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74AHC1G125GW,165

NXP Semiconductors

74AHC1G125GW,165 by NXP Semiconductors

NXP Semiconductors' 74AHC1G125GW,165 is a CMOS bus driver with 9.5 ns propagation delay and 8 Amp max I (ol). It operates at -40 to 125 °C, suitable for automotive applications requiring fast signal transmission in compact spaces.

Median Price

$17.664

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 2,500 parts In-Stock

1+ parts

$17.664

100+ parts

$16.781

1k+ parts

$16.781

10k+ parts

-

2,500

$17.664

$16.781

$16.781

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,705 parts In-Stock

1+ parts

$16.781

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3,705

$16.781

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Chip Stock

USA . 101,000 parts In-Stock

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101,000

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Vyrian

USA . 8,203 parts In-Stock

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VNN

France . 2,900 parts In-Stock

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2,900

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Anansix

USA . 1,242 parts In-Stock

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1,242

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Nova Conductors

Japan . 1,000 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 461 parts In-Stock

1+ parts

$12.040

100+ parts

-

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$8.427

10k+ parts

$8.427

461

$12.040

-

$8.427

$8.427

Semicontronic

India . 2,101 parts In-Stock

1+ parts

$15.010

100+ parts

$14.635

1k+ parts

$14.560

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2,101

$15.010

$14.635

$14.560

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Corphita

USA . 2,619 parts In-Stock

1+ parts

$15.898

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2,619

$15.898

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AZTECH Wire

Italy . 13,931 parts In-Stock

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$17.660

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13,931

$17.660

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$17.664

100+ parts

$16.781

1k+ parts

$16.781

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2,500

$17.664

$16.781

$16.781

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Aztec Data Supply Inc.

USA . 1,871 parts In-Stock

1+ parts

$17.835

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1,871

$17.835

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Corohmni

South Africa . 277 parts In-Stock

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$18.196

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277

$18.196

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Ampacity Inc.

Singapore . 2,216 parts In-Stock

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$32.680

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2,216

$32.680

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QUARKTWIN TECHNOLOGY LTD

USA . 10,910 parts In-Stock

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UNI Independent Distributors

Spain . 6,910 parts In-Stock

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Continental Prestige Electronics

USA . 5,892 parts In-Stock

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Microchip USA

USA . 4,523 parts In-Stock

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Argo Parts USA

USA . 3,051 parts In-Stock

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Supply Digital

USA . 1,048 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Enhance your electronic designs with the high-quality 74AHC1G125GW,165 by NXP Semiconductors, a leading manufacturer in the industry. This bus driver and transceiver offers reliable performance and versatile applications, making it a valuable addition to any project. With a low propagation delay and 3-state output characteristics, this component delivers efficiency and precision. Trust NXP Semiconductors to provide innovative solutions that meet your needs. Elevate your designs with the 74AHC1G125GW,165 and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in automotive applications.

Propagation Delay At Nominal Supply: 9.5 ns

With a low propagation delay, this product ensures fast and efficient data transmission, suitable for high-speed communication systems.

Surface Mount: YES

The surface mount design allows for easy and convenient installation in compact spaces, making it ideal for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a standard form factor, ensuring compatibility with a wide range of equipment and devices.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage of 5V, the product can operate reliably within standard voltage specifications, ensuring compatibility with most systems.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF helps in reducing signal distortion and improving overall signal integrity, making it suitable for high-frequency applications.

Power Supplies (V): 2/5.5

Supporting power supplies within the range of 2V to 5.5V, this product offers versatility and flexibility in different voltage environments.

No. of Terminals: 5

The 5 terminals allow for easy connectivity and integration with other components, simplifying the installation process.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch design of the package help in saving space and reducing PCB footprint, making it ideal for compact designs.

Maximum I (ol): 8 Amp

With a maximum output current of 8A, the product can drive high-power loads with ease, making it suitable for applications requiring robust performance.

Technical Specifications

Bus Driver & Transceivers 74AHC1G125GW,165 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE LOW

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74AHC1G125GW,165 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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