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SN74HC573ADW

Texas Instruments

SN74HC573ADW by Texas Instruments

SN74HC573ADW by Texas Instruments is an 8-bit bus driver with a propagation delay of 44ns at 5V. It features a max I (ol) of 7.8A, operates in industrial temperatures (-40 to 85°C), and has a terminal pitch of 1.27mm. Ideal for applications requiring fast data transmission and low power consumption in compact designs.

Median Price

$0.441

Lifecycle Status

Suppliers In-Stock

46

In-Stock Inventory

1k+

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RS (Exports)

UK . 1,400 parts In-Stock

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$0.441

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Nova Conductors

Japan . 65 parts In-Stock

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USA . 214 parts In-Stock

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Forefront Electronics and Design

USA . 5 parts In-Stock

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Component Electronics Inc.

Canada . 149 parts In-Stock

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Famous Connections Ltd

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Semicontronic

India . 1,300 parts In-Stock

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$0.375

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$0.366

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$0.364

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Ampacity Inc.

Singapore . 991 parts In-Stock

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$0.375

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Argo Parts USA

USA . 4,268 parts In-Stock

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$0.416

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$0.403

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Continental Prestige Electronics

USA . 1,184 parts In-Stock

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$0.416

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$0.407

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Bastille Electronics

Australia . 97 parts In-Stock

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$0.416

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$0.395

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$0.375

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$0.370

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Corohmni

South Africa . 63 parts In-Stock

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$9.078

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Andel Nordic

Denmark . 2,767 parts In-Stock

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$9.802

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Parana Technologies

USA . 602 parts In-Stock

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$14.406

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$14.847

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AZTECH Wire

Italy . 699 parts In-Stock

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DigiPath Technology Company

USA . 2,063 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$15.980

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$14.542

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$13.104

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$15.980

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ChromeModa Solutions

Germany . 743 parts In-Stock

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$16.186

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$13.273

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$16.186

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IDEA Electronic Components Group

UK . 240 parts In-Stock

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$16.186

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$15.377

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$14.567

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Perfect Parts

USA . 37,063 parts In-Stock

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USA . 1,950 parts In-Stock

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Overview

Experience unmatched quality and reliability with the SN74HC573ADW from Texas Instruments, a leading manufacturer in the industry. This bus driver & transceiver offers seamless integration and exceptional performance for a wide range of applications. With a nominal supply voltage of 5V and 8 bits, this product ensures efficient data transmission with a fast propagation delay of 44ns. Benefit from the convenience of surface mount technology and a compact rectangular package style. Trust in Texas Instruments to deliver cutting-edge solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Lightweight and durable material choice for long-lasting performance.

Propagation Delay At Nominal Supply:

44 ns - Fast propagation delay ensures efficient signal transmission.

Surface Mount:

YES - Easy to install and suitable for compact electronic designs.

Package Shape:

RECTANGULAR - Space-saving design for efficient PCB layout.

No. of Bits:

8 - Ideal for handling various data transmissions and commands.

Nominal Supply Voltage / Vsup (V):

5 - Compatible with standard voltage requirements for easy integration.

Load Capacitance (CL):

150 pF - Supports a range of capacitive loads for versatility in applications.

Power Supplies (V):

2/6 - Flexible power input options for adaptability in different environments.

No. of Terminals:

20 - Sufficient terminals for connection versatility in complex systems.

Package Style (Meter):

SMALL OUTLINE - Compact package size for efficient use of board space.

Maximum I (ol):

7.8 Amp - High output current capability for driving bus lines effectively.

Propagation Delay (tpd):

285 ns - Reliable signal propagation within a specified time frame.

Maximum Operating Temperature:

85 °C - Suitable for use in a wide range of operating conditions.

Output Characteristics:

3-STATE - Allows for tri-state output operation for flexibility in system control.

Minimum Operating Temperature:

40 °C - Performs reliably in low-temperature environments.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - Corrosion-resistant finish for long-term reliability.

Terminal Position:

DUAL - Dual terminal position for increased connection options.

No. of Ports:

2 - Multiple ports for versatile connectivity in complex setups.

Maximum Seated Height:

2.65 mm - Low-profile design for space-constrained applications.

Width:

7.5 mm - Slim width for fitting into tight spaces on a PCB.

Output Polarity:

TRUE - True output polarity for accurate signal transmission.

Minimum Supply Voltage (Vsup):

2 V - Low minimum supply voltage for energy-efficient operation.

Peak Reflow Temperature °C:

260 - Withstands high reflow temperatures for robust assembly processes.

Length:

12.8 mm - Compact length for efficient placement on the circuit board.

Temperature Grade:

INDUSTRIAL - Suitable for industrial environments with varying temperature conditions.

Technology:

CMOS - CMOS technology offers low power consumption and high noise immunity.

Terminal Form:

GULL WING - Gull wing terminals for secure solder connections.

Packing Method:

TUBE - Convenient tube packaging for easy handling and storage.

Terminal Pitch:

1.27 mm - Standard terminal pitch for compatibility with various PCB layouts.

Maximum Supply Voltage (Vsup):

6 V - Safe maximum supply voltage to prevent overloading.

Maximum Power Supply Current (ICC):

0.08 mA - Low power consumption for energy-efficient operation.

Technical Specifications

Bus Driver & Transceivers SN74HC573ADW attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 373

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

7.8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

44 ns

Propagation Delay (tpd):

285 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74HC573ADW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-399-5371, 5962013995371

NIIN

013995371

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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