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SN74LVC1G126DCKT

Texas Instruments

SN74LVC1G126DCKT by Texas Instruments

SN74LVC1G126DCKT by Texas Instruments is a 3.3V bus driver with 4.5ns propagation delay, suitable for automotive applications. It features a small outline package, 32A max I (ol), and operates in the temperature range of -40 to 125°C. This CMOS technology device has dual terminals and supports unidirectional count direction with true output polarity.

Median Price

$0.761

Lifecycle Status

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26

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1k+

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Rochester

USA . 435 parts In-Stock

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$0.394

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$0.370

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$0.335

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Chip1Stop

Japan . 214 parts In-Stock

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$0.641

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Arrow

USA . 84 parts In-Stock

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$0.761

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Texas Instruments

USA . 1,622,385 parts In-Stock

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$0.775

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DigiKey

USA . 6,531 parts In-Stock

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$0.840

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$0.475

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$0.415

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6,531

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Mouser Electronics

USA . 1,317 parts In-Stock

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$0.840

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$0.476

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$0.398

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1,317

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Verical

USA . 84 parts In-Stock

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Digiode

USA . 4,297 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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TME

Poland . 880 parts In-Stock

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Chip Stock

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Vyrian

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Component Sense

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Martec Srl

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Netsource Technology, Inc.

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Connector Distribution Corp

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Right Parts Inc.

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Velocity Electronics

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Bristol Electronics

USA . 322 parts In-Stock

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Classic Components Corporation

USA . 250 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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ComSIT Distribution GmbH

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Prism Electronics

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NAC Semi

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LittleDiode

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Distributors (Availability)

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Ampacity Inc.

Singapore . 233,818 parts In-Stock

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$0.294

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Semicontronic

India . 233,403 parts In-Stock

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Corphita

USA . 2,599 parts In-Stock

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Continental Prestige Electronics

USA . 5,781 parts In-Stock

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Argo Parts USA

USA . 1,367 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Microchip USA

USA . 9,209 parts In-Stock

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Parana Technologies

USA . 366 parts In-Stock

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$13.689

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DigiPath Technology Company

USA . 929 parts In-Stock

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$15.073

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$13.868

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ChromeModa Solutions

Germany . 2,764 parts In-Stock

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$15.381

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$12.612

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IDEA Electronic Components Group

UK . 1,321 parts In-Stock

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Corohmni

South Africa . 1,041 parts In-Stock

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Advanced Electronics

New Zealand . 450 parts In-Stock

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Andel Nordic

Denmark . 2,410 parts In-Stock

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Perfect Parts

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Lucentia Tech

USA . 500 parts In-Stock

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GreenTree Electronics

Israel . 234 parts In-Stock

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Overview

Enhance your electronic designs with the SN74LVC1G126DCKT by Texas Instruments. This high-quality bus driver offers fast propagation delay and 3-state output characteristics, perfect for applications in automotive technology and beyond. With a nominal supply voltage of 3.3V and compact package style, this product provides excellent value and performance. Trust Texas Instruments for reliable solutions that deliver superior results in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability, making this product suitable for various applications.

Propagation Delay At Nominal Supply: 4.5 ns

Low propagation delay allows for fast data transmission, making this product efficient in bus driver applications.

Surface Mount: YES

Surface mount capability enables easy and convenient assembly onto circuit boards, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 3.3

Nominal supply voltage of 3.3V is commonly used in many electronic systems, ensuring compatibility with existing setups.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance state, enabling bus driver to float the bus when necessary, enhancing flexibility in signal management.

Technical Specifications

Bus Driver & Transceivers SN74LVC1G126DCKT attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LVC1G126DCKT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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