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SN74LVC573ADW

Texas Instruments

SN74LVC573ADW by Texas Instruments

SN74LVC573ADW by Texas Instruments is an 8-bit bus driver with a propagation delay of 6.9 ns at 3.3V, suitable for automotive applications. It features a 3-STATE output and operates within a temperature range of -40 to 125°C, making it ideal for various electronic systems requiring fast signal transmission. With a small outline package style and surface mount capability, this CMOS technology device offers efficient performance in compact designs.

Median Price

$0.960

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 759 parts In-Stock

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$0.644

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$0.582

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759

$0.644

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Chip1Stop

Japan . 1,004 parts In-Stock

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$0.898

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$0.567

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Mouser Electronics

USA . 1,701 parts In-Stock

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$1.070

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$0.693

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$0.629

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Texas Instruments

USA . 39,288 parts In-Stock

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Element14

Singapore . 19 parts In-Stock

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$1.300

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$0.863

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$0.792

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$0.760

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Farnell

UK . 28 parts In-Stock

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$3.470

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$2.075

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$1.767

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Rochester

USA . 36,679 parts In-Stock

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$0.766

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$0.635

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$0.567

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$0.567

DigiKey

USA . 36,679 parts In-Stock

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$0.960

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Verical

USA . 20,900 parts In-Stock

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Distributors (In-Stock)

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Nova Conductors

Japan . 200 parts In-Stock

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Digiode

USA . 2,992 parts In-Stock

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DigiKey Marketplace

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Vyrian

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Prism Electronics

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EMSNET

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Connector Distribution Corp

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Right Parts Inc.

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Bristol Electronics

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Atlantic Semiconductor

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TME

Poland . 100 parts In-Stock

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Elcom Components

USA . 99 parts In-Stock

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Speed Components Ltd

Israel . 89 parts In-Stock

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Flex Direct, LLC

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Pegasus Components GmbH

Germany . 40 parts In-Stock

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NAC Semi

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ComSIT Distribution GmbH

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LWI Electronics Inc

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LittleDiode

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Distributors (Availability)

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Ampacity Inc.

Singapore . 11,443 parts In-Stock

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$0.446

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Semicontronic

India . 11,284 parts In-Stock

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$0.435

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Corphita

USA . 350 parts In-Stock

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$0.563

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Argo Parts USA

USA . 2,897 parts In-Stock

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Advanced Electronics

New Zealand . 450 parts In-Stock

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Continental Prestige Electronics

USA . 78 parts In-Stock

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$1.980

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$1.290

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$1.110

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Andel Nordic

Denmark . 457 parts In-Stock

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$6.553

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$6.291

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Corohmni

South Africa . 278 parts In-Stock

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$17.344

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Parana Technologies

USA . 2,307 parts In-Stock

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DigiPath Technology Company

USA . 1,537 parts In-Stock

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$19.166

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ChromeModa Solutions

Germany . 4,394 parts In-Stock

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$19.557

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$16.037

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IDEA Electronic Components Group

UK . 151 parts In-Stock

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$19.557

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$18.579

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$17.601

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Perfect Parts

USA . 19,510 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$0.572

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$0.554

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$0.543

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Assy Fe

Spain . 19 parts In-Stock

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Overview

Enhance the performance of your electronic designs with the Texas Instruments SN74LVC573ADW, a high-quality bus driver and transceiver. Designed with precision and reliability in mind, Texas Instruments ensures that this product meets the highest standards in the industry. Ideal for a wide range of applications, this product offers seamless integration, fast propagation delays, and low power consumption. Experience the value and benefits of choosing Texas Instruments for your electronic components needs, and unlock a world of possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 6.9 ns

Fast propagation delay allows for quick signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Easy and convenient installation on PCBs, saving time and effort during assembly.

No. of Bits: 8

Ideal for applications requiring 8-bit data transmission, providing sufficient data handling capability.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage, making it compatible with various systems and components.

Output Characteristics: 3-STATE

Allows for tri-state output, providing flexibility in controlling the signal output and reducing power consumption.

Technical Specifications

Bus Driver & Transceivers SN74LVC573ADW attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 373

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6.9 ns

Propagation Delay (tpd):

22.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74LVC573ADW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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