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74HC1G125GW-G

NXP Semiconductors

74HC1G125GW-G by NXP Semiconductors

NXP Semiconductors' 74HC1G125GW-G is a CMOS bus driver with 5 terminals, operating b/w -40 to 125 °C. It features a propagation delay of 150 ns and supports a supply voltage range from 2V to 6V. Ideal for automotive applications due to its small outline package and true output polarity in a surface-mount design.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 4,120 parts In-Stock

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Electronic Expediters

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Anansix

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VNN

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Digiode

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Nova Conductors

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Andel Nordic

Denmark . 83 parts In-Stock

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$2.628

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$2.523

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AZTECH Wire

Italy . 8,082 parts In-Stock

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Aztec Data Supply Inc.

USA . 18,323 parts In-Stock

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Corohmni

South Africa . 150 parts In-Stock

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Semicontronic

India . 1,212 parts In-Stock

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$29.250

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Advanced Electronics

New Zealand . 500 parts In-Stock

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Ampacity Inc.

Singapore . 512 parts In-Stock

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One Stop Electronics

USA . 429 parts In-Stock

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Argo Parts USA

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UNI Independent Distributors

Spain . 3,276 parts In-Stock

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Continental Prestige Electronics

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Corphita

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Supply Digital

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Bastille Electronics

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Overview

Unlock seamless communication and enhanced performance with the 74HC1G125GW-G by NXP Semiconductors. This high-quality bus driver and transceiver offers a compact design, making it perfect for automotive applications. With a wide supply voltage range and fast propagation delay, this product ensures reliable signal transmission and efficient operation. Trust NXP Semiconductors to deliver top-notch technology that meets your needs for superior connectivity and functionality. Elevate your projects with the 74HC1G125GW-G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures the product is lightweight and durable, making it ideal for use in automotive applications.

Surface Mount: YES

Being surface mountable enables easy installation and saves space on the circuit board, making it suitable for compact designs.

Nominal Supply Voltage / Vsup (V): 5

Having a standard supply voltage of 5V allows for compatibility with most electronics, making it versatile for various applications.

Propagation Delay (tpd): 150 ns

With a low propagation delay, the product ensures fast and efficient data transmission, making it reliable for high-speed communication.

Temperature Grade: AUTOMOTIVE

Designed for automotive temperature requirements, this product is suitable for use in harsh environments and ensures reliable performance even in extreme conditions.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for long-term use.

Technical Specifications

Bus Driver & Transceivers 74HC1G125GW-G attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

150 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74HC1G125GW-G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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