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SN74HC541NSRE4

Texas Instruments

SN74HC541NSRE4 by Texas Instruments

SN74HC541NSRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 29ns at 5V. It features a 3-STATE output and operates in industrial temperature range (-40 to 85°C). Ideal for applications requiring fast signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,541 parts In-Stock

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6,541

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Digiode

USA . 917 parts In-Stock

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917

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Andel Nordic

Denmark . 1,259 parts In-Stock

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$3.989

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-

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$3.829

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$3.829

1,259

$3.989

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$3.829

$3.829

Parana Technologies

USA . 124 parts In-Stock

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$14.894

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-

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$15.321

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124

$14.894

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$15.321

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DigiPath Technology Company

USA . 1,938 parts In-Stock

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$16.400

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$16.400

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ChromeModa Solutions

Germany . 1,872 parts In-Stock

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$16.735

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$13.723

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$16.735

$13.723

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IDEA Electronic Components Group

UK . 1,394 parts In-Stock

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$16.735

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$15.898

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$15.062

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1,394

$16.735

$15.898

$15.062

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AZTECH Wire

Italy . 896 parts In-Stock

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$18.610

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$18.610

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Semicontronic

India . 378 parts In-Stock

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$19.000

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$18.525

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$18.430

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378

$19.000

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$18.430

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Corohmni

South Africa . 52 parts In-Stock

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$22.185

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One Stop Electronics

USA . 1,280 parts In-Stock

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$59.000

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$59.000

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Ampacity Inc.

Singapore . 1,228 parts In-Stock

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$63.000

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Continental Prestige Electronics

USA . 2,484 parts In-Stock

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Corphita

USA . 1,128 parts In-Stock

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Bastille Electronics

Australia . 550 parts In-Stock

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550

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Argo Parts USA

USA . 300 parts In-Stock

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300

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Robosynatics

Brazil . 250 parts In-Stock

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250

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Lucentia Tech

USA . 250 parts In-Stock

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250

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Overview

Elevate your electronic projects with the SN74HC541NSRE4 by Texas Instruments, a top-quality bus driver & transceiver that delivers unmatched performance and reliability. Crafted by a leading manufacturer in the industry, this versatile component is perfect for a wide range of applications. With its fast propagation delay, low power consumption, and durable construction, this product offers exceptional value and benefits to customers seeking superior connectivity solutions. Upgrade your designs and experience seamless operation with the SN74HC541NSRE4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product resistant to damage and easy to handle.

Propagation Delay At Nominal Supply: 29 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount design makes installation easy and efficient, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common nominal voltage, making it compatible with standard power sources.

Power Supplies (V): 2/6

Wide range of power supply options allows flexibility in different operating environments.

No. of Terminals: 20

Sufficient number of terminals for connections, enabling versatile usage scenarios.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliability in various environmental conditions.

Width: 5.3 mm

Compact width saves space and allows for efficient use of PCB real estate in crowded electronic assemblies.

Output Polarity: TRUE

Correct output polarity ensures signal integrity and compatibility with other components in the system.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and signal reliability.

Technical Specifications

Bus Driver & Transceivers SN74HC541NSRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

29 ns

Propagation Delay (tpd):

206 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

SN74HC541NSRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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