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SN74LVC2G125DCTRE4

Texas Instruments

SN74LVC2G125DCTRE4 by Texas Instruments

SN74LVC2G125DCTRE4 by Texas Instruments is a 2-function bus driver & transceiver with a propagation delay of 4.3 ns and a load capacitance of 50 pF. It is commonly used in industrial applications due to its small outline, low profile package style and industrial temperature grade.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,695 parts In-Stock

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7,695

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Digiode

USA . 4,583 parts In-Stock

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4,583

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LWI Electronics Inc

India . 95 parts In-Stock

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95

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Nova Conductors

Japan . 78 parts In-Stock

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78

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Andel Nordic

Denmark . 3,176 parts In-Stock

1+ parts

$7.099

100+ parts

-

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$6.815

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$6.815

3,176

$7.099

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$6.815

$6.815

Ampacity Inc.

Singapore . 1,018 parts In-Stock

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$17.000

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1,018

$17.000

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AZTECH Wire

Italy . 726 parts In-Stock

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$17.579

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726

$17.579

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Parana Technologies

USA . 642 parts In-Stock

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$17.686

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$17.873

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642

$17.686

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$17.873

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ChromeModa Solutions

Germany . 3,427 parts In-Stock

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$19.872

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$16.295

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$19.872

$16.295

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IDEA Electronic Components Group

UK . 1,197 parts In-Stock

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$19.872

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$18.878

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$17.885

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$19.872

$18.878

$17.885

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One Stop Electronics

USA . 557 parts In-Stock

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$25.000

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557

$25.000

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Advanced Electronics

New Zealand . 550 parts In-Stock

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$28.293

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$26.878

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$26.878

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$28.293

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$26.878

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Corohmni

South Africa . 913 parts In-Stock

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$31.477

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913

$31.477

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Semicontronic

India . 1,109 parts In-Stock

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$59.000

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$57.525

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$57.230

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Continental Prestige Electronics

USA . 5,411 parts In-Stock

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Corphita

USA . 4,011 parts In-Stock

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DigiPath Technology Company

USA . 1,704 parts In-Stock

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$17.917

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$17.917

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Argo Parts USA

USA . 948 parts In-Stock

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948

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

USA . 150 parts In-Stock

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$8.900

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$8.900

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$8.900

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$8.900

$8.900

Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Discover the SN74LVC2G125DCTRE4 by Texas Instruments, a cutting-edge Bus Driver & Transceiver that brings quality and reliability to your applications. As a leading manufacturer, Texas Instruments ensures top-notch performance and durability. This versatile device offers 2 functions and 3-STATE output characteristics, allowing for seamless communication between different components. With a small outline and low profile package style, it is space-saving and easy to install. From industrial automation to consumer electronics, this product delivers exceptional value, benefits, and advantages, making it the perfect choice for your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the bus driver and transceiver, making it suitable for industrial applications.

Propagation Delay At Nominal Supply: 4.3 ns

Low propagation delay ensures fast signal transmission, making the bus driver and transceiver efficient for data communication.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard supply voltage of 3.3V, ensuring compatibility with a wide range of systems and devices.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance state, providing flexibility in controlling the bus driver and transceiver outputs.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the bus driver and transceiver energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74LVC2G125DCTRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

Length:

2.95 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP8,.16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.3 ns

Propagation Delay (tpd):

9.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.3 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

2.8 mm

Trade Compliance

SN74LVC2G125DCTRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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