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V62/12667-01XE-T

Texas Instruments

V62/12667-01XE-T by Texas Instruments

V62/12667-01XE-T by Texas Instruments is a Bus Driver & Transceiver with 10.2ns Propagation Delay, 1.8V Nominal Voltage, and 48 Terminals. It features a CMOS Technology, operates in temperatures from -55 to 125 °C, and has a compact design for military applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,867 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,867

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Digiode

USA . 3,213 parts In-Stock

1+ parts

-

100+ parts

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3,213

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 14 parts In-Stock

1+ parts

$8.242

100+ parts

-

1k+ parts

$7.913

10k+ parts

$7.913

14

$8.242

-

$7.913

$7.913

AZTECH Wire

Italy . 853 parts In-Stock

1+ parts

$13.807

100+ parts

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853

$13.807

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One Stop Electronics

USA . 560 parts In-Stock

1+ parts

$23.000

100+ parts

-

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560

$23.000

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Parana Technologies

USA . 1,657 parts In-Stock

1+ parts

$27.616

100+ parts

-

1k+ parts

$38.003

10k+ parts

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1,657

$27.616

-

$38.003

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DigiPath Technology Company

USA . 2,109 parts In-Stock

1+ parts

$30.408

100+ parts

$27.976

1k+ parts

-

10k+ parts

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2,109

$30.408

$27.976

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ChromeModa Solutions

Germany . 2,971 parts In-Stock

1+ parts

$31.029

100+ parts

$25.444

1k+ parts

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10k+ parts

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2,971

$31.029

$25.444

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IDEA Electronic Components Group

UK . 782 parts In-Stock

1+ parts

$31.029

100+ parts

$29.478

1k+ parts

$27.926

10k+ parts

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782

$31.029

$29.478

$27.926

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Corphita

USA . 3,025 parts In-Stock

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3,025

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Overview

Experience unmatched quality and reliability with the V62/12667-01XE-T by Texas Instruments, a leading manufacturer in the industry. This Bus Driver & Transceiver offers seamless integration and exceptional performance in a wide range of applications. With its advanced technology and superior design, this product provides customers with value, efficiency, and peace of mind. Elevate your projects with the innovative features and benefits that this top-of-the-line product has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various environments.

Propagation Delay At Nominal Supply: 10.2 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on PCBs, making it convenient for integration into compact designs.

No. of Functions: 2

Having multiple functions in a single device can simplify circuit design and reduce component count, leading to cost and space savings.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient use of board space and facilitates easy orientation during assembly.

No. of Bits: 8

The 8-bit capability allows for handling of larger data sets, making this product suitable for applications requiring higher resolution or data processing.

Translation: 1.8/5.5V&1.8/5.5V

Support for bidirectional voltage translation between 1.8V and 5.5V levels enables compatibility with a wide range of devices and systems.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage of 1.8V reduces power consumption and heat dissipation, making the product energy-efficient.

No. of Terminals: 48

Having 48 terminals allows for multiple connection points, enabling versatile connectivity options for different system configurations.

Maximum I (ol): 32 Amp

The high output current rating of 32A ensures robust signal driving capability, suitable for driving heavy loads or long transmission lines.

Technical Specifications

Bus Driver & Transceivers V62/12667-01XE-T attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.03 mA

Propagation Delay At Nominal Supply:

10.2 ns

Propagation Delay (tpd):

27.8 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.8/5.5V&1.8/5.5V

Width:

6.1 mm

Trade Compliance

V62/12667-01XE-T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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