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CLVC2G126MDCUTEP

Texas Instruments

CLVC2G126MDCUTEP by Texas Instruments

The Texas Instruments CLVC2G126MDCUTEP is a 3.3V, 8-terminal bus driver with 6.8ns propagation delay and 15.2ns tpd. It features a small outline package and is ideal for military-grade applications requiring true output polarity control at temperatures ranging from -55 to 125°C.

Median Price

$2.956

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 16,312 parts In-Stock

1+ parts

$2.283

100+ parts

$2.000

1k+ parts

$1.130

10k+ parts

-

16,312

$2.283

$2.000

$1.130

-

DigiKey

USA . 3,462 parts In-Stock

1+ parts

$3.630

100+ parts

$2.263

1k+ parts

$2.039

10k+ parts

$1.955

3,462

$3.630

$2.263

$2.039

$1.955

Mouser Electronics

USA . 373 parts In-Stock

1+ parts

$3.630

100+ parts

$2.270

1k+ parts

$1.970

10k+ parts

$1.950

373

$3.630

$2.270

$1.970

$1.950

Arrow

USA . 1,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.497

10k+ parts

$1.364

1,750

-

-

$1.497

$1.364

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 582 parts In-Stock

1+ parts

$1.497

100+ parts

-

1k+ parts

-

10k+ parts

-

582

$1.497

-

-

-

Digiode

USA . 3,297 parts In-Stock

1+ parts

$2.169

100+ parts

-

1k+ parts

-

10k+ parts

-

3,297

$2.169

-

-

-

Prism Electronics

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 649 parts In-Stock

1+ parts

$0.106

100+ parts

-

1k+ parts

-

10k+ parts

$0.102

649

$0.106

-

-

$0.102

Northwest PG Solutions

USA . 1,063 parts In-Stock

1+ parts

$0.117

100+ parts

-

1k+ parts

-

10k+ parts

$0.103

1,063

$0.117

-

-

$0.103

Corphita

USA . 1,018 parts In-Stock

1+ parts

$2.055

100+ parts

-

1k+ parts

-

10k+ parts

-

1,018

$2.055

-

-

-

Andel Nordic

Denmark . 3,037 parts In-Stock

1+ parts

$6.201

100+ parts

-

1k+ parts

$5.953

10k+ parts

$5.953

3,037

$6.201

-

$5.953

$5.953

Parana Technologies

USA . 854 parts In-Stock

1+ parts

$28.165

100+ parts

-

1k+ parts

$44.408

10k+ parts

-

854

$28.165

-

$44.408

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DigiPath Technology Company

USA . 1,282 parts In-Stock

1+ parts

$31.013

100+ parts

-

1k+ parts

-

10k+ parts

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1,282

$31.013

-

-

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ChromeModa Solutions

Germany . 5,015 parts In-Stock

1+ parts

$31.646

100+ parts

$25.950

1k+ parts

-

10k+ parts

-

5,015

$31.646

$25.950

-

-

IDEA Electronic Components Group

UK . 2,118 parts In-Stock

1+ parts

$31.646

100+ parts

$30.064

1k+ parts

$28.481

10k+ parts

-

2,118

$31.646

$30.064

$28.481

-

QUARKTWIN TECHNOLOGY LTD

USA . 19,449 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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19,449

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Overview

Unlock the power of seamless data transmission with the CLVC2G126MDCUTEP by Texas Instruments. Crafted with precision and expertise, this bus driver & transceiver offers unparalleled performance and reliability. Ideal for a wide range of applications, this product ensures smooth communication and efficient operation. Experience the value of top-notch quality and cutting-edge technology, bringing ease and convenience to your projects. Elevate your systems with the CLVC2G126MDCUTEP and enjoy the benefits of superior connectivity and optimized functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the bus driver & transceivers, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 6.8 ns

The low propagation delay ensures fast and efficient communication within the system, making this product suitable for high-speed data transmission.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

The specified supply voltage ensures compatibility with a wide range of systems, making this product versatile and adaptable.

Output Characteristics: 3-STATE

The 3-state output feature allows for greater control and flexibility in managing the signals, enhancing the overall functionality of the product.

Temperature Grade: MILITARY

The military-grade temperature range ensures reliable performance in harsh environmental conditions, making this product suitable for rugged applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noise-prone environments.

Technical Specifications

Bus Driver & Transceivers CLVC2G126MDCUTEP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.3 mm

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6.8 ns

Propagation Delay (tpd):

15.2 ns

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

2 mm

Trade Compliance

CLVC2G126MDCUTEP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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