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NLVVHC1G126DFT2G

Onsemi

NLVVHC1G126DFT2G by Onsemi

NLVVHC1G126DFT2G by Onsemi is a 3-STATE bus driver with 5 terminals, operating at -55 to 125 °C. It has a load capacitance of 50 pF and max I (ol) of 8 Amp, suitable for military-grade applications requiring true output polarity control.

Median Price

$0.210

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 48,000 parts In-Stock

1+ parts

$0.210

100+ parts

$0.210

1k+ parts

$0.200

10k+ parts

-

48,000

$0.210

$0.210

$0.200

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DigiKey

USA . 748 parts In-Stock

1+ parts

$0.530

100+ parts

$0.314

1k+ parts

$0.187

10k+ parts

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748

$0.530

$0.314

$0.187

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Flip Electronics (Authorized)

USA . 66,000 parts In-Stock

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66,000

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EBV Elektronik

Germany . 60,000 parts In-Stock

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60,000

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Mouser Electronics

USA . 1,882 parts In-Stock

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$0.171

1,882

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Distributors (In-Stock)

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Vyrian

USA . 399 parts In-Stock

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$0.171

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399

$0.171

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Digiode

USA . 1,644 parts In-Stock

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$0.200

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1,644

$0.200

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Flip Electronics

USA . 87,000 parts In-Stock

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87,000

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Distributors (Availability)

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Vigor

Singapore . 181 parts In-Stock

1+ parts

$0.140

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-

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181

$0.140

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Ampacity Inc.

Singapore . 35,151 parts In-Stock

1+ parts

$0.145

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35,151

$0.145

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Corohmni

South Africa . 352 parts In-Stock

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$0.171

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352

$0.171

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Corphita

USA . 819 parts In-Stock

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$0.189

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819

$0.189

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Component Stockers USA

USA . 872 parts In-Stock

1+ parts

$0.520

100+ parts

$0.310

1k+ parts

$0.180

10k+ parts

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872

$0.520

$0.310

$0.180

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Microchip USA

USA . 4,842 parts In-Stock

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Kulean Microsystems

USA . 3,004 parts In-Stock

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3,004

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TANS Electronics

Latvia . 2,832 parts In-Stock

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SupplyDigital Components

Austria . 2,127 parts In-Stock

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Problanco Electronics

Mexico . 1,773 parts In-Stock

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1,773

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UHIMA Technologies

Türkiye . 512 parts In-Stock

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512

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Overview

Experience seamless and reliable communication with the NLVVHC1G126DFT2G by Onsemi. Crafted with precision and expertise, this bus driver & transceiver offers unparalleled performance and durability. Ideal for a variety of applications, this product guarantees efficient data transmission and superior signal integrity. Elevate your projects with the quality and excellence that Onsemi is known for. Trust in the value, benefits, and advantages that this product brings to ensure a successful outcome every time. Choose Onsemi for unmatched reliability and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver & transceivers, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during manufacturing.

Screening Level: AEC-Q100

Compliance with AEC-Q100 automotive quality standards ensures high performance and reliability in automotive applications.

Nominal Supply Voltage: 3V

Compatible with standard 3V power supplies, making integration into existing systems seamless.

Propogation Delay: 16 ns

Low propagation delay ensures quick response times for transmitting data signals between devices.

Maximum Operating Temperature: 125 °C

Withstands high temperatures, ideal for automotive and industrial applications where heat resistance is crucial.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Bus Driver & Transceivers NLVVHC1G126DFT2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

16 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NLVVHC1G126DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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