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74HC573DB

NXP Semiconductors

74HC573DB by NXP Semiconductors

74HC573DB by NXP Semiconductors is an 8-bit bus driver with a propagation delay of 45ns. It operates at a nominal voltage of 5V and has a load capacitance of 50pF. This CMOS technology device is ideal for automotive applications due to its wide temperature range and output characteristics in a small outline package.

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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Component Electronics Inc.

Canada . 54 parts In-Stock

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$1.000

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$0.750

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$0.650

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54

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Chip Stock

USA . 54,000 parts In-Stock

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Vyrian

USA . 7,875 parts In-Stock

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VNN

France . 4,695 parts In-Stock

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Digiode

USA . 3,573 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,719 parts In-Stock

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Anansix

USA . 596 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Bristol Electronics

USA . 100 parts In-Stock

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100

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Prism Electronics

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Distributors (Availability)

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Andel Nordic

Denmark . 432 parts In-Stock

1+ parts

$4.517

100+ parts

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$4.336

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$4.336

432

$4.517

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$4.336

Ampacity Inc.

Singapore . 1,193 parts In-Stock

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$5.000

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AZTECH Wire

Italy . 12,936 parts In-Stock

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$8.681

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Semicontronic

India . 182 parts In-Stock

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$17.000

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$16.575

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$16.490

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$17.000

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Aztec Data Supply Inc.

USA . 2,597 parts In-Stock

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$24.760

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$27.061

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$25.708

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$25.708

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Corohmni

South Africa . 236 parts In-Stock

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$30.396

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One Stop Electronics

USA . 131 parts In-Stock

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$58.000

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Continental Prestige Electronics

USA . 4,816 parts In-Stock

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UNI Independent Distributors

Spain . 4,217 parts In-Stock

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Lixinc

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Corphita

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Argo Parts USA

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Glotronic Ltd.

UK . 1,970 parts In-Stock

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Supply Digital

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Kepictronics

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Bastille Electronics

Australia . 500 parts In-Stock

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Assy Fe

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

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Perfect Parts

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Overview

Unlock seamless communication and data transfer with the 74HC573DB by NXP Semiconductors. As a top-tier manufacturer in the industry, NXP delivers unparalleled quality and reliability in their Bus Driver & Transceivers category. Ideal for automotive applications, this product offers a fast propagation delay of 45 ns and robust 3-STATE output characteristics. With a compact design and wide temperature range, the 74HC573DB provides exceptional value and performance for your electronic projects. Elevate your designs with NXP's cutting-edge technology and trust in the superior capabilities of the 74HC573DB.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Durable and lightweight material ideal for automotive applications.

Propagation Delay at Nominal Supply:

45 ns - Fast signal transmission for efficient data communication.

Surface Mount:

YES - Easy to integrate into circuit boards for streamlined assembly process.

Package Shape:

RECTANGULAR - Compact design saves space in electronic equipment.

No. of Bits:

8 - Provides sufficient data transfer capacity for various applications.

Nominal Supply Voltage:

5V - Standard voltage level compatible with many devices.

Load Capacitance:

50 pF - Helps in stabilizing the signal output for reliable performance.

Power Supplies:

2/6 V - Versatile voltage options for flexibility in different operating conditions.

No. of Terminals:

20 - Sufficient connections for interfacing with other components.

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH - Streamlined design for efficient PCB layout.

Maximum I (ol):

6 Amp - Capable of driving high loads for versatile applications.

Propagation Delay (tpd):

225 ns - Low latency ensures quick data transmission.

Maximum Operating Temperature:

125 °C - Suitable for automotive environments with high temperature fluctuations.

Output Characteristics:

3-STATE - Allows for flexible output control options.

Minimum Operating Temperature:

40 °C - Ensures reliable operation in cold conditions.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - Corrosion-resistant finish for long-term reliability.

Terminal Position:

DUAL - Offers multiple connection options for circuit design flexibility.

No. of Ports:

2 - Sufficient ports for interfacing with external components.

Maximum Seated Height:

2 mm - Low profile design for compact electronic devices.

Width:

5.3 mm - Slim form factor suitable for space-constrained applications.

Output Polarity:

TRUE - Ensures accurate signal polarity for proper data transmission.

Minimum Supply Voltage:

2 V - Low voltage operation for energy-efficient performance.

Maximum Time at Peak Reflow Temperature:

30 s - Resistant to high temperature soldering processes for reliable assembly.

Peak Reflow Temperature:

260 C - Withstands high temperature reflow soldering for robust construction.

Length:

7.2 mm - Compact size for space-saving integration.

Temperature Grade:

AUTOMOTIVE - Designed to withstand harsh automotive operating conditions.

Technology:

CMOS - Low power consumption and high noise immunity for efficient operation.

Terminal Form:

GULL WING - Secure terminal design for reliable connections.

Packing Method:

TUBE - Convenient packaging for easy handling and storage.

Terminal Pitch:

0.65 mm - Fine pitch spacing for high-density PCB layouts.

Maximum Supply Voltage:

6 V - Suitable for applications requiring higher voltage levels.

Technical Specifications

Bus Driver & Transceivers 74HC573DB attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

BROADSIDE VERSION OF 373

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

74HC573DB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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