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SN74LV1T34DCKR

Texas Instruments

SN74LV1T34DCKR by Texas Instruments

SN74LV1T34DCKR by Texas Instruments is a CMOS bus driver with 14.5 ns propagation delay, suitable for automotive applications. It operates at a supply voltage range of 1.6V to 5.5V and has a max power supply current of 0.0055 mA. This small outline package with dual terminals is ideal for surface mount designs requiring fast signal transmission.

Median Price

$0.300

Lifecycle Status

Suppliers In-Stock

30

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 89,371 parts In-Stock

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$0.300

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$0.158

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$0.132

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$0.119

89,371

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Mouser Electronics

USA . 81,625 parts In-Stock

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$0.158

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Arrow

USA . 767 parts In-Stock

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$0.310

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767

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Newark

USA . 5,925 parts In-Stock

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$0.373

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RS (Exports)

UK . 38,375 parts In-Stock

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Chip1Stop

Japan . 453 parts In-Stock

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Element14

Singapore . 250 parts In-Stock

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Ozdisan Elektronik

Türkiye . 7,287 parts In-Stock

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$0.094

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Maritex

Poland . 2,651 parts In-Stock

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$0.049

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$0.045

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$0.039

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Mobius Materials

USA . 9,098 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Digiode

USA . 1,743 parts In-Stock

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Component Electronics Inc.

Canada . 37 parts In-Stock

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$0.290

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$0.250

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Forefront Electronics and Design

USA . 2 parts In-Stock

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$1.720

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Chip Stock

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Semtec, LLC

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Martec Srl

Italy . 69,431 parts In-Stock

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Vyrian

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NAC Semi

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Cyclops Electronics Ltd

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ComSIT Distribution GmbH

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PC Components Company LLC

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Bristol Electronics

USA . 1,002 parts In-Stock

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Atlantic Semiconductor

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Sensible Micro Corp

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Microfarads

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Rebound Electronics

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Prism Electronics

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Holdelec - ElecDif-Pro

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Distributors (Availability)

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Semicontronic

India . 57,979 parts In-Stock

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$0.097

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Ampacity Inc.

Singapore . 48,499 parts In-Stock

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Argo Parts USA

USA . 4,065 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Corphita

USA . 4,132 parts In-Stock

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Component Stockers USA

USA . 406 parts In-Stock

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Corohmni

South Africa . 417 parts In-Stock

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Modulus Dynamics

Lithuania . 1,333 parts In-Stock

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$21.379

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$21.379

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$21.379

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Parana Technologies

USA . 2,204 parts In-Stock

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$21.466

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$21.842

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DigiPath Technology Company

USA . 635 parts In-Stock

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$23.637

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$21.746

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$23.637

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ChromeModa Solutions

Germany . 1,815 parts In-Stock

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$24.119

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$19.778

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IDEA Electronic Components Group

UK . 369 parts In-Stock

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$24.119

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$22.913

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$21.707

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369

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$26.424

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$25.102

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$25.102

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$26.424

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Perfect Parts

USA . 87,375 parts In-Stock

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Allen Electronics Distributors

USA . 40,625 parts In-Stock

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$0.276

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GreenTree Electronics

Israel . 16,326 parts In-Stock

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Lixinc

USA . 15,034 parts In-Stock

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S.R.D Solutions

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iodParts Technologies Inc.

India . 8,060 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kepictronics

USA . 3,518 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,143 parts In-Stock

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Continental Prestige Electronics

USA . 1,765 parts In-Stock

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$0.184

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$0.111

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$0.082

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Robosynatics

Brazil . 1,377 parts In-Stock

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1,377

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Lucentia Tech

USA . 1,377 parts In-Stock

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$32.295

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$31.636

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$31.636

1,377

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$31.636

$31.636

Infinite Electronics LLP (Excess)

. 134 parts In-Stock

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Overview

Unlock seamless data transmission with the Texas Instruments SN74LV1T34DCKR Bus Driver & Transceivers. Crafted with precision and reliability in mind, Texas Instruments leads the industry in creating top-notch electronic components. Ideal for automotive applications and beyond, this innovative product boasts a low propagation delay of 14.5 ns, ensuring efficient performance. Experience the unmatched value and benefits of this compact and high-quality device, providing customers with a reliable solution for their connectivity needs. Elevate your projects with the SN74LV1T34DCKR and trust in Texas Instruments' commitment to excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various operating conditions.

Propagation Delay At Nominal Supply: 14.5 ns

Low propagation delay ensures fast and efficient data transmission within the bus system.

Surface Mount: YES

Surface mount capability makes installation and integration easier, saving time and effort.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space and easy alignment during installation.

Nominal Supply Voltage / Vsup (V): 1.8

Operates efficiently at a low nominal supply voltage, making it suitable for power-sensitive applications.

Load Capacitance (CL): 30 pF

Suitable load capacitance ensures compatibility with a wide range of devices and systems.

Power Supplies (V): 3.3

Can be powered by a common voltage supply of 3.3V, simplifying power management in the overall system.

No. of Terminals: 5

Optimal number of terminals for connections, ensuring ease of integration and installation.

Maximum I (ol): 8 Amp

High maximum output current allows for driving multiple devices or components without the need for additional amplification.

Propagation Delay (tpd): 14.5 ns

Consistent propagation delay ensures reliable and synchronized data transmission across connected devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range makes it suitable for automotive applications where temperature fluctuations may occur.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range allows for reliable performance in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish ensures good conductivity and resistance to corrosion, extending the product's lifespan.

No. of Ports: 2

Having two ports allows for versatile connectivity options and potential expansion of the bus system.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for various electronic applications.

Temperature Grade: AUTOMOTIVE

Specifically designed for automotive use, meeting industry standards for performance and reliability in vehicle applications.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for compact design and efficient use of space on the circuit board.

Technical Specifications

Bus Driver & Transceivers SN74LV1T34DCKR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Inputs:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR, 7 INCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.0055 mA

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.6 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LV1T34DCKR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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