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USB1T11AMX

Onsemi

USB1T11AMX by Onsemi

The Onsemi USB1T11AMX is a 14-terminal bus driver/transceiver with a 3.3V nominal voltage and 300ns propagation delay. It operates in industrial temperature grades, featuring a small outline package for surface mount applications. Ideal for systems requiring true output polarity and 3-state output characteristics.

Median Price

$0.970

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 477 parts In-Stock

1+ parts

$0.798

100+ parts

$0.693

1k+ parts

$0.627

10k+ parts

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477

$0.798

$0.693

$0.627

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Chip1Stop

Japan . 1,137 parts In-Stock

1+ parts

$1.150

100+ parts

$0.848

1k+ parts

$0.640

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1,137

$1.150

$0.848

$0.640

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Adafruit Industries

USA . 500 parts In-Stock

1+ parts

$25.854

100+ parts

$23.527

1k+ parts

$21.200

10k+ parts

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500

$25.854

$23.527

$21.200

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Rochester

USA . 31,407 parts In-Stock

1+ parts

-

100+ parts

$0.848

1k+ parts

$0.704

10k+ parts

$0.628

31,407

-

$0.848

$0.704

$0.628

DigiKey

USA . 28,907 parts In-Stock

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$1.060

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$1.060

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Verical

USA . 21,620 parts In-Stock

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$0.880

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$0.785

21,620

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$0.880

$0.785

Flip Electronics (Authorized)

USA . 397 parts In-Stock

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397

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Distributors (In-Stock)

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Digiode

USA . 1,958 parts In-Stock

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$0.661

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$0.661

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Vyrian

USA . 2,206 parts In-Stock

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$0.696

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2,206

$0.696

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Bristol Electronics

USA . 1,347 parts In-Stock

1+ parts

$1.857

100+ parts

$1.151

1k+ parts

$0.696

10k+ parts

$0.613

1,347

$1.857

$1.151

$0.696

$0.613

Flip Electronics

USA . 35,397 parts In-Stock

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Electronics Depot

USA . 3,097 parts In-Stock

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3,097

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Netsource Technology, Inc.

USA . 2,168 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,347 parts In-Stock

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1,347

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Dan-Mar Components

USA . 1,347 parts In-Stock

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Inventory MP

USA . 1,180 parts In-Stock

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1,180

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Mil-Aero Solutions, Inc.

USA . 644 parts In-Stock

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644

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SPM Sales

USA . 500 parts In-Stock

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500

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ComSIT Distribution GmbH

Germany . 440 parts In-Stock

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440

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Prism Electronics

USA . 21 parts In-Stock

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21

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LWI Electronics Inc

India . 1 parts In-Stock

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1

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Distributors (Availability)

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Corphita

USA . 2,525 parts In-Stock

1+ parts

$0.626

100+ parts

-

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2,525

$0.626

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Corohmni

South Africa . 382 parts In-Stock

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$0.696

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382

$0.696

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Vigor

Singapore . 33,000 parts In-Stock

1+ parts

$1.030

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33,000

$1.030

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$25.854

100+ parts

$23.527

1k+ parts

$21.200

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500

$25.854

$23.527

$21.200

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Continental Prestige Electronics

USA . 40,000 parts In-Stock

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$0.560

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Metaverse IC Inc.

Canada . 25,272 parts In-Stock

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Perfect Parts

USA . 24,789 parts In-Stock

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Lixinc

USA . 14,999 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,138 parts In-Stock

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Kepictronics

USA . 9,000 parts In-Stock

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Problanco Electronics

Mexico . 8,032 parts In-Stock

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TANS Electronics

Latvia . 6,531 parts In-Stock

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Kulean Microsystems

USA . 5,123 parts In-Stock

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SupplyDigital Components

Austria . 1,092 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 676 parts In-Stock

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S.R.D Solutions

India . 500 parts In-Stock

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500

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Supply Digital

USA . 458 parts In-Stock

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Microchip USA

USA . 126 parts In-Stock

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Overview

Upgrade your connectivity with the USB1T11AMX by Onsemi, a high-quality bus driver & transceiver that offers reliable performance and seamless data transmission. Manufactured by Onsemi, a trusted name in the industry, this product is designed for applications requiring precision and efficiency. With its compact package shape and durable material, this USB transceiver provides value, benefits, and advantages to customers looking for a dependable solution. Experience enhanced connectivity and seamless communication with the USB1T11AMX.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for internal components, making the product long-lasting and reliable.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage, ensuring compatibility with a wide range of systems.

Propagation Delay (tpd): 300 ns

Delivers fast signal processing, enhancing efficiency and performance of the bus driver & transceivers.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ideal for industrial environments where heat may be a concern.

Output Characteristics: 3-STATE

Allows for high flexibility in output control, enabling multiple devices to share a communication line effectively.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely cold conditions, suitable for a variety of operating environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Ensures good conductivity and corrosion resistance, maintaining signal integrity over time.

Maximum Seated Height: 1.75 mm

Compact and low-profile design saves space, especially in applications with limited installation space.

Width: 3.9 mm

Narrow width allows for efficient use of board space, accommodating densely populated electronic circuits.

Output Polarity: TRUE

Provides clear and definite output states, facilitating easy interpretation of signal levels.

Minimum Supply Voltage (Vsup): 3 V

Supports operation at low voltage levels, conserving power and extending battery life in portable devices.

Peak Reflow Temperature °C: 260

Can endure high reflow temperatures during manufacturing processes, ensuring robust solder connections.

Temperature Grade: INDUSTRIAL

Designed for industrial use, meeting stringent requirements for reliability and performance in harsh conditions.

Terminal Form: GULL WING

Facilitates easy and secure soldering to the PCB, contributing to a reliable electrical connection.

Maximum Supply Voltage (Vsup): 3.6 V

Allows for a slightly higher voltage operation, giving flexibility in power supply options for the product.

Technical Specifications

Bus Driver & Transceivers USB1T11AMX attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

USB

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.6235 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

USB1T11AMX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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