product meets the rigorous requirements for automotive applications, ensuring reliable operation in automotive environments.

Technology: CMOS

The use of CMOS technology provides low power consumption, high noise immunity, and wide operating voltage range, making this product efficient and reliable in various applications.

Terminal Form: GULL WING

The gull wing terminal form allows for easy and reliable soldering, ensuring consistent electrical connections and reducing the risk of solder joint failure.

Packing Method: TR

The TR packing method provides tape and reel packaging, offering convenience and ease of handling during manufacturing and assembly processes.

Terminal Pitch: 0.95 mm

The small terminal pitch of 0.95 mm allows for high-density integration and miniaturization of circuit designs, making this product suitable for applications with limited board space.

Control Type: ENABLE LOW

The control type of "enable low" allows for easy and intuitive control logic implementation, simplifying system design and enhancing user experience.

Moisture Sensitivity Level (MSL): 1

The moisture sensitivity level of 1 indicates that this product has a low susceptibility to moisture-related issues during storage or assembly, ensuring consistent performance and longer product lifespan.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this product can handle higher voltage levels, providing versatility and compatibility with various power supply systems.

Technical Specifications

Bus Driver & Transceivers 74AHC1G125GV,125 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE LOW

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

74AHC1G125GV,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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