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SN54366AJ

Texas Instruments

SN54366AJ by Texas Instruments

SN54366AJ by Texas Instruments is a 6-bit bus driver with 3-STATE output, operating at a voltage range of 4.5V to 5.5V. It features a propagation delay of 37ns and is designed for military-grade applications requiring inverted output polarity in an inline package style.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Vyrian

USA . 2,799 parts In-Stock

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Digiode

USA . 2,458 parts In-Stock

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Electronic Expediters

USA . 1,146 parts In-Stock

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LWI Electronics Inc

India . 391 parts In-Stock

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Sinequanon

UK . 7 parts In-Stock

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Holdelec - ElecDif-Pro

France . 3 parts In-Stock

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Andel Nordic

Denmark . 5,291 parts In-Stock

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$2.390

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$2.294

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AZTECH Wire

Italy . 287 parts In-Stock

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$8.835

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Parana Technologies

USA . 1,500 parts In-Stock

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$25.650

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$26.253

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DigiPath Technology Company

USA . 596 parts In-Stock

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$28.244

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$25.984

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ChromeModa Solutions

Germany . 2,215 parts In-Stock

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$28.820

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IDEA Electronic Components Group

UK . 1,740 parts In-Stock

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$28.820

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$25.938

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One Stop Electronics

USA . 1,092 parts In-Stock

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Corphita

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Assy Fe

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Overview

Enhance your electronic projects with the Texas Instruments SN54366AJ bus driver & transceiver. Manufactured with top-quality ceramic and glass-sealed materials, this versatile component offers reliable performance in various applications. With a nominal supply voltage of 5V and 3-state output characteristics, this product ensures efficient signal transmission while operating in extreme temperatures. Experience seamless connectivity and precise control with the SN54366AJ, making it the ideal choice for military-grade projects requiring high performance and durability. Elevate your designs with the superior quality and advanced technology of Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed package body material provides high durability and reliability, making this product suitable for rugged environments.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard nominal supply voltage of 5V, ensuring compatibility with most systems.

Propagation Delay (tpd): 37 ns

Fast propagation delay of 37 ns ensures quick data transmission and response times.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures up to 125°C, ideal for applications where temperature fluctuations are common.

Output Characteristics: 3-STATE

3-state output characteristics allow for multiple devices to share the same communication lines without interfering with each other, increasing versatility.

Technology: TTL

Utilizes TTL technology, known for its high speed and low power consumption, making this product efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN54366AJ attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

6

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

77 mA

Propagation Delay (tpd):

37 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN54366AJ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-035-7480, 5962010357480, 5962-99-721-3768, 5962997213768

NIIN

010357480, 997213768

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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