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SN54365J

Texas Instruments

SN54365J by Texas Instruments

SN54365J by Texas Instruments is a 6-bit bus driver with 22ns propagation delay at 5V. It operates in a temperature range of -55 to 125°C, suitable for military-grade applications. With a max I (ol) of 12A and output polarity as TRUE, it is ideal for high-power control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,241 parts In-Stock

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Vyrian

USA . 3,942 parts In-Stock

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ECAB

Sweden . 1 parts In-Stock

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AZTECH Wire

Italy . 757 parts In-Stock

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$5.998

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Parana Technologies

USA . 481 parts In-Stock

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$16.008

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$16.351

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DigiPath Technology Company

USA . 2,346 parts In-Stock

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$17.626

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$16.216

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$17.626

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ChromeModa Solutions

Germany . 4,113 parts In-Stock

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$17.986

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$14.749

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$17.986

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IDEA Electronic Components Group

UK . 1,964 parts In-Stock

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$17.986

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$17.087

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$16.187

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One Stop Electronics

USA . 560 parts In-Stock

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$54.000

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Corphita

USA . 3,455 parts In-Stock

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Overview

Enhance your electronic designs with the Texas Instruments SN54365J bus driver & transceiver. Manufactured by a trusted leader in the industry, this high-quality ceramic package offers reliable performance and durability. With 6 bits and a low propagation delay of 22ns, this versatile component is ideal for a wide range of applications. From industrial automation to telecommunications, this product delivers exceptional value, efficiency, and precision to meet all your project needs. Upgrade your systems today with the Texas Instruments SN54365J.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal conductivity and are resistant to high temperatures, making the product durable and reliable in various operating conditions.

Propagation Delay At Nominal Supply: 22 ns

Low propagation delay ensures fast and efficient data transmission, making the product suitable for high-speed communication applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with common electronic systems, simplifying integration.

No. of Bits: 6

Having 6 bits allows for a wide range of data transmission possibilities, providing flexibility in managing signals and communication protocols.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, ensuring reliability in demanding applications.

Technology: TTL

Using TTL technology enables compatibility with existing hardware and simplifies interfacing with other components, enhancing the product's versatility.

Technical Specifications

Bus Driver & Transceivers SN54365J attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

85 mA

Propagation Delay At Nominal Supply:

22 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN54365J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-182-8244, 5962011828244, 5962-25-133-8799, 5962251338799, 5962-99-254-0168, 5962992540168

NIIN

011828244, 251338799, 992540168

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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