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74LVC1G125GW,115

NXP Semiconductors

74LVC1G125GW,115 by NXP Semiconductors

NXP Semiconductors' 74LVC1G125GW,115 is a CMOS bus driver with 10.5 ns propagation delay and 3-STATE output. It operates b/w -40 to 125 °C and supports a supply voltage range of 1.65V to 5.5V, making it ideal for automotive applications requiring fast signal transmission in compact spaces.

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Lifecycle Status

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6

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1k+

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Chip Stock

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Anansix

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Vyrian

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Nova Conductors

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AZTECH Wire

Italy . 708 parts In-Stock

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Andel Nordic

Denmark . 3,796 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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Corohmni

South Africa . 633 parts In-Stock

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Aztec Data Supply Inc.

USA . 77 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 476 parts In-Stock

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Ampacity Inc.

Singapore . 713 parts In-Stock

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Corphita

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Argo Parts USA

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Continental Prestige Electronics

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Bastille Electronics

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Overview

Unlock the power of seamless communication with the 74LVC1G125GW,115 by NXP Semiconductors. As a leader in semiconductor technology, NXP delivers top-quality products that guarantee reliability and efficiency. This bus driver & transceiver is designed to meet the demands of various applications, providing a solution that ensures optimal performance. Experience the value and benefits of this compact and versatile component, offering true output polarity and a 3-state configuration for enhanced functionality. Trust NXP Semiconductors for innovative solutions that drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications in the automotive industry.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V provides a stable power source for the device, ensuring consistent performance under various operating conditions.

Propagation Delay (tpd): 10.5 ns

With a quick propagation delay of 10.5 ns, the transceiver can efficiently transmit data signals and handle high-speed communication in bus driver applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliability and performance in harsh automotive environments where temperature fluctuations are common.

Technology: CMOS

The use of CMOS technology results in low power consumption, making the device energy-efficient and suitable for battery-powered systems in automotive applications.

Technical Specifications

Bus Driver & Transceivers 74LVC1G125GW,115 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

Length:

2.05 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

10.5 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74LVC1G125GW,115 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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