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NLVVHC1GT126DF1G

Onsemi

NLVVHC1GT126DF1G by Onsemi

NLVVHC1GT126DF1G by Onsemi is a 3.3/5V bus driver with 16ns propagation delay, suitable for military applications. It has 5 terminals, operates at -55 to 125°C, and supports up to 8A output current. The device is AEC-Q100 compliant and features a small outline package with dual terminal position.

Median Price

$0.164

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 210 parts In-Stock

1+ parts

$0.208

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$0.161

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210

$0.208

$0.161

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Verical

USA . 9,000 parts In-Stock

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$0.157

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$0.157

Rochester

USA . 9,000 parts In-Stock

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$0.170

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$0.141

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$0.125

9,000

-

$0.170

$0.141

$0.125

Chip1Stop

Japan . 3,000 parts In-Stock

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$0.143

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$0.143

Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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$0.181

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50

$0.181

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Chip Stock

USA . 87,498 parts In-Stock

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Vyrian

USA . 7,251 parts In-Stock

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Bristol Electronics

USA . 6,000 parts In-Stock

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Flip Electronics

USA . 3,000 parts In-Stock

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Digiode

USA . 913 parts In-Stock

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913

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,562 parts In-Stock

1+ parts

$0.112

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2,562

$0.112

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Corohmni

South Africa . 130 parts In-Stock

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$0.134

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130

$0.134

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Argo Parts USA

USA . 4,074 parts In-Stock

1+ parts

$0.181

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$0.176

4,074

$0.181

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$0.176

Continental Prestige Electronics

USA . 2,330 parts In-Stock

1+ parts

$0.181

100+ parts

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$0.177

2,330

$0.181

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-

$0.177

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$0.181

100+ parts

$0.172

1k+ parts

$0.163

10k+ parts

$0.161

300

$0.181

$0.172

$0.163

$0.161

Microchip USA

USA . 3,071 parts In-Stock

1+ parts

$2.990

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3,071

$2.990

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AZTECH Wire

Italy . 1,173 parts In-Stock

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$8.500

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1,173

$8.500

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Aztec Data Supply Inc.

USA . 4,628 parts In-Stock

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$26.206

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4,628

$26.206

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Perfect Parts

USA . 8,436,749 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kepictronics

USA . 9,000 parts In-Stock

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TANS Electronics

Latvia . 7,353 parts In-Stock

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SupplyDigital Components

Austria . 3,991 parts In-Stock

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Problanco Electronics

Mexico . 2,981 parts In-Stock

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Kulean Microsystems

USA . 2,649 parts In-Stock

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Glotronic Ltd.

UK . 2,400 parts In-Stock

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Lixinc

USA . 1,965 parts In-Stock

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Corphita

USA . 463 parts In-Stock

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Vigor

Singapore . 239 parts In-Stock

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UHIMA Technologies

Türkiye . 236 parts In-Stock

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Overview

Experience seamless and reliable data transmission with the NLVVHC1GT126DF1G by Onsemi, a top-tier manufacturer known for its cutting-edge technology in bus driver & transceivers. This versatile component is designed to provide unmatched performance in various applications, offering customers exceptional value, efficiency, and advanced features. Say goodbye to connectivity issues and embrace a superior level of quality with this innovative product from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver & transceiver, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard supply voltage, making it compatible with a wide range of systems.

Power Supplies (V): 3.3/5

Supports multiple power supply options, offering flexibility in different applications.

Maximum I (ol): 8 Amp

Capable of handling high output currents, making it suitable for demanding environments.

Propagation Delay (tpd): 16 ns

Provides fast signal transmission, ensuring efficient communication within the system.

Output Characteristics: 3-STATE

Allows the output to be in three states (high, low, and high-impedance), offering additional control flexibility.

Temperature Grade: MILITARY

Designed to withstand harsh environmental conditions, making it ideal for military applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing overall reliability.

Technical Specifications

Bus Driver & Transceivers NLVVHC1GT126DF1G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NLVVHC1GT126DF1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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