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NLVVHC1G126DFT1G

Onsemi

NLVVHC1G126DFT1G by Onsemi

NLVVHC1G126DFT1G by Onsemi is a 3-STATE bus driver with 5 terminals, operating at -55 to 125 °C. It has a load capacitance of 50 pF and max I (ol) of 8 Amp, suitable for military-grade applications requiring true output polarity control.

Median Price

$0.044

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 6,105 parts In-Stock

1+ parts

$0.310

100+ parts

$0.111

1k+ parts

$0.071

10k+ parts

$0.049

6,105

$0.310

$0.111

$0.071

$0.049

Mouser Electronics

USA . 41,802 parts In-Stock

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$0.044

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$0.044

Flip Electronics (Authorized)

USA . 30,000 parts In-Stock

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Arrow

USA . 15,000 parts In-Stock

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$0.041

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$0.041

Verical

USA . 15,000 parts In-Stock

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$0.041

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$0.041

Chip1Stop

Japan . 15,000 parts In-Stock

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$0.044

15,000

-

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$0.044

Rochester

USA . 6,185 parts In-Stock

1+ parts

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100+ parts

$0.044

1k+ parts

$0.036

10k+ parts

$0.033

6,185

-

$0.044

$0.036

$0.033

Element14

Singapore . 1,285 parts In-Stock

1+ parts

-

100+ parts

$0.105

1k+ parts

$0.071

10k+ parts

$0.047

1,285

-

$0.105

$0.071

$0.047

Farnell

UK . 15 parts In-Stock

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Digiode

USA . 2,332 parts In-Stock

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$0.034

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$0.034

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Nova Conductors

Japan . 500 parts In-Stock

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$0.190

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Bristol Electronics

USA . 34,025 parts In-Stock

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Flip Electronics

USA . 30,000 parts In-Stock

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Vyrian

USA . 14,241 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 14,547 parts In-Stock

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$0.031

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Corphita

USA . 554 parts In-Stock

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$0.032

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554

$0.032

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Corohmni

South Africa . 201 parts In-Stock

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$0.036

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$0.036

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Netroflash

USA . 1,000 parts In-Stock

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$0.190

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$0.190

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Argo Parts USA

USA . 860 parts In-Stock

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$0.190

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$0.184

860

$0.190

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$0.184

Continental Prestige Electronics

USA . 2,975 parts In-Stock

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$0.316

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$0.099

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$0.080

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$0.075

2,975

$0.316

$0.099

$0.080

$0.075

Vigor

Singapore . 510 parts In-Stock

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$0.490

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510

$0.490

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Microchip USA

USA . 3,829 parts In-Stock

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$0.955

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$0.955

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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TANS Electronics

Latvia . 7,534 parts In-Stock

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Kulean Microsystems

USA . 7,343 parts In-Stock

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Problanco Electronics

Mexico . 6,842 parts In-Stock

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Infinite Electronics LLP (Excess)

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SupplyDigital Components

Austria . 4,528 parts In-Stock

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UHIMA Technologies

Türkiye . 837 parts In-Stock

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Overview

Discover the exceptional quality and reliability of the NLVVHC1G126DFT1G by Onsemi, a leading manufacturer in the industry. This innovative Bus Driver & Transceiver offers seamless communication and control, making it ideal for a wide range of applications. With a compact design and advanced features, this product delivers unparalleled performance and efficiency. Experience the value and benefits of this cutting-edge solution and elevate your projects to the next level with Onsemi's NLVVHC1G126DFT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver & transceiver.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V allows for efficient power consumption and operation.

Propagation Delay (tpd): 16 ns

The low propagation delay ensures speedy data transmission and communication.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Minimum Operating Temperature: -55 °C

The wide range of minimum operating temperature allows for the bus driver & transceiver to be used in various climates.

Technical Specifications

Bus Driver & Transceivers NLVVHC1G126DFT1G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

16 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NLVVHC1G126DFT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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