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M74VHCT240ADTR2G

Onsemi

M74VHCT240ADTR2G by Onsemi

M74VHCT240ADTR2G by Onsemi is a CMOS bus driver with 10ns propagation delay, 4-bit functionality, and 8A output current. It operates at -40 to 85 °C, suitable for industrial applications requiring inverted output polarity and 3-STATE characteristics. The small outline package with 0.635mm terminal pitch makes it ideal for surface mount designs in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,249 parts In-Stock

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Vyrian

USA . 2,138 parts In-Stock

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Kulean Microsystems

USA . 8,299 parts In-Stock

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SupplyDigital Components

Austria . 7,922 parts In-Stock

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TANS Electronics

Latvia . 7,205 parts In-Stock

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Problanco Electronics

Mexico . 6,784 parts In-Stock

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Corphita

USA . 1,228 parts In-Stock

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UHIMA Technologies

Türkiye . 343 parts In-Stock

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Corohmni

South Africa . 307 parts In-Stock

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Overview

Unlock the power of efficient data transmission with the M74VHCT240ADTR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality bus drivers & transceivers that guarantee reliable performance. This versatile product boasts a range of applications, from industrial automation to telecommunications. With a fast propagation delay and 3-STATE output characteristics, this component ensures seamless operation. Experience the value of superior technology and precision engineering with the M74VHCT240ADTR2G, your solution for high-performance data transfer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for rugged environments and reducing overall weight of the device.

Propagation Delay At Nominal Supply: 10 ns

Low propagation delay ensures quick and efficient data transmission, making this product ideal for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions in a single component reduces the need for additional components, simplifying the overall design and potentially lowering costs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes integration with other components easier and more standardized.

Load Capacitance (CL): 50 pF

Optimal load capacitance helps in achieving stable and reliable operation, ensuring consistent performance in various conditions.

No. of Terminals: 20

Having a sufficient number of terminals allows for versatile connectivity options and greater flexibility in circuit design.

Maximum I (ol): 8 Amp

High output current capability enables driving of loads with higher power requirements, expanding the range of applications this product can be used in.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and continue to function reliably.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, giving flexibility in controlling the output signal and reducing interference in multi-driver configurations.

Technical Specifications

Bus Driver & Transceivers M74VHCT240ADTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

JESD-30 Code:

R-PDSO-G20

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

M74VHCT240ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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