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SN74AHC1G125DBVR

Texas Instruments

SN74AHC1G125DBVR by Texas Instruments

SN74AHC1G125DBVR by Texas Instruments is a 3-STATE bus driver with 14ns propagation delay at 3.3V, suitable for automotive applications. It features a small outline package with nickel/palladium/gold terminals and operates b/w -40 to 125°C temperature range. The device has dual terminal position, peak reflow temp of 260°C, and supports load capacitance of 50pF.

Median Price

$0.198

Lifecycle Status

Suppliers In-Stock

56

In-Stock Inventory

1k+

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Texas Instruments

USA . 2,081,661 parts In-Stock

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DigiKey

USA . 24,170 parts In-Stock

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$0.087

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$0.072

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$0.064

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Mouser Electronics

USA . 5,775 parts In-Stock

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$0.065

Arrow

USA . 307 parts In-Stock

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$0.198

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Newark

USA . 11,128 parts In-Stock

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Chip1Stop

Japan . 330 parts In-Stock

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Element14

Singapore . 11,278 parts In-Stock

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Farnell

UK . 10,403 parts In-Stock

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RS (Exports)

UK . 1,900 parts In-Stock

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Verical

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Maritex

Poland . 14 parts In-Stock

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Digiode

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Nova Conductors

Japan . 80 parts In-Stock

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TME

Poland . 2,276 parts In-Stock

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American Microsemiconductor Inc.

USA . 7,357 parts In-Stock

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Forefront Electronics and Design

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Component Electronics Inc.

Canada . 376 parts In-Stock

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Vyrian

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Bristol Electronics

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Contempo Components LLC

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Manoshevitz Elec. Sales

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CoreStaff

Japan . 2 parts In-Stock

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$0.047

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$0.044

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Ampacity Inc.

Singapore . 214,760 parts In-Stock

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Semicontronic

India . 214,651 parts In-Stock

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Argo Parts USA

USA . 2,738 parts In-Stock

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Corphita

USA . 4,910 parts In-Stock

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Continental Prestige Electronics

USA . 2,113 parts In-Stock

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$0.100

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$0.052

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$0.034

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$0.034

Microchip USA

USA . 5,730 parts In-Stock

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$0.402

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Andel Nordic

Denmark . 879 parts In-Stock

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$5.863

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$5.629

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$5.629

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$5.629

Parana Technologies

USA . 770 parts In-Stock

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$8.234

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$8.848

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Corohmni

South Africa . 918 parts In-Stock

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$8.482

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DigiPath Technology Company

USA . 99 parts In-Stock

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$9.067

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$8.342

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IDEA Electronic Components Group

UK . 2,287 parts In-Stock

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$9.252

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$8.789

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$8.327

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ChromeModa Solutions

Germany . 812 parts In-Stock

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$9.252

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$7.587

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Modulus Dynamics

Lithuania . 2,622 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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Perfect Parts

USA . 662,535 parts In-Stock

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Brazil . 3,858 parts In-Stock

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Lucentia Tech

USA . 3,858 parts In-Stock

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$18.537

Computer Components Inc. - USA

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Netroflash

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Overview

Elevate your electronic designs with the SN74AHC1G125DBVR by Texas Instruments. Known for their top-tier quality and reliability, Texas Instruments delivers exceptional products in the Bus Driver & Transceivers category. This small outline, low profile package offers a range of applications with its 3-STATE output characteristics and true output polarity. With a minimum operating temperature of -40°C and a maximum operating temperature of 125°C, this product is ideal for automotive-grade projects. Discover the value of fast propagation delays, low power consumption, and excellent performance - all packed into a compact and efficient design. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight, durable, and cost-effective.

Propagation Delay At Nominal Supply: 14 ns

Fast propagation delay ensures quick data transmission and efficient performance.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard nominal supply voltage of 3.3V for compatibility with common power sources.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance, allowing multiple devices to share the same bus without conflict.

Temperature Grade: AUTOMOTIVE

Built to withstand automotive temperature requirements, making it suitable for automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the product.

Technical Specifications

Bus Driver & Transceivers SN74AHC1G125DBVR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74AHC1G125DBVR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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