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M74VHC1GT125DF2G-L22038

Onsemi

M74VHC1GT125DF2G-L22038 by Onsemi

M74VHC1GT125DF2G-L22038 by Onsemi is a 3-STATE bus driver with 5 terminals, operating at -55 to 125 °C. It has a load capacitance of 50 pF, max I (ol) of 80 Amp, and propagation delay of 18 ns. Ideal for applications requiring true output polarity and low enable control in compact designs.

Median Price

$0.042

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 45,000 parts In-Stock

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Mouser Electronics

USA . 36,979 parts In-Stock

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$0.042

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$0.042

DigiKey

USA . 33,000 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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$0.062

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900

$0.062

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Flip Electronics

USA . 45,000 parts In-Stock

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Vyrian

USA . 37,896 parts In-Stock

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Digiode

USA . 263 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 38,012 parts In-Stock

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$0.036

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38,012

$0.036

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Semicontronic

India . 37,990 parts In-Stock

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$0.036

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$0.035

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$0.035

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37,990

$0.036

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Corohmni

South Africa . 96 parts In-Stock

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$0.042

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Argo Parts USA

USA . 4,052 parts In-Stock

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$0.061

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$0.059

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$0.061

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Continental Prestige Electronics

USA . 273 parts In-Stock

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$0.061

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$0.060

273

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Netroflash

USA . 100 parts In-Stock

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$0.062

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$0.059

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$0.057

100

$0.062

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$0.057

Advanced Electronics

New Zealand . 500 parts In-Stock

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$23.797

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$22.607

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$22.607

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$23.797

$22.607

$22.607

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Aztec Data Supply Inc.

USA . 12,634 parts In-Stock

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$25.030

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Authorized Procurement Solutions

USA . 39,000 parts In-Stock

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SupplyDigital Components

Austria . 6,544 parts In-Stock

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iodParts Technologies Inc.

India . 6,000 parts In-Stock

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Kulean Microsystems

USA . 5,970 parts In-Stock

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Problanco Electronics

Mexico . 5,794 parts In-Stock

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Corphita

USA . 1,880 parts In-Stock

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TANS Electronics

Latvia . 1,003 parts In-Stock

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UHIMA Technologies

Türkiye . 988 parts In-Stock

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Microchip USA

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Overview

Enhance your electronic designs with the M74VHC1GT125DF2G-L22038 by Onsemi, a top-of-the-line Bus Driver & Transceiver. Manufactured with precision and quality in mind, this product offers reliable performance and versatility for various applications. Whether you're working on consumer electronics, automotive systems, or industrial equipment, this compact and efficient component delivers exceptional value and benefits to customers. Upgrade your projects with Onsemi's trusted technology and take your designs to the next level of excellence.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and ensures long product life.

Surface Mount:

YES - Easy to install and saves space on the PCB.

Package Shape:

RECTANGULAR - Fits well in compact spaces.

Nominal Supply Voltage (Vsup):

3V - Suitable for a wide range of applications.

Load Capacitance (CL):

50 pF - Ensures reliable signal transmission.

No. of Terminals:

5 - Simplifies connection process.

Package Style:

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Ideal for applications with space constraints.

Maximum I (ol):

80 Amp - Can handle high currents efficiently.

Propagation Delay (tpd):

18 ns - Ensures fast signal transmission.

Maximum Operating Temperature:

125 °C - Suitable for high-temperature environments.

Output Characteristics:

3-STATE - Allows for flexibility in signal output.

Minimum Operating Temperature:

55 °C - Works well in low-temperature conditions.

Terminal Finish:

MATTE TIN - Provides corrosion resistance.

Terminal Position:

DUAL - Facilitates easy connection.

No. of Ports:

2 - Allows for multiple connections.

Maximum Seated Height:

1.1 mm - Low-profile design for space-saving installations.

Width:

1.25 mm - Compact size for versatile applications.

Output Polarity:

TRUE - Ensures correct signal output.

Minimum Supply Voltage (Vsup):

2V - Can operate at low voltages.

Maximum Time At Peak Reflow Temperature:

30s - Resistant to high-temperature soldering processes.

Peak Reflow Temperature:

260C - Can withstand high-temperature reflow processes.

Length:

2 mm - Compact design for space-constrained applications.

Technology:

CMOS - Offers low power consumption and fast switching speeds.

Terminal Form:

GULL WING - Facilitates easy soldering.

Packing Method:

TR - Convenient packaging for transportation and storage.

Terminal Pitch:

0.65 mm - Allows for precise connections.

Count Direction:

UNIDIRECTIONAL - Ensures one-way signal transmission.

Control Type:

ENABLE LOW - Easy to control signal output.

Maximum Supply Voltage (Vsup):

5.5V - Can handle higher voltage inputs.

Maximum Power Supply Current (ICC):

50 mA - Efficient power usage for longer product life.

Technical Specifications

Bus Driver & Transceivers M74VHC1GT125DF2G-L22038 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

80 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

18 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

M74VHC1GT125DF2G-L22038 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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