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NLVVHC1GT125DT1G

Onsemi

NLVVHC1GT125DT1G by Onsemi

NLVVHC1GT125DT1G by Onsemi is a 5-terminal bus driver with 3-STATE output, operating at -55 to 125 °C. It has a load capacitance of 50 pF and max I (ol) of 80 Amp, suitable for military applications requiring true output polarity control.

Median Price

$0.150

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 165,000 parts In-Stock

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Flip Electronics (Authorized)

USA . 165,000 parts In-Stock

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EBV Elektronik

Germany . 9,000 parts In-Stock

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Ozdisan Elektronik

Türkiye . 8 parts In-Stock

1+ parts

$0.036

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8

$0.036

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Vyrian

USA . 1,473 parts In-Stock

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$0.150

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Flip Electronics

USA . 165,000 parts In-Stock

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Digiode

USA . 2,193 parts In-Stock

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Bristol Electronics

USA . 275 parts In-Stock

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$0.131

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275

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$0.131

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Distributors (Availability)

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Corohmni

South Africa . 112 parts In-Stock

1+ parts

$0.036

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112

$0.036

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Ampacity Inc.

Singapore . 112,588 parts In-Stock

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$0.128

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Vigor

Singapore . 536 parts In-Stock

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$0.150

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536

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Component Stockers USA

USA . 34 parts In-Stock

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$0.370

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34

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Microchip USA

USA . 3,143 parts In-Stock

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$1.000

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TANS Electronics

Latvia . 8,208 parts In-Stock

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Kulean Microsystems

USA . 4,475 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 2,775 parts In-Stock

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SupplyDigital Components

Austria . 2,773 parts In-Stock

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Corphita

USA . 1,997 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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UHIMA Technologies

Türkiye . 24 parts In-Stock

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Overview

Enhance your electronic designs with the NLVVHC1GT125DT1G by Onsemi. Known for their superior quality and reliability, Onsemi delivers top-notch Bus Driver & Transceivers that are perfect for a wide range of applications. With a nominal supply voltage of 5V and a maximum operating temperature of 125 °C, this product ensures optimal performance and durability. Whether you're working on automotive electronics or industrial automation systems, this compact and efficient component offers exceptional value, benefits, and advantages to meet all your project needs. Upgrade your designs today with Onsemi's NLVVHC1GT125DT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for applications where weight is a concern.

Surface Mount: YES

Being surface mountable allows for easy installation on printed circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal voltage of 5V makes this product compatible with standard power supplies, ensuring easy integration into existing systems.

Propogation Delay (tpd): 16 ns

With a low propagation delay, this product can quickly transmit signals, making it suitable for high-speed data communication applications.

Temperature Grade: MILITARY

Designed to operate in harsh environmental conditions, the military-grade temperature rating ensures reliable performance in demanding applications.

Technical Specifications

Bus Driver & Transceivers NLVVHC1GT125DT1G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

80 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.5 mm

Trade Compliance

NLVVHC1GT125DT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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