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SN74AHC125PWRE4

Texas Instruments

SN74AHC125PWRE4 by Texas Instruments

SN74AHC125PWRE4 by Texas Instruments is a 3-STATE bus driver with 8.5 ns propagation delay at 3.3V, suitable for automotive applications. It features a small outline package with 14 terminals and operates b/w -40 to 125 °C, making it ideal for various electronic systems requiring fast signal transmission.

Median Price

$0.089

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,790 parts In-Stock

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$0.089

3,790

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$0.089

Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.151

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300

$0.151

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Chip Stock

USA . 114,100 parts In-Stock

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114,100

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Vyrian

USA . 3,645 parts In-Stock

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3,645

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Digiode

USA . 2,784 parts In-Stock

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2,784

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,664 parts In-Stock

1+ parts

$0.076

100+ parts

-

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3,664

$0.076

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Semicontronic

India . 3,372 parts In-Stock

1+ parts

$0.076

100+ parts

$0.074

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$0.074

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-

3,372

$0.076

$0.074

$0.074

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Continental Prestige Electronics

USA . 5,565 parts In-Stock

1+ parts

$0.151

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$0.148

5,565

$0.151

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$0.148

Argo Parts USA

USA . 3,434 parts In-Stock

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$0.151

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-

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$0.146

3,434

$0.151

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$0.146

Andel Nordic

Denmark . 3,921 parts In-Stock

1+ parts

$4.602

100+ parts

-

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$4.418

10k+ parts

$4.418

3,921

$4.602

-

$4.418

$4.418

Parana Technologies

USA . 2,353 parts In-Stock

1+ parts

$16.545

100+ parts

-

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$16.823

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2,353

$16.545

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$16.823

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DigiPath Technology Company

USA . 764 parts In-Stock

1+ parts

$18.218

100+ parts

$16.761

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764

$18.218

$16.761

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ChromeModa Solutions

Germany . 4,324 parts In-Stock

1+ parts

$18.590

100+ parts

$15.244

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4,324

$18.590

$15.244

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IDEA Electronic Components Group

UK . 859 parts In-Stock

1+ parts

$18.590

100+ parts

$17.660

1k+ parts

$16.731

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859

$18.590

$17.660

$16.731

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Corohmni

South Africa . 435 parts In-Stock

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$31.929

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435

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Perfect Parts

USA . 2,962 parts In-Stock

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2,962

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Microchip USA

USA . 1,927 parts In-Stock

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1,927

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Corphita

USA . 1,797 parts In-Stock

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Overview

Unlock the power of seamless data transmission with the SN74AHC125PWRE4 by Texas Instruments. Crafted with precision and expertise, this bus driver and transceiver ensures reliable performance in a variety of applications. From automotive to industrial settings, this versatile component offers unparalleled value and efficiency. With its advanced technology and high-quality construction, customers can trust in the seamless operation and longevity of their systems. Elevate your projects with the SN74AHC125PWRE4 – the perfect choice for innovation and reliability.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Provides durability and resistance to environmental factors, making it suitable for automotive applications.

Propagation Delay At Nominal Supply

8.5 ns - Fast propagation delay ensures quick response times in data transmission.

Surface Mount

YES - Allows for easy installation and space-saving design on PCBs.

No. of Functions

4 - Offers multiple functions in a single device, reducing the need for additional components.

Package Shape

RECTANGULAR - Compact shape allows for efficient use of board space.

Nominal Supply Voltage / Vsup (V)

3.3 - Compatible with standard supply voltages, ensuring easy integration into existing systems.

Load Capacitance (CL)

50 pF - Suitable for driving loads with capacitance requirements, ensuring stable performance.

Power Supplies (V)

2/5.5 - Wide range of power supply voltages allows for flexibility in different operating conditions.

No. of Terminals

14 - Sufficient terminals for connecting to external components and interfacing with other devices.

Package Style (Meter)

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Compact package style saves space on the PCB and allows for densely packed designs.

Maximum I (ol)

8 Amp - High output current capability ensures compatibility with a wide range of loads.

Propagation Delay (tpd)

13 ns - Low propagation delay enables high-speed data transmission for efficient communication.

Maximum Operating Temperature

125 °C - Wide operating temperature range makes it suitable for automotive applications.

Output Characteristics

3-STATE - Three-state output allows for high impedance for bus sharing applications.

Minimum Operating Temperature

40 °C - Operates effectively in low-temperature environments, making it suitable for various conditions.

Terminal Finish

Nickel/Palladium/Gold (Ni/Pd/Au) - Provides corrosion resistance and ensures reliable connections.

Terminal Position

DUAL - Dual terminal position for easy soldering and connection to the PCB.

No. of Ports

2 - Multiple ports for connecting to different devices or systems, enhancing versatility.

Maximum Seated Height

1.2 mm - Low profile design for compact installations and space-constrained applications.

Width

4.4 mm - Compact width for efficient usage of PCB real estate.

Output Polarity

TRUE - True output polarity ensures accurate data transmission.

Minimum Supply Voltage (Vsup)

2 V - Low minimum supply voltage for energy-efficient operation.

Peak Reflow Temperature °C

260 - High peak reflow temperature for durable and reliable solder joints.

Length

5 mm - Compact length for space-saving PCB design.

Temperature Grade

AUTOMOTIVE - Meets automotive industry standards for reliability and performance in automotive applications.

Technology

CMOS - CMOS technology for low power consumption and high noise immunity.

Terminal Form

GULL WING - Gull wing terminals for easy soldering and robust mechanical connection.

Packing Method

TR - Tape and reel packaging for convenient handling and automated assembly.

Terminal Pitch

0.65 mm - Fine terminal pitch for compact layout and high-density PCB designs.

Count Direction

UNIDIRECTIONAL - Unidirectional count direction for simplified operation and control.

Control Type

ENABLE LOW - Active low control type for compatibility with standard logic levels.

Maximum Supply Voltage (Vsup)

5.5 V - High maximum supply voltage for robust operation and compatibility with various systems.

Maximum Power Supply Current (ICC)

0.04 mA - Low power supply current for energy-efficient performance.

Technical Specifications

Bus Driver & Transceivers SN74AHC125PWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74AHC125PWRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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