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M74VHC1G126DFT1G

Onsemi

M74VHC1G126DFT1G by Onsemi

M74VHC1G126DFT1G by Onsemi is a 3-STATE bus driver with 5 terminals, operating at temperatures from -55 to 125 °C. It has a propagation delay of 16 ns and can handle load capacitance of 50 pF. Ideal for applications requiring true output polarity and enable high control type in military-grade environments.

Median Price

$0.087

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$0.087

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Chip Stock

USA . 40,598 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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Digiode

USA . 2,323 parts In-Stock

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Vyrian

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PC Components Company LLC

USA . 100 parts In-Stock

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Bristol Electronics

USA . 55 parts In-Stock

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Sensible Micro Corp

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,641 parts In-Stock

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$0.086

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$0.085

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$0.086

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$0.085

Argo Parts USA

USA . 1,388 parts In-Stock

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$0.086

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$0.084

1,388

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$0.084

Netroflash

USA . 500 parts In-Stock

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$0.087

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$0.083

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$0.081

500

$0.087

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$0.083

$0.081

Microchip USA

USA . 441 parts In-Stock

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$0.410

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AZTECH Wire

Italy . 811 parts In-Stock

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$12.948

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Ampacity Inc.

Singapore . 860 parts In-Stock

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$15.000

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Aztec Data Supply Inc.

USA . 199 parts In-Stock

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$16.610

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$31.990

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$29.111

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$26.232

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Semicontronic

India . 158 parts In-Stock

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$58.000

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$56.550

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$56.260

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RC Electronics

USA . 89,623 parts In-Stock

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Lixinc

USA . 18,504 parts In-Stock

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Problanco Electronics

Mexico . 6,108 parts In-Stock

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Kulean Microsystems

USA . 4,689 parts In-Stock

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Corphita

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SupplyDigital Components

Austria . 1,839 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

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TANS Electronics

Latvia . 1,774 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,200 parts In-Stock

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UHIMA Technologies

Türkiye . 572 parts In-Stock

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Kepictronics

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Corohmni

South Africa . 190 parts In-Stock

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Overview

Discover the ultimate solution for your bus driver & transceiver needs with the M74VHC1G126DFT1G by Onsemi. Crafted with precision and quality, this product offers unparalleled performance and reliability. Whether you're in automotive, industrial, or consumer electronics, this versatile component will elevate your designs to new heights. Embrace the value of efficiency and innovation with Onsemi's cutting-edge technology, providing you with the competitive edge you need to succeed. Elevate your projects with the M74VHC1G126DFT1G and experience excellence like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the bus driver & transceivers.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and ensuring a secure connection.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without compromising performance, making it suitable for various environmental conditions.

Propagation Delay: 16 ns

Low propagation delay ensures quick and efficient signal transmission, reducing latency and improving overall system performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the bus driver & transceivers energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers M74VHC1G126DFT1G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

M74VHC1G126DFT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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