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74ALVC164245DL,112

NXP Semiconductors

74ALVC164245DL,112 by NXP Semiconductors

The NXP Semiconductors 74ALVC164245DL,112 is a bus driver & transceiver with 8 bits and 3V/5V translation. It has a propagation delay of 7.5 ns and can operate at temperatures up to 125°C. This component is commonly used in automotive applications.

Median Price

$1.217

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Nova Conductors

Japan . 500 parts In-Stock

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$1.217

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Chip Stock

USA . 63,000 parts In-Stock

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Vyrian

USA . 6,292 parts In-Stock

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VNN

France . 5,858 parts In-Stock

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Anansix

USA . 1,817 parts In-Stock

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Digiode

USA . 538 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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Argo Parts USA

USA . 857 parts In-Stock

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$1.217

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857

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Netroflash

USA . 500 parts In-Stock

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$1.217

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$1.193

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Continental Prestige Electronics

USA . 39 parts In-Stock

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$1.217

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$1.193

39

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Advanced Electronics

New Zealand . 20 parts In-Stock

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$1.241

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$1.241

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$1.241

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20

$1.241

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Andel Nordic

Denmark . 3,032 parts In-Stock

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$1.476

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$1.417

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$1.417

3,032

$1.476

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$1.417

AZTECH Wire

Italy . 12,220 parts In-Stock

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$12.778

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Microchip USA

USA . 2,157 parts In-Stock

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$19.666

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Aztec Data Supply Inc.

USA . 2,187 parts In-Stock

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$25.360

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$25.360

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Semicontronic

India . 818 parts In-Stock

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$26.000

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$25.350

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$25.220

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818

$26.000

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Corohmni

South Africa . 67 parts In-Stock

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$27.707

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One Stop Electronics

USA . 492 parts In-Stock

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$37.000

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Ampacity Inc.

Singapore . 990 parts In-Stock

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$47.000

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Perfect Parts

USA . 27,984 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,081 parts In-Stock

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UNI Independent Distributors

Spain . 8,392 parts In-Stock

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Corphita

USA . 3,781 parts In-Stock

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Authorized Procurement Solutions

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Supply Digital

USA . 2,197 parts In-Stock

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Overview

Discover the cutting-edge 74ALVC164245DL,112 by NXP Semiconductors, a high-quality bus driver and transceiver that offers unparalleled performance and reliability. With its advanced CMOS technology and dual-port design, this product delivers seamless data transmission and translation between different voltage levels. Ideal for automotive applications, it operates flawlessly in extreme temperature conditions from -40°C to 125°C. Its compact size and surface-mount capability make installation a breeze. Experience the value and benefits of NXP Semiconductors' innovation with the 74ALVC164245DL,112, ensuring your systems run smoothly with maximum efficiency and accuracy.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body enhances the product's durability and resistance, making it an ideal choice for rugged environments such as automotive applications.

Propagation Delay At Nominal Supply: 7.5 ns

With a fast propagation delay of 7.5 ns, this product ensures efficient transmission and reception of bus signals, contributing to high-speed data transfer and reliable communication.

Surface Mount: YES

This product being surface mountable enables convenient and efficient assembly, reducing the overall manufacturing time and cost.

No. of Functions: 2

This bus driver and transceiver product incorporates two essential functions in a single package, saving board space and simplifying the design process.

Package Shape: RECTANGULAR

The rectangular package shape offers ease of handling and efficient use of space, making it compatible with various PCB layouts and designs.

No. of Bits: 8

With an 8-bit configuration, this product supports a wide range of data formats and communication protocols, providing versatility and compatibility for various applications.

Translation: 3V & 5V

The translation capability between 3V and 5V allows seamless integration with different voltage system components, making it suitable for multi-voltage level bus communication.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with common power supply standards, offering ease of integration and reducing power consumption.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this product provides stable and reliable signal transmission, effectively reducing signal distortions and ensuring accurate data transfer.

Power Supplies (V): 3.3,5

The availability of multiple power supply options at 3.3V and 5V enables versatile compatibility with various system configurations, enhancing flexibility and ease of use.

No. of Terminals: 48

This product features 48 terminals, providing ample connectivity options and enabling connections to multiple devices or interfaces.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style allows for high-density mounting on circuit boards, enabling efficient use of space and enabling compact designs.

Maximum I (ol): 24 Amp

With a maximum output current of 24 Amps, this product delivers robust and powerful driving capability, suitable for demanding applications that require high current outputs.

Propagation Delay (tpd): 9.5 ns

The propagation delay of 9.5 ns ensures fast and efficient signal propagation, facilitating quick response times and reducing overall system latency.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can reliably operate in high-temperature environments, such as automotive applications, ensuring performance stability and longevity.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow this product to tri-state its output, facilitating bus sharing or reducing power consumption when the driver is idle, enhancing overall system efficiency.

Minimum Operating Temperature: -40 °C

This product is designed to operate in extreme temperature conditions, with a minimum operating temperature of -40°C, ensuring reliable performance even in harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides excellent corrosion resistance, ensuring reliable electrical connections and enhancing the product's lifespan.

Terminal Position: DUAL

With a dual terminal position, this product offers flexibility in mounting options, accommodating various circuit board layouts and facilitating easy integration into system designs.

No. of Ports: 2

Featuring two ports, this product allows for simultaneous transmission and reception of data, providing enhanced functionality and versatility in bus applications.

Maximum Seated Height: 2.8 mm

The maximum seated height of 2.8 mm ensures a low-profile package, making it suitable for space-constrained applications where height limitations are crucial.

Width: 7.5 mm

With a width of 7.5 mm, this product offers a compact form factor, enabling efficient use of board space and allowing for high-density designs.

Output Polarity: TRUE

The output polarity being true ensures compatibility with common logic levels and simplifies integration with other components, enhancing overall system compatibility and ease of use.

Minimum Supply Voltage (Vsup): 2.7 V

With a minimum supply voltage of 2.7V, this product supports a wide range of power supply options, offering flexibility and compatibility with various system requirements.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand a maximum time of 30 seconds at peak reflow temperature, facilitating reliable assembly and ensuring robust performance during the manufacturing process.

Peak Reflow Temperature °C: 260

Designed to withstand a peak reflow temperature of 260°C, this product ensures reliable soldering during assembly, contributing to overall quality and durability.

Length: 15.875 mm

With a length of 15.875 mm, this product provides a compact and space-efficient solution for various applications, allowing for flexible integration in tight spaces.

Temperature Grade: AUTOMOTIVE

This product is specifically designed and rated for automotive applications, meeting rigorous automotive-grade standards and ensuring reliable performance in harsh vehicle environments.

Technology: CMOS

Utilizing CMOS technology, this product offers low-power consumption, high noise immunity, and compatibility with various digital logic families, making it an ideal choice for efficient and reliable bus communication.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and stability during assembly and operation, ensuring secure solder joints and improved long-term performance.

Packing Method: TUBE

This product is packed in a tube, providing convenient handling, protection, and ease of storage during shipping and assembly processes.

Terminal Pitch: 0.635 mm

With a terminal pitch of 0.635 mm, this product supports fine pitch interconnections, facilitating high-density PCB layouts and offering compatibility with modern manufacturing technologies.

Count Direction: BIDIRECTIONAL

The bidirectional count direction allows this product to support data transmission and reception in both directions, providing flexibility and versatility for various bus communication scenarios.

Control Type: COMMON CONTROL

With common control functionality, this product simplifies system integration and offers centralized control, enhancing ease of use and reducing complexity in bus communication.

Maximum Supply Voltage (Vsup): 5.5 V

Operating at a maximum supply voltage of 5.5V, this product ensures compatibility with common voltage levels and provides an adequate safety margin, guaranteeing stable and reliable performance.

Technical Specifications

Bus Driver & Transceivers 74ALVC164245DL,112 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

PORT A IS OPERATED AT VOLTAGE 1.5-3.6V

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.8 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

3V & 5V

Width:

7.5 mm

Trade Compliance

74ALVC164245DL,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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