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CLVC16T245MDGGEP

Texas Instruments

CLVC16T245MDGGEP by Texas Instruments

The Texas Instruments CLVC16T245MDGGEP is a 2-function bus driver with 8 bits, operating at a nominal voltage of 1.8V and supporting translation b/w 1.8V to 5.5V. It features a propagation delay of 10.2ns, outputting in TRUE polarity with a max I (ol) of 32Amp, making it suitable for bidirectional applications requiring common control in military-grade environments.

Median Price

$14.402

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 2 parts In-Stock

1+ parts

$13.260

100+ parts

$11.260

1k+ parts

-

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2

$13.260

$11.260

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-

Texas Instruments

USA . 10,584 parts In-Stock

1+ parts

$13.805

100+ parts

$12.058

1k+ parts

$8.316

10k+ parts

-

10,584

$13.805

$12.058

$8.316

-

Chip1Stop

Japan . 2 parts In-Stock

1+ parts

$15.000

100+ parts

-

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2

$15.000

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Mouser Electronics

USA . 132 parts In-Stock

1+ parts

$28.540

100+ parts

$21.080

1k+ parts

$19.340

10k+ parts

-

132

$28.540

$21.080

$19.340

-

DigiKey

USA . 39 parts In-Stock

1+ parts

$28.540

100+ parts

$21.078

1k+ parts

$18.970

10k+ parts

-

39

$28.540

$21.078

$18.970

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Arrow

USA . 80 parts In-Stock

1+ parts

-

100+ parts

$12.805

1k+ parts

$11.250

10k+ parts

-

80

-

$12.805

$11.250

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,328 parts In-Stock

1+ parts

$11.875

100+ parts

-

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4,328

$11.875

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Vyrian

USA . 4,028 parts In-Stock

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4,028

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,233 parts In-Stock

1+ parts

$6.701

100+ parts

-

1k+ parts

$6.433

10k+ parts

$6.433

2,233

$6.701

-

$6.433

$6.433

Ampacity Inc.

Singapore . 1,741 parts In-Stock

1+ parts

$10.880

100+ parts

-

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1,741

$10.880

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Corphita

USA . 1,685 parts In-Stock

1+ parts

$11.250

100+ parts

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1,685

$11.250

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Corohmni

South Africa . 663 parts In-Stock

1+ parts

$21.097

100+ parts

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663

$21.097

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Parana Technologies

USA . 115 parts In-Stock

1+ parts

$29.897

100+ parts

-

1k+ parts

$64.476

10k+ parts

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115

$29.897

-

$64.476

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DigiPath Technology Company

USA . 710 parts In-Stock

1+ parts

$32.920

100+ parts

$30.287

1k+ parts

-

10k+ parts

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710

$32.920

$30.287

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ChromeModa Solutions

Germany . 2,363 parts In-Stock

1+ parts

$33.592

100+ parts

$27.545

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10k+ parts

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2,363

$33.592

$27.545

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IDEA Electronic Components Group

UK . 115 parts In-Stock

1+ parts

$33.592

100+ parts

$31.912

1k+ parts

$30.233

10k+ parts

-

115

$33.592

$31.912

$30.233

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Continental Prestige Electronics

USA . 5,983 parts In-Stock

1+ parts

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5,983

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Argo Parts USA

USA . 4,215 parts In-Stock

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4,215

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Bastille Electronics

Australia . 48 parts In-Stock

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48

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Overview

Discover the Texas Instruments CLVC16T245MDGGEP, a top-tier Bus Driver & Transceiver that stands out for its unparalleled quality and reliability. Manufactured by industry leader Texas Instruments, this product offers exceptional performance in a wide range of applications. With a compact design and advanced features, it provides customers with unmatched value and benefits. Whether you need seamless data transmission or efficient bus driving capabilities, the CLVC16T245MDGGEP is your go-to solution for superior results every time. Upgrade to excellence with Texas Instruments.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 10.2 ns

Low propagation delay ensures fast data transmission, making this product suitable for high-speed applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient board layout and space-saving design.

No. of Bits: 8

8-bit data transmission capability provides sufficient bandwidth for various communication protocols.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage reduces power consumption and heat dissipation, enhancing the product's energy efficiency.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable operation in harsh environmental conditions.

Output Polarity: TRUE

True output polarity simplifies signal interpretation and enhances system compatibility.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltage levels.

Technical Specifications

Bus Driver & Transceivers CLVC16T245MDGGEP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.03 mA

Propagation Delay At Nominal Supply:

10.2 ns

Propagation Delay (tpd):

27.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.8/5.5V&1.8/5.5V

Width:

6.1 mm

Trade Compliance

CLVC16T245MDGGEP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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