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74LVC1G125GW/DG,12

NXP Semiconductors

74LVC1G125GW/DG,12 by NXP Semiconductors

NXP Semiconductors' 74LVC1G125GW/DG,12 is a CMOS bus driver with 10.5 ns propagation delay and 3-STATE output. Operating b/w -40 to 125 °C, it has a supply voltage range of 1.65V to 5.5V, making it ideal for automotive applications requiring fast signal transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,796 parts In-Stock

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VNN

France . 5,749 parts In-Stock

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Anansix

USA . 2,001 parts In-Stock

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Digiode

USA . 1,133 parts In-Stock

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Nova Conductors

Japan . 60 parts In-Stock

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Andel Nordic

Denmark . 4,057 parts In-Stock

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$7.453

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$7.155

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One Stop Electronics

USA . 941 parts In-Stock

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$13.000

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AZTECH Wire

Italy . 832 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,670 parts In-Stock

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Ampacity Inc.

Singapore . 1,385 parts In-Stock

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Corohmni

South Africa . 141 parts In-Stock

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Semicontronic

India . 186 parts In-Stock

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$26.325

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Microchip USA

USA . 402 parts In-Stock

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Argo Parts USA

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UNI Independent Distributors

Spain . 3,506 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Bastille Electronics

Australia . 120 parts In-Stock

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Perfect Parts

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Overview

Unlock seamless communication and unparalleled reliability with the 74LVC1G125GW/DG,12 from NXP Semiconductors. As a leader in the industry, NXP ensures top-notch quality and cutting-edge technology in every product. Ideal for bus drivers & transceivers, this compact device boasts a wide range of applications, making it a versatile solution for your electronic projects. Experience swift signal transmission, low power consumption, and effortless integration with this high-performing component. Upgrade your designs today with the 74LVC1G125GW/DG,12 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and excellent protection for the components inside, making it a reliable choice for automotive applications.

Surface Mount: YES

The surface mount design allows for easy installation and integration into circuit boards, making the product user-friendly for assembly processes.

Package Shape: RECTANGULAR

The rectangular shape saves space and allows for efficient placement within a system, making it ideal for compact designs.

Nominal Supply Voltage (Vsup): 1.8V

The low supply voltage requirement enables energy efficiency and reduces power consumption, making it suitable for battery-powered devices.

No. of Terminals: 5

The ample number of terminals allows for versatile connectivity options, enabling the product to interface with multiple components efficiently.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The slim and compact design of the package style saves space and enhances portability, making it suitable for space-constrained applications.

Propagation Delay (tpd): 10.5 ns

The fast propagation delay ensures quick signal transmission, improving overall system performance and responsiveness.

Maximum Operating Temperature: 125 °C

The high operating temperature range allows the product to withstand harsh environmental conditions, making it suitable for automotive and industrial settings.

Output Characteristics: 3-STATE

The 3-state output characteristics provide flexibility in signal control and management, enhancing the versatility of the product in various applications.

Minimum Operating Temperature: -40 °C

The low operating temperature range ensures reliable functionality even in extreme cold environments, making it a robust choice for diverse applications.

Technical Specifications

Bus Driver & Transceivers 74LVC1G125GW/DG,12 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74LVC1G125GW/DG,12 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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