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SN74LVC1G125DPWR

Texas Instruments

SN74LVC1G125DPWR by Texas Instruments

SN74LVC1G125DPWR by Texas Instruments is a 3.3V bus driver with 4.7ns propagation delay, suitable for automotive applications. It features 32A max I (ol), -40 to 125 °C operating temperature range, and TRUE output polarity. This CMOS technology device has a small outline package with nickel/palladium/gold terminal finish.

Median Price

$0.224

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Chip1Stop

Japan . 2,759 parts In-Stock

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$0.137

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$0.137

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Texas Instruments

USA . 704,633 parts In-Stock

1+ parts

$0.224

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$0.152

1k+ parts

$0.078

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704,633

$0.224

$0.152

$0.078

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DigiKey

USA . 9,138 parts In-Stock

1+ parts

$0.300

100+ parts

$0.158

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$0.132

10k+ parts

$0.119

9,138

$0.300

$0.158

$0.132

$0.119

Arrow

USA . 1,318 parts In-Stock

1+ parts

$0.343

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$0.161

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$0.098

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$0.343

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$0.098

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Verical

USA . 476 parts In-Stock

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$0.110

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$0.100

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476

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$0.100

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Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.166

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300

$0.166

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Digiode

USA . 75 parts In-Stock

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$0.213

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$0.213

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Vyrian

USA . 129,778 parts In-Stock

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129,778

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ComSIT Distribution GmbH

Germany . 2,770 parts In-Stock

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SPM Sales

USA . 1,984 parts In-Stock

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Semicontronic

India . 129,429 parts In-Stock

1+ parts

$0.082

100+ parts

$0.080

1k+ parts

$0.080

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129,429

$0.082

$0.080

$0.080

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Ampacity Inc.

Singapore . 129,425 parts In-Stock

1+ parts

$0.082

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$0.082

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Aranea Global

USA . 100 parts In-Stock

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$0.163

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$0.156

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100

$0.163

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$0.156

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Continental Prestige Electronics

USA . 4,910 parts In-Stock

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$0.166

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$0.163

4,910

$0.166

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$0.163

Argo Parts USA

USA . 40 parts In-Stock

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$0.166

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$0.161

40

$0.166

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$0.161

Corphita

USA . 2,125 parts In-Stock

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$0.202

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$0.202

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Corohmni

South Africa . 350 parts In-Stock

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$12.379

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$12.379

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Parana Technologies

USA . 1,420 parts In-Stock

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$27.058

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$31.744

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$27.058

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DigiPath Technology Company

USA . 2,059 parts In-Stock

1+ parts

$29.794

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$27.410

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2,059

$29.794

$27.410

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ChromeModa Solutions

Germany . 1,549 parts In-Stock

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$30.402

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$24.930

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$30.402

$24.930

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IDEA Electronic Components Group

UK . 1,051 parts In-Stock

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$30.402

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$28.882

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$27.362

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1,051

$30.402

$28.882

$27.362

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Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$31.481

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$29.907

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$29.907

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$31.481

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$29.907

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Andel Nordic

Denmark . 1,185 parts In-Stock

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$240.146

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$230.540

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$230.540

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iBuyXS LLC

. 54,000 parts In-Stock

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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Lixinc

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Overview

Texas Instruments presents the SN74LVC1G125DPWR, a top-of-the-line Bus Driver & Transceiver designed for optimal performance and reliability. With Texas Instruments' reputation for quality, this product offers unparalleled value to customers seeking high-speed data transmission with minimal delay. Ideal for a wide range of applications, this compact and versatile device ensures seamless operation in automotive, industrial, and consumer electronics. Upgrade your projects with the SN74LVC1G125DPWR and experience the cutting-edge technology that Texas Instruments is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver & transceivers, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 4.7 ns

Low propagation delay ensures fast signal transmission, making the product suitable for high-speed applications.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common supply voltages, ensuring easy integration into various systems.

Load Capacitance (CL): 50 pF

Suitable for driving moderate capacitive loads, making it versatile for a range of applications.

No. of Terminals: 4

Provides multiple connection points for interfacing with other components, increasing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Compact design with heat sink capability and thin profile allows for efficient space utilization and heat dissipation.

Maximum I (ol): 32 Amp

High output current capability enables driving of larger loads, enhancing the product's versatility.

No. of Ports: 2

Multiple ports provide flexibility in connecting to different devices or circuits, increasing the product's utility.

Maximum Operating Temperature: 125 °C

Wide temperature range tolerance allows for reliable operation in harsh environmental conditions.

Technical Specifications

Bus Driver & Transceivers SN74LVC1G125DPWR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

S-PDSO-N4

JESD-609 Code:

e4

Length:

.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

4

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.7 ns

Propagation Delay (tpd):

9.3 ns

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.48 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.8 mm

Trade Compliance

SN74LVC1G125DPWR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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