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SN74AHCT1G125DBVR

Texas Instruments

SN74AHCT1G125DBVR by Texas Instruments

SN74AHCT1G125DBVR by Texas Instruments is a bus driver with 8.5ns propagation delay, suitable for automotive applications. It operates at 5V with 50pF load capacitance and features a small outline package style. With dual terminal position and true output polarity, it offers 3-state output characteristics for efficient signal transmission.

Median Price

$0.092

Lifecycle Status

Suppliers In-Stock

33

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 2,016,318 parts In-Stock

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DigiKey

USA . 78,812 parts In-Stock

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Mouser Electronics

USA . 26,482 parts In-Stock

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Arrow

USA . 18,000 parts In-Stock

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Verical

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Chip1Stop

Japan . 615 parts In-Stock

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Element14

Singapore . 60 parts In-Stock

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Nova Conductors

Japan . 650 parts In-Stock

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Digiode

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Freelance Electronics

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TME

Poland . 1,389 parts In-Stock

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Vyrian

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Bristol Electronics

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Dan-Mar Components

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PC Components Company LLC

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Connector Distribution Corp

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Connect4Technologies Inc.

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Ampacity Inc.

Singapore . 235,646 parts In-Stock

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Semicontronic

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Corphita

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Modulus Dynamics

Lithuania . 1,142 parts In-Stock

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Corohmni

South Africa . 421 parts In-Stock

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Argo Parts USA

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Netroflash

USA . 50 parts In-Stock

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Advanced Electronics

New Zealand . 40 parts In-Stock

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Parana Technologies

USA . 1,190 parts In-Stock

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 5,448 parts In-Stock

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IDEA Electronic Components Group

UK . 1,047 parts In-Stock

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Andel Nordic

Denmark . 2,828 parts In-Stock

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Allen Electronics Distributors

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iodParts Technologies Inc.

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Lixinc

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Computer Components Inc. - USA

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Continental Prestige Electronics

USA . 1,832 parts In-Stock

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USA . 100 parts In-Stock

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Overview

Unlock the power of seamless data transmission with the SN74AHCT1G125DBVR by Texas Instruments. Crafted with precision and expertise, this Bus Driver & Transceiver offers unparalleled reliability and performance. Ideal for automotive applications, this product ensures swift and efficient communication within your system. Experience the value of a high-quality solution that not only meets but exceeds your expectations. Elevate your projects with the superior benefits and advantages of the SN74AHCT1G125DBVR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver & transceivers, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 8.5 ns

Fast propagation delay ensures quick signal transmission, making this product suitable for high-speed bus applications.

Surface Mount: YES

Easy to install and space-saving design allows for efficient PCB layout and assembly.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage compatible with most systems, ensuring seamless integration.

Load Capacitance (CL): 50 pF

Optimal load capacitance for stable and reliable signal transmission, reducing signal distortion.

Technology: CMOS

CMOS technology offers low power consumption and noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74AHCT1G125DBVR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHCT/VHCT/VT

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74AHCT1G125DBVR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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