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V62/14606-01XE

Texas Instruments

V62/14606-01XE by Texas Instruments

V62/14606-01XE by Texas Instruments is a Bus Driver & Transceiver with 2 functions, 8 terminals, and propagation delay of 2.3 ns. It operates at temperatures from -55 to 125°C, has a supply voltage range of 2.3V to 3.6V, and is suitable for military-grade applications requiring bidirectional control with low enable.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,389 parts In-Stock

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6,389

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Digiode

USA . 52 parts In-Stock

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52

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Distributors (Availability)

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Andel Nordic

Denmark . 50 parts In-Stock

1+ parts

$1.905

100+ parts

-

1k+ parts

$1.829

10k+ parts

$1.829

50

$1.905

-

$1.829

$1.829

AZTECH Wire

Italy . 801 parts In-Stock

1+ parts

$16.128

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801

$16.128

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Parana Technologies

USA . 453 parts In-Stock

1+ parts

$18.638

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-

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$18.733

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453

$18.638

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$18.733

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DigiPath Technology Company

USA . 1,000 parts In-Stock

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$20.523

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1,000

$20.523

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ChromeModa Solutions

Germany . 4,723 parts In-Stock

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$20.942

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$17.172

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4,723

$20.942

$17.172

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IDEA Electronic Components Group

UK . 445 parts In-Stock

1+ parts

$20.942

100+ parts

$19.895

1k+ parts

$18.848

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445

$20.942

$19.895

$18.848

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One Stop Electronics

USA . 195 parts In-Stock

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$36.000

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195

$36.000

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Corphita

USA . 2,223 parts In-Stock

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Overview

Enhance your electronic designs with the V62/14606-01XE by Texas Instruments, a top-tier manufacturer known for its superior quality and reliability. As a Bus Driver & Transceiver, this component offers fast propagation delay, 3-state output characteristics, and a wide operating temperature range. Perfect for military-grade applications, this small outline package ensures optimal performance in demanding environments. Experience seamless data transmission and efficient power usage with the V62/14606-01XE - a smart choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the product durable and lightweight, ensuring longevity and ease of handling during installation and operation.

Propagation Delay At Nominal Supply: 2.3 ns

The low propagation delay of 2.3 ns ensures fast and efficient data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Being surface mountable provides easy and secure mounting on circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage: 2.5 V

The 2.5 V nominal supply voltage is common in many electronic systems, ensuring compatibility with a wide range of devices.

Temperature Grade: MILITARY

The military-grade temperature tolerance of the product allows it to operate reliably in harsh environmental conditions, making it suitable for rugged applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers V62/14606-01XE attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CB3Q/3VH/3C/2B

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.7 mA

Propagation Delay At Nominal Supply:

2.3 ns

Propagation Delay (tpd):

2.3 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

3 mm

Trade Compliance

V62/14606-01XE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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