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74ALVC164245DL,118

NXP Semiconductors

74ALVC164245DL,118 by NXP Semiconductors

NXP Semiconductors' 74ALVC164245DL,118 is a Bus Driver & Transceiver with 8-bit capacity. It operates at 2.7V and supports translation b/w 3V & 5V systems. With a propagation delay of 7.5 ns, it's ideal for automotive applications requiring bidirectional control in small outline packages.

Median Price

$0.839

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 1,000 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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$0.839

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$0.839

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Chip Stock

USA . 117,000 parts In-Stock

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Vyrian

USA . 6,609 parts In-Stock

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VNN

France . 3,460 parts In-Stock

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Anansix

USA . 1,389 parts In-Stock

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Digiode

USA . 724 parts In-Stock

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J2 Sourcing AB

Sweden . 25 parts In-Stock

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Inventory MP

USA . 13 parts In-Stock

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Martec Srl

Italy . 13 parts In-Stock

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Bristol Electronics

USA . 13 parts In-Stock

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Prism Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,224 parts In-Stock

1+ parts

$0.839

100+ parts

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$0.822

4,224

$0.839

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$0.822

Argo Parts USA

USA . 3,998 parts In-Stock

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$0.839

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Netroflash

USA . 50 parts In-Stock

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$0.839

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50

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AZTECH Wire

Italy . 12,251 parts In-Stock

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$0.840

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$0.840

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Andel Nordic

Denmark . 1,256 parts In-Stock

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$3.484

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$3.345

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$3.345

1,256

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$3.345

Ampacity Inc.

Singapore . 239 parts In-Stock

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$8.000

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$8.000

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Aztec Data Supply Inc.

USA . 2,780 parts In-Stock

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$11.090

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$11.090

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Semicontronic

India . 2,620 parts In-Stock

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$14.000

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$13.650

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$13.580

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$14.000

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Advanced Electronics

New Zealand . 276 parts In-Stock

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$20.609

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$19.579

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$19.579

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276

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Corohmni

South Africa . 1,572 parts In-Stock

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$24.375

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One Stop Electronics

USA . 1,103 parts In-Stock

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$45.000

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Perfect Parts

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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UNI Independent Distributors

Spain . 2,267 parts In-Stock

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Corphita

USA . 1,639 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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Supply Digital

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Microchip USA

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Overview

Elevate your circuit design with the 74ALVC164245DL,118 by NXP Semiconductors. Known for their superior quality and expertise in semiconductor technology, NXP delivers reliable Bus Drivers & Transceivers that ensure seamless data transmission between devices. This versatile component offers translation between 3V & 5V, making it ideal for a variety of applications. With a compact package style and maximum operating temperature of 125°C, this product provides unmatched value, efficiency, and performance for your projects. Take your designs to the next level with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver and transceiver, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 7.5 ns

This low propagation delay ensures fast signal transmission, making the product suitable for high-speed bus communication.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in one component increases efficiency and saves space in the overall design of the system.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easier to integrate into standard PCB layouts, optimizing space usage.

No. of Bits: 8

An 8-bit interface allows for a wide range of data transmission options, suitable for various communication protocols.

Translation: 3V & 5V

Supporting multiple voltage translations makes this product versatile and compatible with different types of systems.

Nominal Supply Voltage / Vsup (V): 2.7

The specific nominal supply voltage ensures stable and reliable operation of the bus driver and transceiver.

Load Capacitance (CL): 50 pF

The specified load capacitance allows for efficient signal transmission without causing excessive power consumption.

Power Supplies (V): 3.3,5

The product supports a range of power supplies, offering flexibility in different system configurations.

No. of Terminals: 48

Having a higher number of terminals allows for more connectivity options and functionality in the system.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design of the package saves space on the PCB and allows for denser component placement.

Maximum I (ol): 24 Amp

The high maximum output current capability enables the product to drive larger loads without overheating or performance degradation.

Propagation Delay (tpd): 9.5 ns

This propagation delay value ensures fast signal transmission and reduces latency in the communication process.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range allows the product to withstand harsh environmental conditions and maintain reliable performance.

Output Characteristics: 3-STATE

The 3-state output characteristic enables the bus driver and transceiver to easily control bus lines, providing efficient signal management.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures the product can operate in extreme cold environments without performance issues.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of high-quality terminal finish materials ensures reliable electrical connections and corrosion resistance for long-term use.

Terminal Position: DUAL

Dual terminal positions provide redundancy and improve signal transmission reliability in case one terminal fails.

No. of Ports: 2

Having multiple ports allows for simultaneous data transmission on different channels, increasing the efficiency of the communication system.

Maximum Seated Height: 2.8 mm

The low maximum seated height of the product saves space on the PCB and allows for compact system designs.

Width: 7.5 mm

The specified width dimension makes the product suitable for integration into standard PCB layouts and system configurations.

Output Polarity: TRUE

Having true output polarity ensures accurate signal transmission and compatibility with various digital systems.

Minimum Supply Voltage (Vsup): 1.5 V

Supporting a low minimum supply voltage allows for energy-efficient operation and compatibility with low-power systems.

Maximum Time At Peak Reflow Temperature (s): 30

The specified maximum time at peak reflow temperature ensures proper soldering and component reliability during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance makes the product suitable for lead-free soldering processes and ensures robust mechanical connections.

Length: 15.875 mm

The specified length dimension enables easy integration into standard PCB sizes and optimizes space utilization in the system design.

Temperature Grade: AUTOMOTIVE

Being automotive-grade, the product meets high reliability and performance standards required for automotive applications and harsh operating conditions.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high noise immunity, and compatibility with various digital systems.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering onto the PCB, ensuring secure electrical connections and mechanical stability.

Packing Method: TR

The TR packing method provides efficient handling, storage, and distribution of the product, reducing the risk of damage during transportation.

Terminal Pitch: 0.635 mm

Having a small terminal pitch allows for high-density mounting on the PCB and enables compact system designs with efficient signal routing.

Count Direction: BIDIRECTIONAL

Supporting bidirectional signal transmission allows for versatile communication options in both directions, enhancing system flexibility.

Control Type: COMMON CONTROL

Having a common control type simplifies the overall system design and operation, making the product easy to integrate and control.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a high maximum supply voltage ensures compatibility with a wide range of power sources and operating conditions, making the product versatile and reliable.

Technical Specifications

Bus Driver & Transceivers 74ALVC164245DL,118 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

PORT A IS OPERATED AT VOLTAGE 1.5-3.6V

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.8 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

3V & 5V

Width:

7.5 mm

Trade Compliance

74ALVC164245DL,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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