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74AHC1G125GW

NXP Semiconductors

74AHC1G125GW by NXP Semiconductors

NXP Semiconductors' 74AHC1G125GW is a Bus Driver & Transceiver with 9.5ns Propagation Delay, 5V Nominal Voltage, and 50pF Load Capacitance. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and TRUE Output Polarity.

Median Price

$14.858

Lifecycle Status

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Adafruit Industries

USA . 34 parts In-Stock

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RS (Exports)

UK . 14,580 parts In-Stock

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Bristol Electronics

USA . 4,515 parts In-Stock

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Digiode

USA . 1,439 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Sea View Technologies

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Anansix

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Goldney Electronics S.L.

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Velocity Electronics

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Prism Electronics

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Nova Conductors

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Semicontronic

India . 5,207 parts In-Stock

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Ampacity Inc.

Singapore . 5,273 parts In-Stock

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Andel Nordic

Denmark . 2,498 parts In-Stock

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AZTECH Wire

Italy . 13,480 parts In-Stock

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Corphita

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Advanced Electronics

New Zealand . 34 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,875 parts In-Stock

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Corohmni

South Africa . 896 parts In-Stock

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Metaverse IC Inc.

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Cyclops Electronics Ltd (Excess)

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QUARKTWIN TECHNOLOGY LTD

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UNI Independent Distributors

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Continental Prestige Electronics

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Supply Digital

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Bastille Electronics

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Overview

Upgrade your electronics with the high-quality 74AHC1G125GW by NXP Semiconductors - a reliable bus driver & transceiver that delivers exceptional performance. With a nominal supply voltage of 5V, this product offers fast propagation delay and optimum output characteristics. Perfect for automotive applications, this small outline, thin profile component is designed to enhance your devices' efficiency. Trust NXP Semiconductors for top-of-the-line technology and experience seamless connectivity with the 74AHC1G125GW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, suitable for use in various environments.

Propagation Delay At Nominal Supply: 9.5 ns

Low propagation delay ensures fast and efficient data transmission, ideal for high-speed applications.

Surface Mount: YES

Surface mount design allows for easy and quick installation onto circuit boards, saving time and effort.

Package Shape: RECTANGULAR

Rectangular shape enables easy integration into existing circuit designs, maximizing compatibility.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with common power sources.

Load Capacitance (CL): 50 pF

Handles a moderate load capacitance, ensuring stable performance in various configurations.

Power Supplies (V): 2/5.5

Supports a wide range of power supply voltages, enhancing flexibility in system design.

No. of Terminals: 5

With a sufficient number of terminals, this product offers versatile connectivity options for different applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim package style saves space on the PCB and allows for densely populated designs.

Maximum I (ol): 8 Amp

High output current capability enables driving of multiple loads without the need for external amplifiers.

Propagation Delay (tpd): 14.5 ns

With a short propagation delay, this product ensures minimal signal distortion and accurate data transmission.

Maximum Operating Temperature: 125 °C

Able to withstand high temperatures, suitable for automotive and industrial applications.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, preventing bus contention and maintaining signal integrity.

Minimum Operating Temperature: -40 °C

Performs reliably in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Finish: Tin (Sn)

Tin finish provides a good soldering surface, ensuring secure connections for long-lasting performance.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and facilitates easy connection to other components.

No. of Ports: 2

With multiple ports, this product supports versatile input and output configurations in complex systems.

Maximum Seated Height: 1.1 mm

Low seated height makes it suitable for compact designs with tight constraints on component height.

Width: 1.25 mm

Narrow width allows for efficient use of space on the PCB, enabling compact and streamlined circuit layouts.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and compatibility with standard logic levels.

Minimum Supply Voltage (Vsup): 2 V

Supports operation at low supply voltages, making it energy-efficient and suitable for battery-powered applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a short reflow time, this product simplifies the manufacturing process and reduces production time.

Peak Reflow Temperature °C: 260

Able to withstand high reflow temperatures, ensuring reliable solder joints during assembly.

Length: 2.05 mm

Compact length saves space on the PCB, enabling efficient use of board real estate for other components.

Temperature Grade: AUTOMOTIVE

Designed for automotive use, meets industry standards for reliability and performance in vehicle applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and facilitates automated soldering processes during assembly.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting on the PCB, enabling space-efficient circuit designs.

Control Type: ENABLE LOW

Enable low control type simplifies system integration and allows for easy interfacing with other components.

Maximum Supply Voltage (Vsup): 5.5 V

Supports operation at a high supply voltage, ensuring compatibility with a wide range of power sources.

Technical Specifications

Bus Driver & Transceivers 74AHC1G125GW attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE LOW

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74AHC1G125GW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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