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SN74HCT244PWR

Texas Instruments

SN74HCT244PWR by Texas Instruments

SN74HCT244PWR by Texas Instruments is a 20-terminal bus driver with 35ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 5V, has a load capacitance of 150pF, and features true output polarity. This CMOS technology device offers dual terminal position and enables low control type.

Median Price

$0.274

Lifecycle Status

Suppliers In-Stock

53

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1k+

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Arrow

USA . 6 parts In-Stock

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Chip1Stop

Japan . 1,111 parts In-Stock

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Texas Instruments

USA . 343,586 parts In-Stock

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Farnell

UK . 558 parts In-Stock

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DigiKey

USA . 7,335 parts In-Stock

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Mouser Electronics

USA . 36 parts In-Stock

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Newark

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Element14

Singapore . 1,770 parts In-Stock

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Verical

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Nova Conductors

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TME

Poland . 5,799 parts In-Stock

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Maritex

Poland . 114 parts In-Stock

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Micros sp.j. W. Kędra i J. Lic

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Semicontronic

India . 40,069 parts In-Stock

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Ampacity Inc.

Singapore . 40,121 parts In-Stock

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Corphita

USA . 4,944 parts In-Stock

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Modulus Dynamics

Lithuania . 934 parts In-Stock

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Corohmni

South Africa . 67 parts In-Stock

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Argo Parts USA

USA . 2,249 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$0.228

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Advanced Electronics

New Zealand . 100 parts In-Stock

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Microchip USA

USA . 2,835 parts In-Stock

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$1.048

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Andel Nordic

Denmark . 2,324 parts In-Stock

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$5.487

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$5.268

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Parana Technologies

USA . 1,283 parts In-Stock

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$20.684

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$20.807

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DigiPath Technology Company

USA . 1,078 parts In-Stock

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$22.776

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ChromeModa Solutions

Germany . 6,931 parts In-Stock

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$23.241

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$19.058

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IDEA Electronic Components Group

UK . 1,522 parts In-Stock

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$23.241

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$22.079

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$20.917

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Perfect Parts

USA . 117,644 parts In-Stock

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Germany . 11,947 parts In-Stock

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USA . 473 parts In-Stock

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Germany . 198 parts In-Stock

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Overview

Enhance your electronic designs with the SN74HCT244PWR by Texas Instruments, a top-tier manufacturer known for quality and reliability. This bus driver & transceiver is perfect for a wide range of applications, delivering fast propagation delay and 3-state output characteristics. With its small outline, thin profile package style, and true output polarity, this product offers exceptional value and performance. Upgrade your projects with the SN74HCT244PWR and experience the benefits of superior technology and industrial-grade temperature tolerance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for transportation and harsh environments.

Propagation Delay At Nominal Supply: 35 ns

Low propagation delay ensures fast and efficient data transmission, making the product reliable for real-time applications.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on PCBs, ideal for compact designs.

Nominal Supply Voltage: 5V

Standard 5V supply voltage ensures compatibility with common power sources and simplifies integration into existing systems.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance control, enabling flexibility in connecting multiple devices to the bus driver/transceiver.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in extreme temperature conditions, making the product suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Bus Driver & Transceivers SN74HCT244PWR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR, 13 INCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

35 ns

Propagation Delay (tpd):

56 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74HCT244PWR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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