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SN74LVC1G125YZPR

Texas Instruments

SN74LVC1G125YZPR by Texas Instruments

SN74LVC1G125YZPR by Texas Instruments is a 3.3V CMOS bus driver with 4.7ns propagation delay, suitable for industrial applications. It features a 50pF load capacitance, 32A max I (ol), and operates in a temperature range of -40 to 85°C. This rectangular package has surface mount capabilities and enables true output polarity with a low enable control type.

Median Price

$0.196

Lifecycle Status

Suppliers In-Stock

19

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1k+

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Texas Instruments

USA . 2,878,739 parts In-Stock

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$0.198

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Mouser Electronics

USA . 42,337 parts In-Stock

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$0.440

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$0.237

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$0.213

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42,337

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$0.212

DigiKey

USA . 8,894 parts In-Stock

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$0.530

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$0.292

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$0.251

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$0.226

8,894

$0.530

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Arrow

USA . 3,000 parts In-Stock

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$0.195

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Chip1Stop

Japan . 3,000 parts In-Stock

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$0.101

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$0.095

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Verical

USA . 414 parts In-Stock

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Digiode

USA . 4,097 parts In-Stock

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Nova Conductors

Japan . 19 parts In-Stock

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Vyrian

USA . 494,308 parts In-Stock

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Chip Stock

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Bristol Electronics

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A&K Electronics

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Rotakorn

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Semtec, LLC

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SPM Sales

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Holdelec - ElecDif-Pro

France . 1,411 parts In-Stock

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Component Sense

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Connector Distribution Corp

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Right Parts Inc.

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Ampacity Inc.

Singapore . 494,048 parts In-Stock

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$0.104

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Corphita

USA . 354 parts In-Stock

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Semicontronic

India . 494,182 parts In-Stock

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Continental Prestige Electronics

USA . 6,918 parts In-Stock

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$0.279

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Argo Parts USA

USA . 1,299 parts In-Stock

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$0.276

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$19.590

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$18.610

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Parana Technologies

USA . 1,721 parts In-Stock

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$26.395

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Corohmni

South Africa . 173 parts In-Stock

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ChromeModa Solutions

Germany . 2,037 parts In-Stock

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IDEA Electronic Components Group

UK . 1,671 parts In-Stock

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Andel Nordic

Denmark . 2,199 parts In-Stock

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Perfect Parts

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A-Z Elektronik GmbH

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Assy Fe

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DigiPath Technology Company

USA . 1,798 parts In-Stock

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Legend Electronics Inc. (Excess)

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Speed Components Ltd (Excess)

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Netroflash

USA . 100 parts In-Stock

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Overview

Elevate your electronic designs with the SN74LVC1G125YZPR by Texas Instruments, a top-tier bus driver and transceiver that delivers unparalleled quality and reliability. With a trusted manufacturer like Texas Instruments behind it, this product ensures optimal performance and efficiency in various applications. Its compact design, low power consumption, and high-speed propagation delay make it a standout choice for cutting-edge projects. Experience seamless integration and enhanced functionality with this advanced component, providing value and benefits that set your creations apart from the rest. Elevate your designs today with the SN74LVC1G125YZPR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for use in portable and rugged applications.

Propagation Delay At Nominal Supply: 4.7 ns

Low propagation delay ensures fast and efficient signal transmission, making this transceiver suitable for high-speed data communication.

Surface Mount: YES

Surface mount capability allows for easy and compact integration onto PCBs, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard supply voltage of 3.3V makes this transceiver compatible with a wide range of electronic systems and ensures reliable performance.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF helps in maintaining signal integrity and reducing transmission errors in high-frequency communication.

Power Supplies (V): 3.3

Consistent power supply at 3.3V ensures stable operation of the transceiver, preventing voltage fluctuations that could affect performance.

No. of Terminals: 5

Having 5 terminals allows for easy connection and integration of the transceiver into the system, simplifying the installation process.

Maximum I (ol): 32 Amp

The high maximum output current of 32Amp enables the transceiver to drive multiple loads or devices without overheating or voltage drop issues.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40 to 85°C ensures reliable operation in harsh environmental conditions and industrial settings.

Technology: CMOS

Using CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, making this transceiver energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74LVC1G125YZPR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-XBGA-B5

JESD-609 Code:

e1

Length:

1.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA5,2X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.7 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.9 mm

Trade Compliance

SN74LVC1G125YZPR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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