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SN74LVC1G125DCK

Texas Instruments

SN74LVC1G125DCK by Texas Instruments

SN74LVC1G125DCK by Texas Instruments is a 3-STATE bus driver with 5 terminals, operating at a supply voltage of 1.8V to 3.3V. It features a max output current of 24A, propagation delay of 9ns, and operates in industrial temperature range (-40°C to 85°C). This CMOS technology device is ideal for applications requiring low-power consumption and compact design.

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9

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Vyrian

USA . 8,312 parts In-Stock

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Martec Srl

Italy . 1,810 parts In-Stock

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Digiode

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Nova Conductors

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Bas Electronics GmbH & Co. KG

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LWI Electronics Inc

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Resion

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Mil-Aero Solutions, Inc.

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Andel Nordic

Denmark . 1,355 parts In-Stock

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$2.399

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$2.303

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$2.303

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$8.639

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$8.207

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Semicontronic

India . 442 parts In-Stock

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$11.000

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$10.725

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$10.670

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AZTECH Wire

Italy . 716 parts In-Stock

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Corohmni

South Africa . 40 parts In-Stock

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Parana Technologies

USA . 1,797 parts In-Stock

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 5,213 parts In-Stock

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IDEA Electronic Components Group

UK . 2,244 parts In-Stock

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Ampacity Inc.

Singapore . 1,192 parts In-Stock

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One Stop Electronics

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Continental Prestige Electronics

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Overview

Looking for a reliable Bus Driver & Transceiver for your electronic projects? Look no further than the SN74LVC1G125DCK by Texas Instruments. With a reputation for producing top-notch components, Texas Instruments delivers unmatched quality and performance. This versatile device is ideal for applications requiring precision and efficiency, offering a seamless solution for your circuit design needs. Don't settle for anything less than the best – choose Texas Instruments for unparalleled value and reliability in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and resistant to damage.

Nominal Supply Voltage / Vsup (V): 1.8

Low nominal supply voltage helps in reducing power consumption and heat generation, making the product energy efficient.

Maximum I (ol): 24 Amp

High maximum output current capability ensures reliable performance even under heavy load conditions.

Propagation Delay (tpd): 9 ns

Low propagation delay ensures fast data transmission speed, which is crucial for real-time applications.

Output Characteristics: 3-STATE

3-STATE output allows for multiple drivers to share a single communication line without causing bus contention issues.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environmental conditions, making the product suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the product.

Technical Specifications

Bus Driver & Transceivers SN74LVC1G125DCK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LVC1G125DCK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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