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74LVC1G125GW,165

NXP Semiconductors

74LVC1G125GW,165 by NXP Semiconductors

74LVC1G125GW,165 by NXP Semiconductors is a bus driver & transceiver with a propagation delay of 6 ns and a load capacitance of 50 pF. It is commonly used in automotive applications due to its small size and low power consumption.

Median Price

$0.048

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DigiKey

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Chip Stock

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Anansix

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Nova Conductors

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Ampacity Inc.

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India . 478 parts In-Stock

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One Stop Electronics

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South Africa . 463 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,794 parts In-Stock

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Advanced Electronics

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Overview

Discover the power and reliability of the 74LVC1G125GW,165 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers exceptional quality and performance with this bus driver & transceiver. With its small outline and thin profile package, this versatile device allows for seamless integration into various applications. Experience fast propagation delay and true output polarity, ensuring efficient signal transmission. With its wide operating temperature range and automotive-grade technology, this product is built to withstand even the harshest environments. Trust in NXP Semiconductors to provide you with the value, benefits, and advantages you need for your next project. Upgrade your electronics today with the 74LVC1G125GW,165!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY -

This product is made with a durable and robust plastic/epoxy package body material, ensuring its reliability and long lifespan.

Propagation Delay At Nominal Supply: 6 ns -

With a propagation delay of just 6 ns, this product operates with exceptional speed, making it ideal for high-performance applications.

Surface Mount: YES -

Being surface mount compatible, this product offers easy installation and facilitates space-saving designs, making it a convenient choice for compact systems.

No. of Functions: 1 -

Featuring a single function, this bus driver and transceiver simplifies system designs and enhances overall efficiency.

Package Shape: RECTANGULAR -

The rectangular package shape provides compatibility with standard mounting techniques, making this product easy to integrate into various systems and applications.

No. of Bits: 1 -

Designed with one bit, this bus driver and transceiver is suitable for single-bit data transmission and offers a cost-effective solution for your communication needs.

Nominal Supply Voltage / Vsup (V): 1.8 -

Operating at a nominal supply voltage of 1.8V, this product ensures efficient power consumption and compatibility with low-voltage systems, making it an energy-efficient choice.

Load Capacitance (CL): 50 pF -

The load capacitance of 50 pF allows this bus driver and transceiver to effectively drive external loads, ensuring reliable and accurate data transmissions.

Power Supplies (V): 3.3 -

With a power supply voltage of 3.3V, this product is compatible with standard power sources, providing ease of integration and versatile usage.

No. of Terminals: 5 -

Featuring five terminals, this bus driver and transceiver effortlessly connects with other components, simplifying system interconnections and reducing complexity.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH -

The small outline, thin profile, and shrink pitch package style of this product allow for compact designs and easy assembly, making it suitable for space-constrained applications.

Maximum I (ol): 24 Amp -

With a maximum output current of 24 Amps, this bus driver and transceiver can drive large loads, ensuring robust and reliable signal transmission.

Propagation Delay (tpd): 10.5 ns -

This product boasts a propagation delay of only 10.5 ns, enabling fast and efficient signal propagation across connected devices, making it suitable for time-sensitive applications.

Maximum Operating Temperature: 125 °C -

This bus driver and transceiver can operate reliably at high temperatures up to 125°C, making it a durable and dependable choice for demanding environments.

Output Characteristics: 3-STATE -

Featuring 3-STATE output characteristics, this product allows for high impedance operation, enabling multiple devices to share a common bus and reducing interference.

Minimum Operating Temperature: -40 °C -

With a minimum operating temperature of -40°C, this bus driver and transceiver can function in extreme cold environments, ensuring reliable operation even in harsh conditions.

Terminal Finish: Tin (Sn) -

The tin terminal finish of this product provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections and long-term functionality.

Terminal Position: DUAL -

Equipped with dual terminal positions, this bus driver and transceiver allows for versatile PCB layout options, enhancing flexibility during system design and assembly.

No. of Ports: 2 -

Featuring two ports, this product enables simultaneous data transmission/response between multiple devices, facilitating efficient and seamless communication.

Maximum Seated Height: 1.1 mm -

With a maximum seated height of 1.1 mm, this bus driver and transceiver offers a low-profile design, allowing for space-efficient integration within compact electronics.

Width: 1.25 mm -

Measuring just 1.25 mm in width, this product boasts a small form factor, enabling it to be used in space-limited applications without compromising functionality.

Output Polarity: TRUE -

The true output polarity of this bus driver and transceiver ensures accurate signal transmission, reducing errors and enhancing system reliability.

Minimum Supply Voltage (Vsup): 1.65 V -

Operating with a minimum supply voltage of 1.65V, this product is suitable for low-power applications, offering energy efficiency and extended battery life.

Maximum Time At Peak Reflow Temperature (s): 30 -

With a maximum allowable time of 30 seconds at peak reflow temperature, this bus driver and transceiver can withstand soldering processes, simplifying assembly and ensuring reliable manufacturing.

Peak Reflow Temperature °C: 260 -

This product can endure peak reflow temperatures of up to 260°C, making it compatible with industry-standard soldering techniques and ensuring reliable mechanical connections.

Length: 2.05 mm -

With a length of 2.05 mm, this compact bus driver and transceiver allows for efficient use of circuit board space, maintaining a small footprint in your designs.

Temperature Grade: AUTOMOTIVE -

Designed and rated for automotive applications, this bus driver and transceiver can withstand the rigorous demands and temperature fluctuations in automotive environments, offering reliable communication in automotive systems.

Technology: CMOS -

Built using CMOS technology, this bus driver and transceiver offers low power consumption, high noise tolerance, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING -

The gull wing terminal form of this product provides strong mechanical stability and enables easier inspection during manufacturing, ensuring high-quality connections and reliable performance.

Packing Method: TR -

Packaged in tape and reel format, this bus driver and transceiver offers convenience during manufacturing and ensures safe transportation, reducing the risk of damage during handling.

Terminal Pitch: 0.65 mm -

With a terminal pitch of 0.65 mm, this product can be easily mounted onto standard PCBs, allowing for straightforward integration into various electronic designs.

Control Type: ENABLE LOW -

This bus driver and transceiver utilizes an enable low control type, enabling simplified system integration and reliable data transmission control.

Moisture Sensitivity Level (MSL): 1 -

Featuring a moisture sensitivity level of 1, this product is moisture-resistant, making it suitable for a wide range of environments and ensuring long-term reliability.

Maximum Supply Voltage (Vsup): 5.5 V -

Designed to operate with a maximum supply voltage of 5.5V, this product offers versatility and compatibility with various power sources, allowing for flexible application in diverse systems.

Technical Specifications

Bus Driver & Transceivers 74LVC1G125GW,165 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74LVC1G125GW,165 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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