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SN74AVC2T45DCUR

Texas Instruments

SN74AVC2T45DCUR by Texas Instruments

SN74AVC2T45DCUR by Texas Instruments is a bus driver with 2 functions, translating b/w 1.5V and 3.3V. It has a propagation delay of 5.4ns, operates in industrial temperatures (-40 to 85°C), and supports bidirectional communication in small outline packaging for various applications.

Median Price

$0.558

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 920,408 parts In-Stock

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$0.558

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$0.429

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920,408

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Chip1Stop

Japan . 5,087 parts In-Stock

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$0.898

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DigiKey

USA . 9,625 parts In-Stock

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$0.900

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$0.513

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$0.457

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$0.407

9,625

$0.900

$0.513

$0.457

$0.407

Mouser Electronics

USA . 4,943 parts In-Stock

1+ parts

$0.900

100+ parts

$0.513

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$0.458

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$0.411

4,943

$0.900

$0.513

$0.458

$0.411

Verical

USA . 14,484 parts In-Stock

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$0.534

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$0.361

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$0.335

14,484

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Arrow

USA . 12,000 parts In-Stock

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$0.298

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$0.298

RS (Exports)

UK . 2,125 parts In-Stock

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$0.393

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$0.393

Distributors (In-Stock)

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Digiode

USA . 2,402 parts In-Stock

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$0.370

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2,402

$0.370

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Nova Conductors

Japan . 600 parts In-Stock

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$0.415

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$0.415

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TME

Poland . 108 parts In-Stock

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$0.720

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108

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Vyrian

USA . 138,644 parts In-Stock

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Chip Stock

USA . 53,500 parts In-Stock

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Cyclops Electronics Ltd

UK . 10,939 parts In-Stock

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Sensible Micro Corp

USA . 8,845 parts In-Stock

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Pegasus Components GmbH

Germany . 2,944 parts In-Stock

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SPM Sales

USA . 1,048 parts In-Stock

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NAC Semi

USA . 266 parts In-Stock

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$0.350

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Elcom Components

USA . 190 parts In-Stock

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Prism Electronics

USA . 95 parts In-Stock

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Semi Source

USA . 50 parts In-Stock

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Semtec, LLC

USA . 20 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 138,341 parts In-Stock

1+ parts

$0.253

100+ parts

$0.247

1k+ parts

$0.245

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138,341

$0.253

$0.247

$0.245

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Corphita

USA . 969 parts In-Stock

1+ parts

$0.351

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$0.351

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Argo Parts USA

USA . 4,963 parts In-Stock

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$0.415

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$0.403

4,963

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$0.403

Continental Prestige Electronics

USA . 2,140 parts In-Stock

1+ parts

$0.415

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$0.407

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Netroflash

USA . 500 parts In-Stock

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$0.415

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$0.415

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Advanced Electronics

New Zealand . 270 parts In-Stock

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$0.423

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$0.423

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270

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Ampacity Inc.

Singapore . 138,061 parts In-Stock

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$0.550

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Andel Nordic

Denmark . 3,900 parts In-Stock

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$3.606

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$3.461

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Parana Technologies

USA . 1,927 parts In-Stock

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$13.030

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$13.526

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DigiPath Technology Company

USA . 293 parts In-Stock

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$14.348

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IDEA Electronic Components Group

UK . 2,094 parts In-Stock

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$14.641

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$13.909

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$13.177

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ChromeModa Solutions

Germany . 96 parts In-Stock

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$14.641

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$12.006

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Corohmni

South Africa . 12 parts In-Stock

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Perfect Parts

USA . 93,567 parts In-Stock

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Kepictronics

USA . 66,000 parts In-Stock

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Lixinc

USA . 19,401 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,960 parts In-Stock

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S.R.D Solutions

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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iodParts Technologies Inc.

India . 510 parts In-Stock

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Overview

Unlock seamless data transmission with the Texas Instruments SN74AVC2T45DCUR Bus Driver & Transceivers. Crafted with precision and reliability, this product boasts top-notch quality and performance. Ideal for a wide range of applications, this versatile device offers customers exceptional value and benefits. Experience fast propagation delay, low power consumption, and efficient signal translation in a compact and durable package. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the device.

Propagation Delay At Nominal Supply: 5.4 ns

Offers fast signal transmission for efficient data communication.

Surface Mount: YES

Makes installation easy and saves space on the PCB.

No. of Functions: 2

Provides versatility and flexibility in signal processing.

Nominal Supply Voltage / Vsup (V): 1.5

Works efficiently with low power supply voltage.

Output Characteristics: 3-STATE

Allows the device to have high impedance output state for bus sharing applications.

Technology: CMOS

Utilizes low power CMOS technology for energy-efficient operation.

Technical Specifications

Bus Driver & Transceivers SN74AVC2T45DCUR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TWO SEPARATE CONFIGURABLE POWER-SUPPLY RAILS FOR PORT A AND B

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

5.4 ns

Propagation Delay (tpd):

5.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.5/3.3V&1.5/3.3V

Width:

2 mm

Trade Compliance

SN74AVC2T45DCUR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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