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SN74LVC1G125DBVRG4

Texas Instruments

SN74LVC1G125DBVRG4 by Texas Instruments

SN74LVC1G125DBVRG4 by Texas Instruments is a 3.3V bus driver with 4.5ns propagation delay, suitable for industrial applications. It features a small outline package with 5 terminals and can handle up to 24A output current in a temperature range of -40°C to 85°C. This CMOS technology transceiver has a true output polarity and supports surface mount installation.

Median Price

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4

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1k+

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Bristol Electronics

USA . 10,913 parts In-Stock

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Vyrian

USA . 3,346 parts In-Stock

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Digiode

USA . 2,863 parts In-Stock

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Nova Conductors

Japan . 21 parts In-Stock

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One Stop Electronics

USA . 1,123 parts In-Stock

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$3.000

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Parana Technologies

USA . 183 parts In-Stock

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$8.210

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Andel Nordic

Denmark . 2,535 parts In-Stock

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$8.315

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$7.982

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DigiPath Technology Company

USA . 1,920 parts In-Stock

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$9.040

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$8.317

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ChromeModa Solutions

Germany . 3,018 parts In-Stock

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$9.225

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IDEA Electronic Components Group

UK . 1,047 parts In-Stock

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$8.764

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$8.302

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Advanced Electronics

New Zealand . 650 parts In-Stock

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$14.364

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Corohmni

South Africa . 54 parts In-Stock

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AZTECH Wire

Italy . 214 parts In-Stock

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Semicontronic

India . 1,204 parts In-Stock

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Ampacity Inc.

Singapore . 158 parts In-Stock

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Perfect Parts

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S.R.D Solutions

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Argo Parts USA

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Continental Prestige Electronics

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Modulus Dynamics

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Speed Components Ltd (Excess)

Israel . 562 parts In-Stock

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Bastille Electronics

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Lucentia Tech

USA . 30 parts In-Stock

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Overview

Experience seamless and reliable data transmission with the SN74LVC1G125DBVRG4 by Texas Instruments. Crafted with precision and expertise, this bus driver & transceiver offers unparalleled performance in a compact design. Ideal for industrial applications, this product ensures fast propagation delay and low power consumption, making it a cost-effective solution for your electronic needs. Trust in Texas Instruments for top-quality components that deliver exceptional results every time. Elevate your projects with the SN74LVC1G125DBVRG4 and experience efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 4.5 ns

The low propagation delay ensures fast and efficient data transmission, making this product ideal for high-speed applications.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves valuable PCB space, making it suitable for compact designs.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is commonly used in many electronic systems, making this product compatible with a wide range of applications.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures proper signal integrity and performance, making this product reliable in various operating conditions.

Power Supplies (V): 3.3

The use of a single 3.3V power supply simplifies the system design and reduces component count, making this product cost-effective.

No. of Terminals: 5

Having 5 terminals provides flexibility in connecting the product to external devices, allowing for versatile integration in different systems.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The compact and low-profile package style with shrink pitch saves space on the PCB, making this product suitable for miniaturized designs.

Maximum I (ol): 24 Amp

The high output current capability of 24A ensures the product can drive high-capacitive loads with ease, making it reliable in demanding applications.

Propagation Delay (tpd): 9 ns

While still fast, the propagation delay of 9 ns allows for precise timing control in data transmission, ensuring accuracy in signal propagation.

Maximum Operating Temperature: 85 °C

The wide operating temperature range of up to 85°C ensures the product can perform reliably in harsh environmental conditions, increasing its versatility.

Output Characteristics: 3-STATE

The 3-state output allows for high impedance state when not active, reducing power consumption and enabling multi-drop bus connections.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the product can operate in cold environments without compromising performance, suitable for various applications.

Terminal Position: DUAL

The dual terminal position provides redundancy and improved signal integrity, minimizing the risk of connection failures and ensuring stable operation.

No. of Ports: 2

Having 2 ports allows for simultaneous communication with multiple devices, enhancing the product's connectivity options and flexibility in system integration.

Maximum Seated Height: 1.45 mm

The low seated height of 1.45mm saves vertical space on the PCB, making this product ideal for compact designs or applications with height restrictions.

Width: 1.6 mm

The narrow width of 1.6mm allows for efficient space utilization on the PCB, enabling high-density board designs and compact system assemblies.

Output Polarity: TRUE

Having true output polarity ensures compatibility with standard logic levels and simplifies system integration, making this product easy to use.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage of 1.65V allows for operation in low-power applications, increasing the product's versatility and energy efficiency.

Length: 2.9 mm

The compact length of 2.9mm saves horizontal space on the PCB, enabling efficient board layout and compact system designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can operate reliably in demanding industrial environments, making it suitable for industrial applications.

Technology: CMOS

The use of CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of systems, making this product versatile and energy-efficient.

Terminal Form: GULL WING

The gull-wing terminal form facilitates soldering and inspection processes, ensuring reliable connections and ease of manufacturing.

Packing Method: TR

The TR packing method (tape and reel) simplifies handling, storage, and automated assembly processes, increasing production efficiency.

Terminal Pitch: 0.95 mm

The fine terminal pitch of 0.95mm enables high-density packaging and precise connection, making this product suitable for compact and miniaturized designs.

Control Type: ENABLE LOW

The enable low control type allows for easy integration with existing systems and enables efficient signal control, enhancing the product's usability.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V provides flexibility in power supply options and ensures compatibility with a wide range of systems, increasing the product's versatility.

Technical Specifications

Bus Driver & Transceivers SN74LVC1G125DBVRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74LVC1G125DBVRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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