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CD74HCT245M

Texas Instruments

CD74HCT245M by Texas Instruments

CD74HCT245M by Texas Instruments is an 8-bit bus driver with a propagation delay of 33 ns at 5V. It features a 3-STATE output and operates in temperatures ranging from -55 to 125 °C. Ideal for bidirectional control applications, this CMOS technology chip has a terminal pitch of 1.27 mm and comes in a small outline package.

Median Price

$0.598

Lifecycle Status

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42

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1k+

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Chip1Stop

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Adafruit Industries

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DigiKey

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Mouser Electronics

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Rochester

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Verical

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Digiode

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Nova Conductors

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Component Electronics Inc.

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American Microsemiconductor Inc.

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Prism Electronics

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Bristol Electronics

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TME

Poland . 2 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 4,204 parts In-Stock

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$0.332

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Corphita

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Component Stockers USA

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Corohmni

South Africa . 56 parts In-Stock

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$0.418

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Advanced Electronics

New Zealand . 100 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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$0.429

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Continental Prestige Electronics

USA . 4,022 parts In-Stock

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Argo Parts USA

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Microchip USA

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$6.045

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 6,236 parts In-Stock

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IDEA Electronic Components Group

UK . 1,504 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Authorized Procurement Solutions

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Supply Digital

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GreenTree Electronics

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Overview

Unlock the power of seamless data transmission with the CD74HCT245M by Texas Instruments. Designed with precision and reliability in mind, this bus driver & transceiver offers unparalleled performance in a compact package. Perfect for a wide range of applications, this product ensures fast propagation delay and efficient signal transfer, making it an essential component for any project. Trust in Texas Instruments for quality you can rely on. Elevate your design with the CD74HCT245M today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Propagation Delay At Nominal Supply: 33 ns

With a low propagation delay, this product ensures fast and efficient signal transmission, reducing latency.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB, making it suitable for compact designs.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into existing circuit layouts, enhancing versatility and compatibility.

No. of Bits: 8

With 8 bits, this product offers sufficient data transmission capacity for a wide range of applications, ensuring flexibility and scalability.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V, this product is compatible with most systems and ensures consistent performance.

Load Capacitance (CL): 50 pF

The 50pF load capacitance helps in stabilizing the signal transmission, reducing noise and interference for reliable operation.

Power Supplies (V): 5

The use of a 5V power supply simplifies the design and power management process, making the product user-friendly and cost-effective.

No. of Terminals: 20

With 20 terminals, this product offers ample connectivity options for interfacing with other components, enhancing configurability.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for high-density PCB layouts, making it suitable for compact systems.

Technical Specifications

Bus Driver & Transceivers CD74HCT245M attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

33 ns

Propagation Delay (tpd):

39 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.5 mm

Trade Compliance

CD74HCT245M Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-393-2529, 5962013932529

NIIN

013932529

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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