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SN74LV1T125DBVRG4

Texas Instruments

SN74LV1T125DBVRG4 by Texas Instruments

SN74LV1T125DBVRG4 by Texas Instruments is a 3-STATE bus driver with 8A max I (ol) and 15.5ns propagation delay. It operates b/w -40 to 125 °C, suitable for automotive applications due to its low profile package style and CMOS technology.

Median Price

$0.228

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 758 parts In-Stock

1+ parts

$0.198

100+ parts

$0.192

1k+ parts

$0.113

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758

$0.198

$0.192

$0.113

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Mouser Electronics

USA . 586 parts In-Stock

1+ parts

$0.560

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-

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$0.460

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$0.354

586

$0.560

-

$0.460

$0.354

Chip1Stop

Japan . 1,300 parts In-Stock

1+ parts

-

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$0.257

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$0.176

10k+ parts

$0.155

1,300

-

$0.257

$0.176

$0.155

Verical

USA . 758 parts In-Stock

1+ parts

-

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$0.192

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$0.113

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758

-

$0.192

$0.113

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Distributors (In-Stock)

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Digiode

USA . 2,823 parts In-Stock

1+ parts

$0.185

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-

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2,823

$0.185

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Nova Conductors

Japan . 10 parts In-Stock

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$0.434

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10

$0.434

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Chip Stock

USA . 74,710 parts In-Stock

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Semtec, LLC

USA . 9,659 parts In-Stock

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Vyrian

USA . 4,229 parts In-Stock

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4,229

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Bristol Electronics

USA . 2,050 parts In-Stock

1+ parts

-

100+ parts

$0.422

1k+ parts

$0.315

10k+ parts

$0.292

2,050

-

$0.422

$0.315

$0.292

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,951 parts In-Stock

1+ parts

$0.176

100+ parts

-

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$0.176

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Semicontronic

India . 4,175 parts In-Stock

1+ parts

$0.230

100+ parts

$0.224

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$0.223

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4,175

$0.230

$0.224

$0.223

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Ampacity Inc.

Singapore . 4,036 parts In-Stock

1+ parts

$0.230

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-

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4,036

$0.230

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Modulus Dynamics

Lithuania . 24 parts In-Stock

1+ parts

$0.363

100+ parts

$0.360

1k+ parts

$0.349

10k+ parts

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24

$0.363

$0.360

$0.349

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Continental Prestige Electronics

USA . 5,738 parts In-Stock

1+ parts

$0.434

100+ parts

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$0.425

5,738

$0.434

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$0.425

Argo Parts USA

USA . 4,607 parts In-Stock

1+ parts

$0.434

100+ parts

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$0.421

4,607

$0.434

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$0.421

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.434

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$0.425

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2,000

$0.434

$0.425

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Andel Nordic

Denmark . 450 parts In-Stock

1+ parts

$8.269

100+ parts

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$7.938

10k+ parts

$7.938

450

$8.269

-

$7.938

$7.938

Corohmni

South Africa . 297 parts In-Stock

1+ parts

$16.149

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$16.149

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Parana Technologies

USA . 2,054 parts In-Stock

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$19.815

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$19.774

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2,054

$19.815

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$19.774

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ChromeModa Solutions

Germany . 922 parts In-Stock

1+ parts

$22.264

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$18.256

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922

$22.264

$18.256

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IDEA Electronic Components Group

UK . 878 parts In-Stock

1+ parts

$22.264

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$21.151

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$20.038

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878

$22.264

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$20.038

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$32.554

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$30.926

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$30.926

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Lixinc

USA . 16,757 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Microchip USA

USA . 2,488 parts In-Stock

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DigiPath Technology Company

USA . 2,102 parts In-Stock

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$20.073

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Robosynatics

Brazil . 10 parts In-Stock

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Lucentia Tech

USA . 10 parts In-Stock

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$73.050

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$73.050

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$73.050

10

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$73.050

$73.050

$73.050

Overview

Enhance your electronic projects with the SN74LV1T125DBVRG4 from Texas Instruments, a leading manufacturer known for superior quality and reliability. This bus driver & transceiver offers seamless communication between different parts of your circuit, ensuring efficient data transmission. Its compact design and wide temperature range make it ideal for automotive applications. With low power consumption and high output characteristics, this component provides exceptional value and performance to meet all your project needs. Upgrade your electronics with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making this product suitable for rugged environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low voltage, making it energy-efficient and suitable for battery-powered applications.

Maximum I (ol): 8 Amp

Can handle high output currents, ensuring robust performance.

Propagation Delay (tpd): 15.5 ns

Low propagation delay enables fast data transmission, making this product ideal for high-speed applications.

Maximum Operating Temperature: 125 °C

Designed to operate at high temperatures, making it suitable for automotive and industrial applications.

Output Characteristics: 3-STATE

3-State output allows for flexibility in controlling the output signal, adding versatility to the product.

Terminal Position: DUAL

Dual terminal position enables easy connection to the circuit, enhancing convenience during installation.

Width: 1.6 mm

Compact width saves space on the circuit board, making this product suitable for designs with tight constraints.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Bus Driver & Transceivers SN74LV1T125DBVRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.0055 mA

Propagation Delay (tpd):

15.5 ns

Maximum Seated Height:

1.45 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.6 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

SN74LV1T125DBVRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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